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| Ask the Experts |
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April 14, 2025 - Updated
April 21, 2025 - Originally Posted
Stencil Patter for LGA Power Pad
We are experiencing difficulties reliably soldering the large ground pad on land grid array (LGA) packages using a single large window in the stencil. Should we use multiple smaller windows when dispensing solder paste for the center ground pad? The MFG data sheets do not provide options for using a multi-window paste stencil. Can you give a reasonable rule to follow, regardless of the size of the LGA ground pad, when using multiple smaller windows in the stencil?
J.M.
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| Expert Panel Responses |
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No responses provided.
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Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions
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