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Need a Profiler Plan B?
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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
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Ask the Experts Member |
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Yun Zhang
R&D Director
Cookson Electronics, Enthone
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Ms. Zhang has a PhD in chemistry/electrochemistry. Experiences include AT&T/Lucent Bell Labs, Technic, Cookson Electronics/Enthone. Areas of expertise include: electroplating; Sn whiskers, wafer bumping, Cu post/pillar, Cu redistribution lines and Sn and SnAg bumps.
Yun Zhang has submitted responses to the following questions.
Tin Whiskers
Vacuum would help but will not prevent it.
The only way to prevent whisker growth under any condition is to ...
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Are you sitting comfortably?
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Vision Engineering
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