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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
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Wave Soldering Processes Rethought
As a pioneer in the development of automated soldering technologies, SEHO is setting global standards today more than ever with outstanding features. Find out more.
SEHO Systems GmbH
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Ask the Experts Member |
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Eddie Groves
Director of the Selective Soldering Academy (SSA)
Selective Soldering Academy
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Eddie Groves has over 32 years' experience in the electronics manufacturing industry, specifically in the soldering of circuit boards. His first 11 years was with Lucent Technologies (AT&T), then with Kester, Qualitek and then Pillarhouse. He has over two decades of Selective Soldering experience as a user and a provider of Selective Soldering equipment. His particular focus is Process Development, Process Troubleshooting, flux, and component & PCB solderability.
Eddie Groves has submitted responses to the following questions.
Solder Joint Blow Holes
The epoxy bump on the bottom of the LED shouldn't cause a new blow hole problem just by changing from ...
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AI Void Detection – X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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