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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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June 15, 2011 - Updated
June 12, 2011 - Originally Posted
OSP Interval Times for Reflow
When using OSP coated boards, what is the maximum acceptable (and recommended) time interval between reflow of the "first" and "second" sides to ensure proper wetting?
M. G.
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| Expert Panel Responses |
Normally as quick as possible. Without knowing your reflow profile it would be nearly impossible to give an accurate estimate. Try with a group of scrap boards for 24, 48, 36 hours etc. until you reach a point you are happy with. But 48 hours should be the maximum you aim for due to potential variation on PWB
Richard Boyle
Global Product Champion, Henkel Electronics
Richard Boyle is a Global Product Champion at Henkel Electronics. He has over 25 years experience in the electronics assembly industry and is responsible for the global technical service of all of Henkel's solder materials.
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