February 23, 2021

VIEWPOINT 2021: Reid Henry, President, Hentec Industries/RPS Automation

VIEWPOINT 2021: Reid Henry, President, Hentec Industries/RPS Automation
Reid Henry, President, Hentec Industries/RPS Automation
The unprecedented impact of the COVID-19 pandemic combined with a trade war made 2020 a challenging year for the electronics industry as a whole. Fortunately for Hentec/RPS all of our automated selective soldering machines, component lead tinning machines and solderability test equipment is proudly made in the USA which has minimized this affect.

After celebrating more than 25 years in the automated soldering industry we are continuing to expand our support team to provide the best service in the industry to our growing customer base. We recently launched our new Valence selective soldering system that uses electromagnetic solder pumps to provide our customers with greater efficiency, better process repeatability and enhanced quality.

The continued need for gold removal, component re-conditioning and BGA de-balling has increased demand for our Odyssey robotic hot solder dip machines. Throughout 2021, Hentec/RPS will continue with new product innovations to meet our customers board assembly needs.

Reid Henry, President
Hentec Industries/RPS Automation
Viewpoint Index
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address