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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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July 16, 2007 - Updated
July 24, 2007 - Originally Posted
Acceptable "reject rate" for hand assembly
What is an What is an acceptable "reject rate" for a total hand assembly, through hole operation line. I have established a less than .10% of all total hand placed through hole components for our load room. We are a small low volume, high mix firm, using through hole boards, wave soldered. Is this a reasonable level to expect from our process?
Robert Bartolotta
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| Expert Panel Responses |
Typical first pass yield on hand assembly is 5000 ppm.
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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