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Steve Arneson


National Business Manager
ASC International

Mr. Arneson has been working in the electronics industry since 1992. His primary focus revolves around educating manufacturers as to the true value-add SPI and AOI have to offer within the manufacturing process. Armed with just enough industry knowledge to make him dangerous, Mr. Arneson can provide useful, real-world application study related advise to assist with all your SPI and AOI questions.

Steve Arneson has submitted responses to the following questions.
Solder Paste Print in Volcano Shape
There are a few possible issues you may be dealing with when you are seeing this type of profile. 1.) ...
Solder Paste Thickness Measurements
The most accurate way to answer this question is to first look at the overall complexity of the board to ...
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Touch Free BGA Solder Ball Removal
Watch a video that shows touch-free BGA component deballing. This precision process is highly reliable when preparing BGA components prior to reballing.
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High-Density Rigid PCB Boards