circuitnet
Sponsor
Nordson-ASYMTEK

ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
Ask the Experts
Class 3 Pin Contact Question
I am working on a class 3 product. We have an assembly from one operation that has a tinned pin. The pin is inserted into ...
Responses by:
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Solder Paste Print Test Boards
Removing Cleaning Residues Under BTC Packages
BGA Solder Ball Wetting
Requirements for Installing Leaded vs. Lead-free Press Fit Connectors
Maximum Allowable Time Prior to Washing When Using Water Soluble Paste
What's Causing Cloudy Conformal Coating
What Is Causing Slanted Pins After Reflow
MORE ASK THE EXPERTS
Aim-Solder
Sponsor
Manncorp

Keeley Pedals Perfected with Manncorp
Keeley Electronics revolutionizes production with Manncorp pick & place machines, achieving unprecedented speed, precision, and innovation in the guitar pedal industry.
Manncorp Inc.
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMT
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Heller-Industries-Inc
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
What Year Was It?
FDR Gives First Fireside Chat
What Year
President Franklin D. Roosevelt gives his first national radio address or "fireside chat," broadcast directly from the White House.
See the answer below.
Sponsor
Indium-Corporation

High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
Advanced-Interconnections
What Year Was It Answer
FDR Gives First Fireside Chat
Answer: March 12, 1933
March 13, 2026
The Silicon Hegemon
Taiwan dominates the semiconductor industry, producing about 92% of the world’s most advanced chips. Led by Taiwan Semiconductor Manufacturing Company, its pure-play foundry model powers global tech firms while driving AI growth, even as energy limits and geopolitical tensions threaten this critical supply-chain hub.
EE Times
Sponsor
Creative-Electron

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
If You Think Laptops Are Expensive In 2026, You Won't Believe What They Cost In The '80s
Modern laptops may seem pricey, but early machines cost far more. The 1982 GRiD Compass 1101 launched at $8,150, while models like Macintosh Portable neared $6,500—yet even today’s $230 Asus Vivobook Go Slim easily outperforms them.
BGR
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
Oracle prepares new round of layoffs while doubling down on AI infrastructure
OpenAI CEO Sam Altman met lawmakers in Washington after the company’s deal with the Department of Defense. Sen. Mark Kelly raised concerns about AI in warfare, urging guardrails and legislation as tensions with rival Anthropic spotlight surveillance risks.
TechSpot
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Sam Altman faced ‘serious questions’ in meeting with lawmakers about OpenAI’s defense work
OpenAI CEO Sam Altman met lawmakers in Washington after the company’s deal with the Department of Defense. Sen. Mark Kelly raised concerns about AI in warfare, urging guardrails and legislation as tensions with rival Anthropic spotlight surveillance risks.
CNBC
Investigation of Overprinting BGA Pads
The added benefit of using overprinting stencil design strategy is that this should compel further improvement in paste transfer efficiency and uniformity by raising its area ratio. In this study the circle shape overprint apertures were designed for 0.5mm pitch BGA land patterns that measured to an area ratio value of 0.70.
Technical Paper
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
Test-Research-Inc.

High Accuracy SMT / SEMI Inspection
Discover TRI's High Accuracy Inspection Solutions for the SMT and SEMI Back-End Electronics Manufacturing.
Test Research, Inc.
Beyond Bandwidth: The Industry is Striving for Custom Memory (Part 2)
Chipmakers are developing custom memory to push AI performance beyond standard HBM4E. Companies including Marvell Technology, Samsung Electronics, Micron Technology, SK Hynix, Global Unichip Corp., and imec are advancing architectures that boost bandwidth, efficiency, and capacity for next-generation AI accelerators.
EE Times
7 Annoying EV Myths That Just Refuse To Die Read More: https://www.bgr.com/2118575/most-annoying-electric-vehicle-myths/
Electric vehicle adoption has surged to over 25% of global new car sales, yet misinformation persists. Experts counter myths about emissions, cost, and range, showing EVs produce far lower lifetime emissions, cost less to run, and now offer significantly improved driving range.
BGR
Crack Propagation Mechanism Study on Bismuth Contained Base Lead Free Solder
The thermal cycling reliability characteristics of solder containing a small amount of Bismuth which is below 4wt% in accordance with the new requirements were investigated.
Technical Paper
Sponsor
Air-Vac-Engineering

Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
AI Was Supposed to Make Work Easier. A New Study Shows It’s Doing the Opposite.
An analysis of 164,000 workers shows AI is intensifying work rather than easing it. Use of email, messaging, and management software surged, while focused work time fell. Researchers warn that AI-driven efficiency may increase cognitive overload, burnout, and long-term declines in work quality.
Entrepreneur
40 Years of Wireless Evolution Leads to a Smart, Sensing Network
The upcoming 6G era will transform connectivity beyond speed, creating a universal data fabric where millions of agents collaborate across digital and physical worlds. Building on 1G–5G evolution, 6G will fundamentally reshape how devices, networks, and applications interact, advancing system-wide intelligence.
IEEE Spectrum
Fabriciton of NiCo Alloy and Rh Coating Using Electroplating Method
The properties of NiCo deposits were analyzed using field emission scanning electron microscopy (FESEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD).
Technical Paper
Sponsor
Essegi-Automation

From Slave to Master: flexible ISM integrations
ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow.
Essegi Automation
Lobster buffet: China’s tech firms feast on OpenClaw as companies race to deploy AI agents
China is rapidly adopting the open-source AI agent OpenClaw as tech firms and local governments expand access. Companies like Tencent and ByteDance launch simplified tools and services, boosting consumer uptake while raising privacy concerns and accelerating demand for Chinese AI models.
CNBC
Honor flagship phone to launch in Taiwan by 2Q26, shaking up market
Honor plans to enter the Taiwanese smartphone market in 2026 by opening retail stores and selling phones and accessories. Its flagship Honor Magic8 Pro has received certification from Taiwan’s National Communications Commission and could launch as early as the second quarter.
Digitimes
Sponsor
Glenbrook-Technologies

X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies
Meta designs four in-house chips to power data centers
Meta Platforms unveiled plans for four generations of in-house artificial intelligence chips as it expands data center infrastructure. The move aims to strengthen control over AI hardware, improve performance efficiency, and support rapidly growing AI workloads across its platforms.
Digitimes
Blow Holes After Switching from Lead-Free HASL to ENIG
After switching our PCB finish from lead-free HASL to ENIG blow holes started occurring in the solder joints of the through-hole LEDs. The PCBs and LEDs are from the same suppliers as before, only the finish changed.
Board Talk
Pegatron Eyes 10-fold AI Server Growth
Pegatron Corp said it plans to grow AI server revenue more than tenfold this year, driven by demand for Nvidia GB300 server platform systems and cloud clients. Shipments are expected to rise quarterly, though near-term margins may face pressure from infrastructure investments.
Taipei Times
Apple's Foldable iPhone Just Got Its Most Convincing Leak Yet
Apple's foldable iPhone looks closer to launch as new CAD renders reveal a book-style design resembling a mini tablet. The leak aligns with earlier reports, hinting at a possible fall debut as Samsung begins producing Apple’s crease‑reduced foldable displays.
CNET
Sponsor
Viscom

Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom
Why AI Chatbots Agree With You Even When You're Wrong
AI researchers warn that chatbots often display "sycophancy," agreeing with users even when they're wrong. Studies from OpenAI and Anthropic tie the issue to training methods, raising safety concerns, lawsuits, and efforts to build more critical models.
IEEE Spectrum
Today's Sponsor
Summit-Interconnect
Sponsor
Summit-Interconnect

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect
Test Your Knowledge
What science deals with the motion of projectiles?
See answer below.
Industry Press
Indium Experts to Present Solder & Thermal Management Solutions at APEX
Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics at APEX 2026, March 17-19, in Anaheim, California. ...
Indium Corporation
Rehm Thermal Systems Strengthens Its Presence in Asia at Spring Trade Fairs
Electronics manufacturing is increasingly shaped by smart factory concepts, e-mobility, and the continuous expansion of 5G infrastructure. As requirements ...
Rehm Thermal Systems
TopLine® Offers Custom 'Super-Sized' BGA
When you need bigger, only bigger will do. So where do you go if it's not off-the-shelf? TopLine can help. TopLine Corporation announces the availability of custom ...
TopLine Corporation
Transition Automation Introduces Innovative Advancements
Transition Automation, Inc. is announcing two new product advancements designed to improve SMT printing performance and extend squeegee life: Laser-Enhanced ...
Transition Automation, Inc.
TAGARNO Responds to Growing Conformal Coating Inspection Demands
TAGARNO is seeing significant growth in demand for its digital microscopy systems as electronics manufacturers increase their use of conformal coating across a range ...
TAGARNO
Renesas Announces General Availability of Renesas 365
Renesas Electronics Corporation announced the general availability of Renesas 365, Powered by Altium, an intelligent, model-based platform that integrates ...
Renesas Electronics Corporation
AIM Solder Promotes Timothy O'Neill to Vice President of Technology
AIM Solder is pleased to promote Timothy O'Neill to Vice President of Technology, effective March 1, 2026. In this newly created role, O'Neill will unify Research ...
AIM Solder
MORE INDUSTRY PRESS
Ormet-TLPS
Sponsor
Alltemated

Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
Quote of the Day
"One machine can do the work of fifty ordinary men. No machine can do the work of one extraordinary man."
Elbert Hubbard
Sponsor
Rehm-Thermal-Systems-GmbH

Use of Numerical Simulation Methods
The use of numerical methods has now become widespread. The implementation of these methods helps to minimize development costs by reducing the number of required prototypes. Download now.
Rehm Thermal Systems GmbH
Master-Bond
Cartoon of the Day
Cartoon
"It's supposed to be inspirational, but most employees see it as permission to take a nap."
Copyright © Randy Glasbergen
Sponsor
Schunk

Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
Circuit-Technology-Center
Test Your Knowledge Answer
What science deals with the motion of projectiles?
Answer: Ballistics