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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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May 15, 2006 - Updated
July 5, 2007 - Originally Posted
What alloy do you recommended for filters used with SAC305?
We are an electronic manufacturer of RF and Microwave Filters. Before RoHS we soldered our products using Sn95/Sb5 with a melting point 232-240�C. Our customer typically used Sn63 to solder our products on their printed circuit assemblies. Now with RoHS our customers may use SAC305 with a melting point 217-220�C, very close to Sn95/Sb5 thus we need to use higher solder alloy in our product. What alloy can you recommended for our products?
S.D.
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| Expert Panel Responses |
High lead (>85%) solders are still exempt under the RoHS legislation. This has been the choice of most companies building primary interconnections and consider about reflow during assembly operations.
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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