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Jul 23, 2021 Very Low Temp PCBs We have a requirement for PCBs to be used at temperatures as low as -200 degree C. Are ... J.V. Jul 22, 2021 0201 Pick & Place Nozzle Plugging We are assembling PCBA's containing 0201 passive components. We have a problem with solder paste getting in the ... C.T. Jul 21, 2021 IPC-A-610 Class 3 - IPC-A-600 Class 2 If the PCB Assembly inspection requirement is IPC-A-610 Class 3, does it mean that the PCB inspection IPC-A-600 ... S.R. Jul 20, 2021 BGA Solder Ball Collapse Do lead free solder balls collapse the same amount as tin-lead solder balls? ... N.Z. Jul 19, 2021 Baking After Cleaning Hand Placed Parts Is baking required after in-line cleaning an assembly with moisture sensitive parts that were hand placed instead of ... R.M. Jul 16, 2021 What is the IPC Definition of Uncommonly Harsh? IPC-A-610 and other documents define class 3 to include products where "the end use environment may be uncommonly ... S.M. Jul 14, 2021 Solder Balling Splash After Reflow A lot of balls are observed after reflow process along and under SMD components. (see images)We have not ... B.G. Jul 13, 2021 BGA Component Grounding Problem We have an ongoing concern regarding reliability BGA components. Over the last year, we had boards returned due ... M.S. Jul 12, 2021 Mixed MSL Baking If the highest MSL-rated component on a PCB had a 27-hour bake time at 125C (1.4-2.0mm, MSL 3) ... B.B. Jul 9, 2021 Selective Soldering Frame Causing Cold Solder Joints We have continual problems with our wave soldering system, especially cold solder joints. Could the cold solder joints ... T.H. |
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