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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
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October 9, 2006 - Updated
July 4, 2007 - Originally Posted
Repair damaged pads on Teflon Substrates
Is there a repair method out there for repairing lifted/damaged pads on Teflon substrates?
Michelle Elston
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| Expert Panel Responses |
Teflon is a bit more difficult to bond a replacement pads to, but certainly can be done. We have a procedure online you may wish to take a look at. See our online procedure 4.7.2 Surface Mount Pad Repair, Film Adhesive Method.
Jeff Ferry
President, Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
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