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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
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October 20, 2008 - Updated
October 20, 2008 - Originally Posted
Types of Pad Contamination
How many types of pad contamination have been identified to date? For example, I know that there can be phosphorous and chlorine contamination. Can this type of contamination occur while the board is being populated due to fluxes or poor thermal profiles? It seems that the popular opinion is that it primarily takes place during the plating process.
E. F.
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| Expert Panel Responses |
We have found pads with high levels of sulfate, sodium, ammine, rosin, and nitrate besides the chloride and phosphate contamination.
Terry Munson
President/Senior Technical Consultant, Foresite
Mr. Munson, President and Founder of Foresite, has extensive electronics industry experience applying Ion Chromatography analytical techniques to a wide spectrum of manufacturing applications.
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