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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
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| Ask the Experts |
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August 9, 2011 - Updated
August 9, 2011 - Originally Posted
Minimum Solder Sphere Count Per Pad
For either type-3 or type-4 solder paste, should there be a minimum number of solder sphere deposited on each surface mount pad?
S. S.
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| Expert Panel Responses |
Design guide for stencil aperture size (IPC 7525) is least 5 solder balls across the aperture opening.
Bill Coleman
Vice President Technology, Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
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