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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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January 29, 2025
VIEWPOINT 2025: Chris Williams, Head of European Sales, Solderstar
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| Chris Williams, Head of European Sales, Solderstar
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2024 has been an interesting year for Solderstar, with continued growth despite challenges in the European automotive sector. Slower-than-anticipated adoption of EV technologies in markets like Germany and Eastern Europe has created uncertainties. However, these conditions have encouraged manufacturers to scrutinize their equipment purchases more closely, looking for solutions that deliver both cost savings and production efficiency—a focus where Solderstar excels.
Our Reflow Shuttle Verification Tool enables customers to manage reflow oven maintenance proactively. By monitoring parameters such as vibration in three axes, conveyor speed, nitrogen levels, vacuum, and temperature profiles, the tool helps identify process changes early. The addition of oxygen monitoring in parts per million (PPM) allows manufacturers to track nitrogen usage more precisely and ensure it is applied efficiently. This supports both reflow performance and environmental goals.
In 2025, we expect automotive production to rebound, and Tier 1 EMS providers will increasingly prioritize environmental performance over cost savings. As nitrogen usage continues to be a major focus, Solderstar's tools will help manufacturers optimize nitrogen application, reduce wastage, and support ISO 14001 compliance—ensuring both quality and sustainability in PCB production.
Chris Williams, Head of European Sales
Solderstar
http://www.solderstar.com
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