March 24, 2025

VIEWPOINT 2025: Michail Klimkovic, CEO, XIMEA s.r.o. Last year showed considerable improvement of supply chain issues and the production could run in full gear. Even though the problems posed by spreading influence of various international conflicts still weigh heavy on demand and delivery from and to different locations, XIMEA has been able to find new ways to meet .... XIMEA s.r.o.

Sponsor Reflow Solderable TIM1 Thermal Grease AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology

China says it is prepared for shocks as US tariffs loom Chinese Premier Li Qiang urged global market openness amid rising economic uncertainty and looming Trump tariffs. At the China Development Forum, he pledged policy support and interest rate cuts, aiming to revive foreign investment and stabilize China's sluggish economy. Taipei Times

Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance products by using Openair-Plasma® and PlasmaPlus®. Technical Paper

TSMC to dominate 2nm sector TSMC is set to dominate the global 2-nanometer chip market, outpacing Samsung and Intel with superior yield rates, scale, and client interest. Mass production begins mid-year, with aggressive expansion and a $100B U.S. investment boosting long-term growth. Taipei Times

Sponsor High-Density Rigid PCB Boards Summit's rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options. Summit Interconnect

Most AI experts say chasing AGI with more compute is a losing strategy A new survey of 475 AI researchers shows 76% doubt that scaling up computing power alone will lead to AGI. Despite massive investments, performance gains are plateauing, and experts now prioritize safety, efficiency, and alternative approaches over brute-force scaling. TechSpot

Technical Papers ■ Recycling vs Circularity: Minimising E-Waste in Manufacturing ■ Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components ■ Probe Card Manufacturer 'Sees the Unseen' With X-ray ■ Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods ■ An Eight-Step Methodology for Bringing a Process Under Statistical Control ■ Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel ■ Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry ■ Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment ■ Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes ■ Smart pH Employment in Electronic Cleaning MORE TECHNICAL PAPERS

Sponsor Contaminant Removal with Plasma Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more. Plasma Etch

Why startups and tech giants are racing to build a practical quantum computer Tech giants and startups alike are racing to develop quantum computing, with Nvidia joining the effort via a new Boston research center. Experts project the technology could unlock $2 trillion in value by 2035, despite current limitations. CNBC

Strategies for Addressing More Complex Custom Chip Design Surging demand for edge AI and HPC is fueling growth in custom chip design, but challenges like PPA trade-offs, packaging, and supply chain hurdles remain. Turnkey providers like Sondrel help startups overcome these barriers with integrated, flexible solutions. EE Times

Sponsor AI Void Detection – X-Ray Inspection X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available. Test Research, Inc.

3 Costly Mistakes Companies Make When Using Gen AI Interest in generative AI remains high, but manufacturers are pausing deployments as risks emerge. New research highlights three major blindspots. As regulation grow, companies must act now to avoid legal trouble, reputational damage, and customer mistrust. Entrepreneur

iPhone Fold might look like this quirky new foldable you probably can't buy Apple plans to launch its first foldable iPhone next year, reportedly featuring a crease-less 7.75-inch foldable screen and 5.49-inch external display. Leaks suggest a unique aspect ratio, with a design closer to a tablet than Samsung's Fold. BGR

Sponsor Simply Double the Production Volume SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more. SEHO Systems GmbH

AlexNet Source Code Is Now Open Source The Computer History Museum, in partnership with Google, has released the groundbreaking 2012 AlexNet source code on GitHub. AlexNet revolutionized AI by harnessing deep learning and GPUs, launching today’s dominant approach to image recognition and neural networks. IEEE Spectrum

Mitsubishi Electric Breaks Ground in Pittsburgh Mitsubishi Electric Power Products Inc. broke ground on an $86M factory near Pittsburgh, creating 200 jobs and expanding its energy product line. Backed by $6.7M in state support, the project strengthens Pennsylvania’s position in energy manufacturing. EE Times

Sponsor Inline Automatic X-Ray Inspection: TruView™ Verus TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed. Creative Electron

Global electronics supply chain shifts from certainty to chaos amid tariff 'noise' Tariffs and trade uncertainty triggered an unexpected surge in electronic component demand in early 2025, disrupting seasonal buying norms. Supplyframe reports inventories plunged while buyers rushed to stock up, straining supply chains and fueling inflation and economic uncertainty. EP&T

Apple sued for false advertising over Apple Intelligence Apple faces a federal lawsuit alleging false advertising and unfair competition after delaying key Apple Intelligence features. The class action seeks damages for customers who bought devices expecting immediate access to the promised, heavily promoted capabilities. Axios

Heterogeneous Data Teaches Robots Range of Tasks Researchers have developed a technique that combines heterogeneous data from many sources into one system that can teach any robot a wide range of tasks. Circuit Insight - Technology Briefing

Sponsor Buy SMT Dispensing Needles Online EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online. DL Technology

Apple supplier Wingtech offloads ODM assets to Luxshare in semiconductor pivot Luxshare Precision is acquiring core assets from Wingtech's consumer electronics unit in an all-cash deal. The move, made through Luxshare Communication, supports Luxshare's strategy to expand globally and deepen vertical integration in electronics manufacturing. Digitimes

How Does Printed Solder Paste Volume Affect Solder Joint Reliability? Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability. Circuit Insight - Materials Tech

Memory Safety Will Be Key to Tackle Fundamental Cyber Security The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority. EE Times