Master Bond Inc.
eBook: Adhesives for Sensor Applications
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Epoxy compounds serve a critical role in sensor applications – helping to ensure optimal performance throughout the life of these devices. Read through these real-life case studies published in peer reviewed scientific journals and patents to learn more.

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EP17HTND-CCM: Adhesive for thermal actuator in a novel endoscope
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Master Bond EP17HTND-CCM was used for bonding and sealing in the assembly of a novel scanning fiber endoscope with a thermal actuator. Learn more about how this thermally conductive, high temperature resistant adhesive performed in the study.

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White Paper: Epoxies and Glass Transition Temperature
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Learn about glass transition temperature (Tg) and why it is an important factor for consideration in high temperature bonding, sealing, coating and encapsulation applications. In this white paper, we explore how Tg is measured and how thermal stability affects the performance of epoxy compounds. Download now to learn more.

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EP3HTS-TC: Highly Thermally Conductive Epoxy
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Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy with an outstanding thermal conductivity of 16-17 W/(m·K). The material features a thixotropic paste consistency and is not pre-mixed and frozen. Scroll through this infographic to learn more.

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