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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
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Ask the Experts Member |
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Prashant Joshi
Director of Engineering
Interconnect Systems Inc.
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Prashant has 15 years experience in design and process development. With a MS in Mechanical/ Materials Engineering his areas of interest are connectors, electronics assembly, SMT, reballing, wire bond.
Prashant Joshi has submitted responses to the following questions.
Pre-Bake Standard for Rework
I would recommend IPC/JEDEC J-STD-033B which is a specification for handling, packing, shipping and use of moisture/reflow sensitive surface mount ...
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Are you sitting comfortably?
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Vision Engineering
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