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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology

EZ-FLO encapsulation and underfill dispensing needles are designed for precise, repeatable application of encapsulation and underfill material. A Smoother internal profile enhances material flow and consistency.

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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Ask the Experts Member

Joe Karcewski

Product Manager
APS-Novastar, LLC

Joe Karcewski has been a Process Engineer for 16 years in the industry. He is a certified IPC-A-610 trainer and is presently working at APS-Novastar as a Product Manager for Soldering Systems including Selective Soldering systems.

Joe Karcewski has submitted responses to the following questions.

Pin-in-Paste Hole Fill
To ensure proper plated hole fill during the screen printing process you must have the proper volume of solder paste. ...

Is PCB Baking Necessary?
This is a correct statement. PCB Baking is not necessary if the PCB is Vacuum Packed by the PCB Supplier ...

Recommended Rework Dwell Times
When hand soldering utilizing Sn/Pb solder, the maximum dwell time at any thru-hole lead should be 20 seconds. A much ...

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McDry Ultra-Low Humidity Storage Cabinets
McDry dry cabinet for MSL components and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages.
Seika