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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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High-Density Rigid PCB Boards
Summit's rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options.
Summit Interconnect
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Ask the Experts Member |
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Prashant Joshi
Director of Engineering
Interconnect Systems Inc.
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Prashant has 15 years experience in design and process development. With a MS in Mechanical/ Materials Engineering his areas of interest are connectors, electronics assembly, SMT, reballing, wire bond.
Prashant Joshi has submitted responses to the following questions.
Pre-Bake Standard for Rework
I would recommend IPC/JEDEC J-STD-033B which is a specification for handling, packing, shipping and use of moisture/reflow sensitive surface mount ...
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
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