|Ask the Experts|
June 24, 2021
Recommended Solder Paste Aperture Configuration
What aperture shape/configuration do you recommend with our solder paste stencils for 008004 and 01005 pad sizes?
|Expert Panel Responses|
Successful ultra-fine pitch printing as required for 008004 and 01005 components pushes the boundaries of current paste, stencil and equipment technologies. Multiple input variables need to be optimized to achieve the desired result. Chief amongst these are solder paste, stencil materials and aperture designs.
Extensive print testing indicates that a 'squircle' aperture (a square with a radius corner) consistently outperforms either a round or square aperture.
Director of Product Management
008004 .004 x .005 oblong with .003 space
01005 .005 x .006 oblong with .004 space
Vice President Technology
Unfortunately there is not an industry standard for these smaller components at this time. Several big name users have developed and optimized their own pad stack that works best for them.
For the stencil, I would recommend something in the .003" (75 micron) range for a thickness and nanocoating is a must.
The aperture can then be 1 to 1 with the pad.
Technical Support Engineer
I will follow the manufacturer's recommended pad shape. However, when dealing with such small components, your solder type and stencil release will be the key players in your process.
Senior Manufacturing Engineer
A 15% reduction on the pad size and 2 mil stencil worked for the applications that I have done. The used shape for the aperture is the classic square.
Engineering and Operations Management
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