Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more. ECD
Thermally Conductive Molding Significantly Improves Performance and Reliability
Many component failures are heat related. Designs with thermal molding materials conduct heat away from temperature sensitive devices for better performance and reliability.
X2F
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
Sponsor
AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC Ormet® TLPS