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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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High-Density Rigid PCB Boards
Summit's rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options.
Summit Interconnect
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Ask the Experts Member |
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Stuart Erickson
President
Ultrasonic Systems, Inc.
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Mr. Erickson is co-founder of Ultrasonic Systems, Inc. a technology leader in ultrasonic spray technology. Hi is holder of several patents related to ultrasonic spray technology. His roles include product development, technology application, sales and marketing.
Stuart Erickson has submitted responses to the following questions.
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
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