Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more. ECD
Investigation & Results on the Phenomenon of "Flying" SMD Components
This paper deals with the fundamentals of heat transfer and the test procedures show how the SOD323 can be processed given a suitable selection of solder paste and oven settings.
Rehm Thermal Systems
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC Ormet® TLPS