AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS
Technical Paper
Unlocking the Potential of Nanoscale Conformal Coatings
Revolutionary Plasma Coating as Conformal Coating - discover it now! PlasmaPlus® enables ultra-thin, solvent-free functional coatings under atmospheric pressure - without post-treatment. Ideal for corrosion protection, insulation and adhesion improvement.
Plasmatreat GmbH
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology