|Ask the Experts|
February 17, 2021
BGA Component Cleaning Spec
Is there a standard or or specification covering requirements for BGA cleaning after rework?
|Expert Panel Responses|
IPC/EIA J-Std-001 "Requirements for Soldered Electrical and Electronic Assemblies" section 8, "Cleanliness Requirements" address these post soldering cleaning which I think it safe to assume applies to all post solder cleaning whether post-reflow/wave soldering or post-rework soldering and also regardless of the component type.
Senior Project Engineer
Electronic Controls Design Inc
The dedicate standard to BGA processes is the IPC 7095. Its important understand the full process and take in considerations all the variables and try to reproduce at moment of repair and rework to get the best result and
meet the standard criteria IPC-610.
The IPC-7095 standard internally call to IPC 7711 & 7721 to techniques repair and rework and IPC-610 to acceptance. The cleanliness criteria are a little bit ambiguous, because is focused only on visual inspection.
My recommendation is meet all the IPC standard statements and recommendations for process, rework, repair and visual acceptance. In my experience one of the most important think, is the materials selection (flux, solder, solvents, wipes , tooling etc.) this need to be fiber and dust free, halide free, low halide or zero halide to minimize the reliability issues.
Engineering Director / Master IPC Trainer (MIT)
I would say that the cleanliness requirements after rework would be the same as those imposed by the user as part of the initial requirements. IPC J-STD-001 Section 8.3.2 would cover the specific requirements unless the user has specified something different.
PCBA Engineering Liaison
General Atomics Electromagnetic Systems Group
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