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Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD

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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Ask the Experts Member

Aaron Caplan

Director of Marketing & Training
PACE Worldwide

Mr. Caplan has been involved in electronics manufacturing technology since the 80's, is an acknowledged expert in Miniature/Microminiature Electronics Repair, and provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques.

Aaron Caplan has submitted responses to the following questions.

Point to Pint Soldering vs Drag Soldering
Drag soldering, sometimes called the Miniwave technique or multi-lead soldering, is a popular method used to install QFP's and other ...

How To Reduce Solder Joint Voids in QFN Components
During QFN rework, stencil design is critical to reducing solder joint voiding. We have had great success with a stencil ...

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Are you sitting comfortably?
Boost comfort and productivity! Discover how proper ergonomics can reduce strain, improve accuracy, and enhance performance for microscope users. Download now!
Vision Engineering