|
Sponsor
|
|
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
|
|
| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
August 17, 2009 - Updated
August 17, 2009 - Originally Posted
Fine pitch through hole soldering
What is the finest pitch for plated through hole components that can be succesfully wave soldered without bridging? If you don't have a specific dimension, can you let me know the finest pitch through hole component you have soldered succcessfully?
A. N.
|
| Expert Panel Responses |
With a Selective Soldering machine you have more control of your parameters and axis which makes it easier to have success soldering fine pitch components. 1.27mm fine pitch soldering occurs on a daily basis, but soldering well below 1mm pitch can also be achieved with a very high FPY.
Todd O'Neil
National Sales and Marketing Manager, North America, Business Development Manager, DAGE | X-Ray component counting
Mr. O'Neil has been in the electronics manufacturing industry for over 20 years.
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
