Stephanie Nash

Stephanie Nash has submitted responses to the following questions.

Stencil Pattern for Thermal Pads on QFNs
It is recommended to reduce the perimeter of the ground pad slightly before making additional modifications. Once the perimeter is ...

Manual or Automated Assembly?
We offer a desktop printing stencil kit to lessen the amount of time spent and defects associated with hand soldering. ...

How Many Fiducials Per Solder Paste Stencil?
For larger panels such as this, it is generally acceptable to utilize the board level fiducials on the four corner ...

Circuit Board Bow and Twist
Instability of the inner layers or improper layering of the board during manufacturing may be contributors to this issue. IIT ...

Excess Flux Residue After Hand Soldering
To determine if the electrical performance will be compromised, a surface insulation resistance test (available in the IPC Test Methods) ...

Lifted Lead on SOT Component
Excess solder deposition could be one potential cause for this issue. If there is excess solder on two of the ...

Reflow Causing Warp
IIT offers titanium board stiffeners that will assist with stabilizing the board during reflow. They easily slide on to the ...

Contract Assembly in a Prison
There are desktop stencil kits available that make deposition of solder on the board consistent and much faster than hand ...

BGA Pad Lifting
When you say pad, are you talking about the pad on the board? If so, the board would need to ...

Stencil Tension
Under normal use, and assuming the metal, mesh, or glue has not sustained damage the stencil should not lose noticeable ...

Solder Mask Stencil Tension
Stainless steel foil has a much higher modulus of elasticity than polyester screen fabrics. Conventional mesh tension meters are designed ...

Stencil Issue with PLCC Component
This issue can easily be addressed by contacting your stencil supplier. Custom adjustments can be made to the stencil data ...

Components Lifting During Wave Soldering
Components lifting during reflow could be the result of excess solder. Have your stencil manufacturer evaluate the component lead to ...

Most Important Factors for Screen Printing
The short answer to this question is: All four of these factors impact the success/failure of the screen printing process. ...

Leadless Component Hand Soldering Help
Leadless devices can bridge without proper stencil design. There is a design formula used to determine proper deposition to wet ...

BGA Shifting During Reflow
Without seeing the board, the types of components being loaded, board finish, and the paste type being used, the following ...