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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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May 7, 2007 - Updated
July 4, 2007 - Originally Posted
Soldering wire on through-hole pad
Is there an IPC standard or other suggestion for soldering 18 gage wire "ON TOP" of a through-hole pad?
K.Z
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| Expert Panel Responses |
Not sure if I wouild call it a standard, I think it may be more of a guideline. See some info at: http://www.circuitrework.com/guides/6-1.shtml
Jeff Ferry
President, Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
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