circuitnet
Sponsor
Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
UNDI Fabrication for IC Substrates
Sponsor
KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
August 27, 2007 - Updated
August 27, 2007 - Originally Posted

Best Paste for Gold Finished Surfaces

We use water soluble leaded past and have discovered that the solder joint finish is markedly duller when used on ENiAg finished surface PCBs as compared to HASL. Do you know what causes this and is there a better paste to use for gold finished surfaces?
Steve Hughes
Expert Panel Responses
More than likely, this is related to the dissolution of Gold into the solder joint. Gold is easily dissolved by molten Tin-based solders during the reflow process and the added Gold in the solder joint can result in a grainy appearance on the surface of the solder. One thing that can be investigated here is the thickness of the Gold layer on the ENIG board. This thickness should optimally be in the range of 5-15 microinches. Anything too thin and you may have a solderability issue due to the porous Gold surface. Anything too thick and you will end up with too much in Gold in the solder joint and may face grainy solder joints and also potentially a condition called gold embrittlement. This issue cannot be affected by trying another solder paste formulation unless the mechanism for the dull finish has more to do with solder paste activity than with the Gold dissolution.

Brian Smith
Brian Smith
General Manager - Electronic Assembly Americas, DEK International
Mr. Smith has been supporting customers in the electronics assembly industry since 1994. His expertise is focused on solder paste printing and reducing soldering defects. He holds a BS in Chemical Engineering and an MBA in Marketing. He has authored several papers in trade magazines and at industry conferences. He is an SMTA Certified Process Engineer.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling