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Introducing New Board-to-Board Connectors

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Ask the Experts Member

Jack Fisher

Chairman of the IPC Technology Roadmap Committee

Interconnect. Technology Analysis Inc.

Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.

Jack Fisher has submitted responses to the following questions.

Copper Dissolution Rate
The High Density Packaging Users Group(HDPug) has just completed a copper dissolution study. The final report is still being written ...

Insufficient Barrel Fill on Through-hole Components
It is very hard to answer this question. Board thickness, pin size, thermal relief and more play a role. One ...

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