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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
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Ask the Experts Member

Patinya Srianan

Customer Technical Support Engineer
Alpha Assembly Solution

Mr. Srianan is a Customer Technical Support Engineer for Alpha Assembly Solution. He has 15-years of experience in SMT and soldering fields. He takes care of all technical inquiries and problems for customers in Southeast Asia and Australia.

Patinya Srianan has submitted responses to the following questions.

Solder Paste Print Test Boards
Using the real boards to perform test print to simulate the setup and parameters. The problem can be detected before ...

Full Aqueous Clean or Local Spot Clean
Water-soluble solder paste is mostly classified in ORH0 or ORH1 which are highly corrosive. Manual cleaning is a risk to ...

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