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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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High-Density Rigid PCB Boards
Summit's rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options.
Summit Interconnect
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Ask the Experts Member |
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Stanley J Soderstrom
Product Engineer
Ultrasonic Systems
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Mr. Soderstrom is a veteran of the U.S. Navy where he studied aviation electronics. Stanley has been working in the electronics manufacturing industry for more than 20 years and is considered a top expert in the field of spray fluxing process control.
NOTE: Mr. Soderstron is no longer working at Ultrasonic Systems.
Stanley J Soderstrom has submitted responses to the following questions.
Spray fluxer in wave solder
I believe most engineers and chemists would agree that IPA (isopropyl alcohol) is considered the best cleaning agent for spray ...
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
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