Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
Ask Experts Submit a Question |
Submit your question to our Expert's panel using the form below. This is not the typical forum where anyone can post an answer to the questions submitted.
Your question will be forwarded to a distinguished panel of industry experts. Those experts that have a comment or suggestion to pass along will forward them to us for posting.
Look for new questions and answers posted each week.
Please keep your questions short, although it's important that you include all the information our panel may need to provide an answer.
Complete this form to submit a question.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
Sponsor |
|
Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology
|
|
|