|Ask the Experts Index|
Feb 26, 2021
How to Remove Oxidization from SMT Component Leads?
How do you suggest we remove oxidization from SMT component leads? The component leads are seriously oxidized due ...
Feb 25, 2021
Cause of Green/Blue Oxide Buildup
My organization is responsible for performing depot level repair to circuit card assemblies. We are encountering some serious ...
Feb 24, 2021
Rework of Underfilled Array Packages
What is the best method for removing a SMT array package that has been underfilled and cured? Mechanically, ...
Feb 23, 2021
Acceptable Conductor Repair
An operator attempted to repair 3 damaged conductors using buss wire over-coated with epoxy. Do you consider this ...
Feb 22, 2021
Class 3 Cleaning Requirements
We recently received our first contract to assemble Class 3 circuit board assemblies. Are there any changes we ...
Feb 19, 2021
Cleaning No-Clean Solder Paste
We are building small lots of circuit board assemblies using no-clean solder paste. We prefer to remove the ...
Feb 18, 2021
Concerns With Silver Finish Component Leads
A few of the components we are using are have leads with silver finish. Will silver cause solder ...
Feb 17, 2021
BGA Component Cleaning Spec
Is there a standard or or specification covering requirements for BGA cleaning after rework? ...
Feb 16, 2021
Tented Via Options and Tradeoffs
Just read an inquiry concerning tented via-in-pad where the vias in a thermal pad under a chip are ...
Feb 15, 2021
Insufficient Barrel Fill on Through-hole Components
We are seeing insufficient barrel fill for one through-hole components during wave soldering. We suspect the problem could ...
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