Circuitnet Ask the Experts

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Ask the Experts Index

■	Test Probe Problems After Pin-In-Paste
■	Seeking IPC and J-STD Definitions
■	Use of Nitrogen for Hand Soldering
■	Suggested Limit for PCBA Heat Cycles
■	QFN Test Failures Caused by Flux
■	Competing Reflow Oven Zones
■	Confused About IPC-A-610 Class 2 vs. Class 3
■	Burned Chip Repair
■	Idle Wave Solder Temperature
■	IPC 610 Class 3 with Missing Non-functional BGA Pads
■	BGA Component Cleaning Spec
■	Aluminum Trays and Rapid Static Discharge
■	Seeking Advise for a Solder Reflow Recipe
■	Cleanliness Standards for Electronic Components
■	Fastening Surface Mounted Connectors Before or After Refow?
■	Concerns With Silver Finish Component Leads
■	Hot Air Soldering for 0201s and 01005s
■	What is the IPC Definition of Uncommonly Harsh?
■	QFN Open Solder Joints
■	BGA Component Grounding Problem
■	Solder Mask Ghosting
■	Is Component Lead Damage Reparable?
■	Challenges with 01005 Components
■	Components Jumping Around During Reflow
■	Moisture Barrier Bag Calculation
■	Acceptable Conductor Repair
■	Question About Dry Storage of PCBA's
■	MELF Component Misalignment
■	Delamination After V-cut
■	Allowable Bow and Twist on Round PC Fab
■	Is There a Spec for LDI Mask thickness?
■	Production Floor Temperature and Humidity Loggers
■	How To Reduce Solder Joint Voids in QFN Components
■	Reduce Glare During Assembly
■	How To Rework SMT Connector with Center Ground Strip
■	Two Year Component Date Code Mandate
■	IPC SOIC Defect Question
■	OA Flux Turning Blue
■	Conformal Coating Over No-Clean Flux
■	Copper Dissolution Rate
■	Matte Black Solder Mask Defects
■	BGA Solder Ball Collapse
■	ESD Ground Wire Gauge
■	Conformal Coating Press Fit Connectors
■	Recommended Fiducial Shape
■	PCBA Inspection Process Causing Damage
■	Can a Few Contaminated Joints Cause an Assembly to Fail RoHS Compliance?
■	Ultrasonic Cleaning and Surfactants
■	Low Operating Temperature Lead-Free Solder
■	BGA Reballing Question

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