|
|
|
|
|
|
Ask the Experts Index |
|||||||||
|
|||||||||
|
|||||||||
Jun 28, 2024 Twisting Multi-strand Wires Should multi-strand wires be twisted before they are tinned with solder? What are the benefits of twisting prior ... A.S. Jun 27, 2024 Question About J-STD-001 We have a requirement to conformal coat a PCB assembly that is processed using a no clean flux. ... R.S. Jun 26, 2024 BGA re-balling process Can you recommend a process or semi-automatic machine for re-balling BGA's? Is there a process or system available ... J.S. Jun 25, 2024 Solder Caking to Bottom of PCBs After Wave We recently drained and refilled our wave solder pot with SN100 due to contamination. Flux coverage looks good. ... D.H. Jun 24, 2024 Idle Wave Solder Temperature When our wave solder system is not in use, including after the workday and over the weekend, should ... P.H. Jun 21, 2024 Step Stencil Squeegee Angle If you have step stencil, what angle should we use for the squeegee when printing solder paste, and ... P.P. Jun 20, 2024 Recommended Fiducial Shape Is there a recommended fiducial shape for HASL finish boards that will minimize solder pooling on the fiducial ... J.M. Jun 19, 2024 Rework for OSP Assemblies Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP (Organic Solderability Preservative) ... J.N Jun 18, 2024 Competing Reflow Oven Zones We have an 8 zone reflow oven in our SMT production line. We recently purchased an oven profiler ... T.G. Jun 17, 2024 IPC-A-610 Solder Joint Acceptability Question Per IPC-A-610, figure 5-1, solder connection angle shall not exceed 90 degrees unless there is solder mask on ... S.P. |
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|
|
|