|Ask the Experts Index|
Jul 23, 2021
Very Low Temp PCBs
We have a requirement for PCBs to be used at temperatures as low as -200 degree C. Are ...
Jul 22, 2021
0201 Pick & Place Nozzle Plugging
We are assembling PCBA's containing 0201 passive components. We have a problem with solder paste getting in the ...
Jul 21, 2021
IPC-A-610 Class 3 - IPC-A-600 Class 2
If the PCB Assembly inspection requirement is IPC-A-610 Class 3, does it mean that the PCB inspection IPC-A-600 ...
Jul 20, 2021
BGA Solder Ball Collapse
Do lead free solder balls collapse the same amount as tin-lead solder balls? ...
Jul 19, 2021
Baking After Cleaning Hand Placed Parts
Is baking required after in-line cleaning an assembly with moisture sensitive parts that were hand placed instead of ...
Jul 16, 2021
What is the IPC Definition of Uncommonly Harsh?
IPC-A-610 and other documents define class 3 to include products where "the end use environment may be uncommonly ...
Jul 14, 2021
Solder Balling Splash After Reflow
A lot of balls are observed after reflow process along and under SMD components. (see images)We have not ...
Jul 13, 2021
BGA Component Grounding Problem
We have an ongoing concern regarding reliability BGA components. Over the last year, we had boards returned due ...
Jul 12, 2021
Mixed MSL Baking
If the highest MSL-rated component on a PCB had a 27-hour bake time at 125C (1.4-2.0mm, MSL 3) ...
Jul 9, 2021
Selective Soldering Frame Causing Cold Solder Joints
We have continual problems with our wave soldering system, especially cold solder joints. Could the cold solder joints ...
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