Rick Kompelien

Rick Kompelien has submitted responses to the following questions.

Challenges Placing RF Shields During SMT Assembly
You might try applying SMT adhesive dots to the PCB at the corners of the shields prior to component placement. ...

Oxidation of Solder Balls During Secondary Reflow
You didn't provide much information along with your question, so I'll have to assume you are referring to the solder ...

Acceptability Standard for Plated Hole Barrel Fill
Your question raises many more questions: What acceptability standard (and class) are you required to use? IPC-A-610 and J-STD-001 are ...

What Is Causing Slanted Pins After Reflow
This is a PCB design issue - increasing the pad size will allow for proper formation of solder fillets. If ...

Challenge Wetting Solder to Brass Pins
In order to give a good answer, it would be necessary to know more about your product (IPC Class 1, ...

Mixed MSL Baking
The safe bet would be to bake the assembly long enough to satisfy the most stringent requirement. If the component ...

Assembly Question for Soldering USB Connectors
You could screen paste and reflow the first side to form solder bumps on the pads. Apply liquid flux to ...

Water Wash vs. No-clean
No-clean flux processing is more efficient - less handling, less equipment, and shorter cycle time. You would want to choose ...

EMI Shield Reflow Soldering Techniques
In most cases, the RF Shields can be machine-placed very accurately and the surface tension of the solder should hold ...

Question About Dry Storage of PCBA's
If your hand solder and potting operations are performed soon after your SMT processes, you should not need special dry ...

BGA Component Grounding Problem
If the cause of your high resistance failures is not apparent using microscopy or X-Ray, you will probably need to ...

Components Falling Off During Reflow
Theoretically yes, but there are a lot of factors that would determine the point at which that would happen. The ...

Competing Reflow Oven Zones
You will want to start by getting the recommended thermal profile for the solder paste you have selected. You should ...

Exposed Copper Defect
That would depend on where the copper is exposed. Some component types normally have exposed copper where the packages are ...

Depaneling circuit board that contain BGA components
All components and their interconnects should be protected from the stress that can be created by depaneling processes that flex ...

BGA reballing question
In my opinion, the additional thermal cycle would have much more negative impact to the BGA than would the residual ...