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A Lifespan of Reliability
Nordson Electronics Solutions makes reliable electronics an everyday reality. Selective soldering, dispensing, coating, and plasma solutions.
Nordson Electronics Solutions
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Ask the Experts Member |
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John S. Wasyliw
VP of Engineering
APS Novastar LLC
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John Wasyliw is VP of Engineering with over 20 years of experience in complex mechanical and motion design including control and software development. He is currently responsible for all product engineering, new product development and commercialization for APS Novastar LLC.
John S. Wasyliw has submitted responses to the following questions.
Board Spacing During Reflow
Your first objective should be to obtain consistent thermal repeatability or uniform heating across your boards. The ovens today are ...
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Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
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