Technical Paper

Impact of high peak reflow temperature on flux removal of high Pb solder paste



Voiding in high lead (Pb) solder joint is an on-going problem especially for power electronics. This paper evaluated cleaning effectiveness of discrete packages soldered with various high lead solder pastes.
ZESTRON
Download This Technical Paper

Your Name


Your Company
Your E-mail


Your State, or Country if outside USA

More Technical Papers
>3.0 µins Gold Now Achievable, Without Nickel Corrosion
Impact of high peak reflow temperature on flux removal of high Pb solder paste
Critical Considerations for Electronic Component Tin Whisker Mitigation
The Effects of Long-Term Storage on Solderability of Components
The Rise of Augmented AI Component Counting and Managing
E-Motor PEEK Wire Insulation & Epoxy Secondary Insulation
Evaluating and Qualifying Candidate Selective Soldering Systems
Tombstone Troubleshooting When Soldering PCB's
Increase Production Yield by Investing in Leading-Edge Equipment
The Essential Guide to Large-Volume Thermal Interface Materials (TIM) Dispensing
Reduction of voids in solder joints with vacuum
Selective Soldering High Thermal Mass and Fine-Pitch Components
Not All 3D Inspection Is Created Equal
Essential Tools For High Accuracy Thermal Profiling
Inductive Soldering for High Thermal Demand Applications
X-Ray Supports Solder Paste Development
Functional Test of RF Boards with MMCX Connectors
Data Exchange in Electronics Manufacturing
Benefits of Manual X-ray Inspection
The Elimination of Whiskers from Electroplated Tin

Full Technical Paper Index
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address