Ask the Experts Member

INDEX
ASK
PANEL
JOIN
image

Guy Shemesh


General Manager
ePiccolo Engineering

Mr. Shemesh has Bsc. in E.E engineering and hands-on experience with electronics (schematics & layout) since 2004. He has designed dozens of multi-layer PCBs, HDI, RF, rigid-flex, etc., and had the honor for design reviewing veteran layout engineers several times as a consultant.

Guy Shemesh has submitted responses to the following questions.
3D AOI Solder Joint Qualification Parameters
The answer could be divided in two. First and foremost, I recommend looking at IPC-A-610 to verify that your suspected ...
Design Considerations and Impact on Assembly
Generally speaking, you should always strive to produce a board that is as simple as possible to manufacture and assemble. ...
Solder Joint Blow Holes
I don't think the root cause is with air tight sealing on the top although this can aggravate the problem ...
Removal of Non-functional Pads from Inner Layers
As a 15+ circuit designer, I can add that there are major advantages to having the non-functional pads removed. First ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address