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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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April 29, 2009 - Updated
April 27, 2009 - Originally Posted
Leaded components in a no lead process
We will be assembling circuit boards using an RoHS complient assembly line, however our customer does not have an RoHS lead free requirement. Are there any concerns if we use a few leaded components in this process? Are we likely to contaminate our wave solder bath?
J. B.
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| Expert Panel Responses |
It isn't going to be an issue of lead contamination so much as it might be an issue with reliability. We have seen issues with cracking when the lead gets above .4% in the solder joint. Our suggestion would be to wait to go to lead free until you have all leaded components switched.
Mike Scimeca
President, FCT Assembly
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.
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