Essential Guide to High Reliability BGA Component Re-balling This new paper discusses the techniques and key process steps of this highly specialized process. Robotic solder ball removal. Watch a short video of the process. BGA component re-balling from lead-free to tin-lead solder is a critical requirement of some high-reliability customer applications due to tin whisker mitigation concerns. This new paper discusses the techniques and key process steps of this highly specialized process. The experts at Circuit Technology Center have been re-balling BGA components for over 20 years. Download the paper for an in-depth review of the critical process steps including: The use of robotic hot solder dip equipment with dynamic solder wave for the precise de-balling and alloy exchange of the original solder balls The applicable industry specifications and standards Various methods for new solder ball attach Post re-balling inspection, verification protocols, and optional tests Device re-identification options, proper MSL bake, and re-packaging options DOWNLOAD THE PAPER   Circuit Technology Center, Inc. 22 Parkridge Road | Haverhill, MA 01835 USA Phone: 978-374-5000 | www.circuitrework.com This email was sent to *|EMAIL|* - Unsubscribe. Circuitnet Media, LLC | 6 Liberty Square #2040, Boston MA 02109 USA