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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
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April 14, 2008 - Updated
April 14, 2008 - Originally Posted
Determining Current Carrying Capacity
How do you determine the current carrying capacity of PCB traces and vias? What tools and formulas are used to make the calculation?
M. N.
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| Expert Panel Responses |
Check out IPC-2152.
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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