|
|
|
|
|
|
|
|
|
|
|
|
| Ask the Experts Index | |||||||||
|
|||||||||
|
|
|||||||||
|
Sep 29, 2022 MSD Components Baked Too Long If MSD components are baked for more time than specified in J Std, can this cause potential failures ... V.S. Conformal Coating Press Fit Connectors We are having problems withpress-fit connectors. We produce military circuit board assemblies andcurrently use a fast drying, single ... S.C. Options for Reballing BGA Components Which of the following do you recommend when reballing BGA components? Reballing with solder paste and solder spheres, ... J.J. Contamination Using Solvent Dispensers After solder touch-up we use small bench-top solvent dispensers with acid brushes for local spot cleaning. Are we ... R.M. How To Reduce Solder Joint Voids in QFN Components What techniques and methods can we use regarding our solder paste stencil design to reduce or eliminate solder ... H.C. Rechecking Thermal Profiles Is it necessary to replicate the thermal profiling process during long term mass production? Is it necessary to ... H.A. No-Clean Flux Residue After Selective Soldering After selective soldering connectors there is a small amount of no-clean flux residue left behind. This minimal amount ... S.T. Channels To Reduce Voids in Large Pads At our facility we have devices with large pads (D2PAK for example) that have had voids visible through ... A.U. Aluminum Trays and Rapid Static Discharge Occasionally we transport assembled circuit boards directly on aluminum trays. Some in our plant are concerned that the ... W.M. Seeking Advise for a Solder Reflow Recipe I have a new product coming in and need some ideas on reflow recipe creation. The pcb has ... W.K. |
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|
|
|
|
|
|
|