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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology

EZ-FLO encapsulation and underfill dispensing needles are designed for precise, repeatable application of encapsulation and underfill material. A Smoother internal profile enhances material flow and consistency.

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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Ask the Experts Member

Gary Bowman

Sales Manager
Krayden, Inc.

Gary Bowman has been in distribution sales for 33 years selling into Electronic, Aerospace, Medical and OEM market place. Bowman has been with Krayden for 18 years.

Gary Bowman has submitted responses to the following questions.

Conformal coating and connector holes
Boards that are conformal coated have the areas that they don't want conformal coating on masked or taped off. There ...

Conformal Coating Process question
Wicking will be the result of the surface tension and material viscosity. To prevent the capillarity action you need to ...

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McDry Ultra-Low Humidity Storage Cabinets
McDry dry cabinet for MSL components and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages.
Seika