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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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High-Density Rigid PCB Boards
Summit's rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options.
Summit Interconnect
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Ask the Experts Member |
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Claudio Orefice
President
High-Tech Conversions Inc.
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Claudio Orefice is president of High-Tech Conversions. They manufacture a variety of wiping products and can supply virtually any type of consumable item used in cleanrooms, assembly lines, laboratories and manufacturing
Claudio Orefice has submitted responses to the following questions.
Hand Soldering Alternative
In order to improve output on a hand soldering project, experts recommend doing two things...
You need to make sure ...
Stencil Cleaning Alternatives
Ultrasonic stencil cleaners are still the industry standard for cleaning paste from apertures in stencils, but what is changing is ...
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
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