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Free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies to IPC standards.
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Technical Paper

Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment

The use of numerical methods in order to support the development of systems and processes has now become widespread. The implementation of these methods helps to minimize development costs by reducing the number of required prototypes thanks to a pre-selection process.
Rehm Thermal Systems GmbH

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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
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