| Ask the Experts Index | |||||
|
|||||
|
|||||
|
Feb 26, 2021 How to Remove Oxidization from SMT Component Leads? How do you suggest we remove oxidization from SMT component leads? The component leads are seriously oxidized due ... J.J. Feb 25, 2021 Cause of Green/Blue Oxide Buildup My organization is responsible for performing depot level repair to circuit card assemblies. We are encountering some serious ... M.P. Feb 24, 2021 Rework of Underfilled Array Packages What is the best method for removing a SMT array package that has been underfilled and cured? Mechanically, ... E.C. Feb 23, 2021 Acceptable Conductor Repair An operator attempted to repair 3 damaged conductors using buss wire over-coated with epoxy. Do you consider this ... R.M. Feb 22, 2021 Class 3 Cleaning Requirements We recently received our first contract to assemble Class 3 circuit board assemblies. Are there any changes we ... L.L. Feb 19, 2021 Cleaning No-Clean Solder Paste We are building small lots of circuit board assemblies using no-clean solder paste. We prefer to remove the ... M. K. Feb 18, 2021 Concerns With Silver Finish Component Leads A few of the components we are using are have leads with silver finish. Will silver cause solder ... S.A. Feb 17, 2021 BGA Component Cleaning Spec Is there a standard or or specification covering requirements for BGA cleaning after rework? ... E.C. Feb 16, 2021 Tented Via Options and Tradeoffs Just read an inquiry concerning tented via-in-pad where the vias in a thermal pad under a chip are ... D.N. Feb 15, 2021 Insufficient Barrel Fill on Through-hole Components We are seeing insufficient barrel fill for one through-hole components during wave soldering. We suspect the problem could ... CM |
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |