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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
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EZ-FLO encapsulation and underfill dispensing needles are designed for precise, repeatable application of encapsulation and underfill material. A Smoother internal profile enhances material flow and consistency.

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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Ask the Experts Member

Jeff Fouche

Design Engineer
ACE Production Technologies

Jeff Fouche has 2 years of experience as a Manufacturing Engineer for CM/OEM and 2 years as a Design/Process Engineer with ACE Production Technologies. Jeff is also an IPC certified trainer. He received his BSME in 2003 from the University of Idaho.
NOTE: Mr. Fouche is no longer working at ACE production Technologies.

Jeff Fouche has submitted responses to the following questions.

Hand Soldering vs. Selective Wave for small LCD
Based simply on the peak temperature a PCB experiences during selective soldering, I can confidently say that you will not ...

Increase bed life with in-line cleaner
There are a few things that you can do for free with your existing system to improve the life of ...

Wetting Problem SAC finished component
Although I cannot speak much to the SMT side of you question, I do have some comments regarding the tinning ...

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McDry Ultra-Low Humidity Storage Cabinets
McDry dry cabinet for MSL components and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages.
Seika