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Ask the Experts Index |
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May 8, 2025 Stencil Cleaning Procedure Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil ... P.M. May 7, 2025 Bottom Terminated Components and Vias Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ... N.P. May 6, 2025 Hand Soldering at Low Temperature We often need to make repairs in the field involving circuit board soldering. Is there any impact on ... P.S. May 5, 2025 Low Operating Temperature Lead-Free Solder We will be soldering copper wires inside a motor that operates in a cold environment at -200 °C ... L/M. May 2, 2025 Mixed Process Solder Joint Appearance, Smooth or Grainy? We are using RoHS components that are placed using tin/lead solder paste and soldered in oven using a ... P.W. May 1, 2025 ESD Grounding - 1 Meg Ohm Resistor Why do we need to use a 1 meg-ohm resistor for ESD grounding? ... R.R. Apr 30, 2025 Stencil Pattern for LGA Power Pad We are experiencing difficulties reliably soldering the large ground pad on land grid array (LGA) packages using a ... J.M. Apr 29, 2025 BGA Die and Pry Testing See the image of a die and pry flip chip BGA. Are these results Kirkendall Voiding or some ... J.J. Apr 28, 2025 Stencil Cleaning Frequency What is the industry standard for the amount of time between stencil cleaning? ... C.C. Apr 25, 2025 Rechecking Thermal Profiles Is it necessary to replicate the thermal profiling process during long term mass production? Is it necessary to ... H.A. |
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