circuitnet
Sponsor
Aim-Solder

Drop-in SAC305 Alternative: Try REL61
Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today.
AIM Solder
Ask the Experts
Looking for Long-term Component Storage Options
Looking for long-term (10+ years) options to store components (IC's) in dry or nitrogen environment. Can you provide some options?
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Carlos Bouras
General Manager, Nordson SELECT
Jerry Karp
President, JSK Associates
Ray Prasad
President, Ray Prasad Consultancy Group
Paul Austen
Senior Project Engineer, Electronic Controls Design Inc
Question About PPM Defect Rate for Reversed Packages
ESD and Humidification
SMT Target Component Placement
Old Components and Blow Holes
Pin in Paste Solder Dropping
Reusing recovered solder paste
Bottom Side Chip Bonding
MORE ASK THE EXPERTS
ECD
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMT
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Circuit-Technology-Center
Sponsor
SEHO

Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH
What Year Was It?
Alamo Defenders Call for Help
What Year
In San Antonio, Texas, Colonel William Travis issues a call for help on behalf of the Texan troops defending the Alamo, an old Spanish mission and fortress under attack by the Mexican army.
See the answer below.
Sponsor
Manncorp

Keeley Pedals Perfected with Manncorp
Keeley Electronics revolutionizes production with Manncorp pick & place machines, achieving unprecedented speed, precision, and innovation in the guitar pedal industry.
Manncorp Inc.
Alltemated
What Year Was It Answer
Alamo Defenders Call for Help
Answer: February 24, 1836
February 24, 2026
image
The AI Memory Squeeze: Why Japan's Consumer Electronics Face a New Reality
Rising AI server demand is reshaping global memory allocation, leaving Japanese consumer electronics, including TVs and home appliances, facing shortages and soaring costs. Suppliers favor AI & cloud clients, squeezing margins & challenging Japan's traditional supply strategies.
Trend Force
Sponsor
AI-Technology-Inc

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
VIEWPOINT 2026: Foad Ghalili, President/CEO, Epoch International Enterprises, Inc.
image
Over the past year, Epoch strengthened coordination across its global footprint and set a solid foundation for 2026. San Jose continued building on its expanded facility, applying advanced equipment, medical-device capability, and ITAR certification to broaden its technical reach. Bangalore completed its first full year ...
Epoch International Enterprises, Inc.
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
Electrostatic discharge (ESD) threatens IoT and high-reliability electronics as components shrink and densify. This paper details design protections, assembly controls, and validation methods to help engineers and OEMs enhance device resilience and ensure long-term performance.
Technical Paper
U.S. launches Peace Corps-backed 'Tech Corps' to help export AI, counter China
The White House launched a "Tech Corps" within the Peace Corps to send skilled U.S. volunteers abroad, advancing AI adoption, building infrastructure, training local talent, countering Chinese tech influence, and promoting global collaboration and AI sovereignty.
CNBC
Sponsor
DL-Technology

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology
Empowering Your Engineering Teams with Engineering Pro: The Smarter Way to Stay Ahead in Electronics Manufacturing
Engineering Pro is a self-paced online platform for electronics manufacturing teams, delivering IPC-standard training, process optimization, and defect prevention. Role-based paths, progress tracking, and upskilling tools accelerate onboarding, boost efficiency & ensure compliance.
Global Electronics Association
The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies
Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).
Technical Paper
Technical Papers
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
Optimizing BGA Rework: Challenges, Techniques and Quality Control
MORE TECHNICAL PAPERS
Sponsor
Viscom-SE

Viscom: Next Level of Inspection at APEX
Viscom Inc. presents its AI-powered inspection software vAI ProVision at APEX Expo 2026 in Anaheim. See live demos of faster AOI and AXI programming at Booth #2836.
Viscom SE
Amazon to spend $12 billion in Louisiana on AI data centers
Amazon will invest $12 billion in AI-focused data center campuses in Louisiana's Caddo and Bossier Parishes, creating 540 jobs and supporting 1,700 roles. The move, part of a broader $200 billion capex plan, expands its cloud footprint amid intensifying competition.
CNBC
Poem: The Attraction of Blackberries
A first encounter sparked curiosity and playfulness as she asked about blackberries. Together, they wandered the September fields, gathering and eating more than they kept, their hands and lips stained with sweet, dark juice, savoring simple, shared delight.
IEEE Spectrum
The Impact of VIA and Pad Design on QFN Assembly
This paper discusses the impact of the via size and design on QFN voiding and solder protrusion. Do small vias prevent the solder from flowing onto the other side?
Technical Paper
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Adjusting to US ruling on tariffs
The US Supreme Court limited former President Donald Trump's tariff powers, blocking unilateral broad duties under emergency law. While other trade tools exist, the ruling eases uncertainty, reshapes supply chains, and pushes Taiwanese firms to rethink investments and risks.
Taipei Times
AI's Math Tricks Don't Work for Scientific Computing
AI is fueling a surge in new digital number formats as engineers cut bit lengths to boost speed and save energy. These AI-optimized formats often fail scientific workloads. In an interview with IEEE Spectrum, Laslo Hunhold discussed designing a custom format for scientific computing.
IEEE Spectrum
Advances in Power Electronics
This paper details some of the recent advances in power electronics systems and details some of the challenges that need to be overcome.
Technical Paper
Sponsor
BEST-Inc.

Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.
UN calls for scam center clampdown
The UN urged governments to crack down on Southeast Asian scam centers, where hundreds of thousands are trafficked into forced labor. Its report details torture, sexual abuse, starvation, and coerced violence, calling for urgent rescue, justice, and rehabilitation measures.
Taipei Times
MIT's new 3D printer can create a working electric motor in one go
Researchers at MIT have created a multimaterial 3D-printing platform that fabricates a fully functional electric linear motor in one automated process. Using five integrated materials and precise sensor controls, the low-cost motor matches conventional performance.
TechSpot
Sponsor
SEIKA-America

Malcom Paste Mixers
Unlike hand mixing, the Malcom SPS Solder Paste Mixer is a non-contaminating mixer which utilizes pseudo planetary motion to stir the solder paste. The SPS-1 provides uniform consistency.
Seika
With The Computer World On Fire, Mini PCs Might Become The New Norm - Here's Why
Mini PCs are gaining traction as compact, powerful alternatives to laptops and desktops. They mount behind monitors, travel easily, cut costs, and use less power, attracting budget- and efficiency-minded consumers amid rising energy and AI hardware expenses.
BGR
Common PCB Design Decisions that Cause Manufacturing Problems
What are the most common design decisions that can have a negative impact on the PCB assembly manufacture and how could we correct them during the design? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario and share their suggestions.
Board Talk
NASA Return to Venus Depends on New Class of Ceramic Sensor
Venus's 460°C heat, crushing pressure and corrosive air quickly destroy silicon electronics. To extend missions, NASA is adopting wide-bandgap chips like silicon carbide and rugged ceramic sensors that survive extreme heat and chemical attack without bulky shielding.
EE Times
The Age-Verification Trap
Lawmakers push social media age limits to protect teens from addiction and harmful content. But real enforcement forces platforms to collect IDs or biometric data, creating privacy risks, errors, and constant rechecks. Efforts to shield children in collide with modern data-protection principles.
IEEE Spectrum
Sponsor
Plasma-Etch

Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch
Sam Altman defends AI resource usage: Water concerns 'fake,' and 'humans use energy too'
OpenAI CEO Sam Altman rejected claims that AI like ChatGPT wastes water, labeling them false, while admitting AI's energy use grows. Speaking in India, he stressed improving inference efficiency, yet critics warn data center expansion still raises environmental concerns.
CNBC
Today's Sponsor
Creative-Electron
Sponsor
Creative-Electron

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
Test Your Knowledge
How many nautical miles are there in one degree of latitude?
See answer below.
Industry Press
Creative Electron Expands NDT and FOD Market Reach
Creative Electron is pleased to announce a new partnership with Kodex, Inc. as an authorized distributor for its Non-Destructive Testing (NDT) and Foreign Object Detection ...
Creative Electron
Dual Cure Medical Adhesive Features High Tg and Autoclave Resistance
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that ...
Master Bond
White Paper Explores Cold Precision Milling for Underfilled BGA Removal
Circuit Technology Center, Inc. has released a technical white paper: Cold Precision Milling for Underfilled BGA Component Removal. Available at www.circuitrework.com ...
Circuit Technology Center, Inc.
Seika Machinery Introduces MORITA TECH WM7000 Series Robotic Noise Scanners
Seika Machinery, Inc. has added the MORITA TECH WM7000 Series High Performance EMC Noise Scanners to its electronics manufacturing equipment lineup. ...
Seika Machinery, Inc.
High-Performance Fastening Solution for Lightweight Aerospace Interiors
Böllhoff and DELO combine their expertise and adapt proven joining technologies for the aerospace industry: The ONSERT fastening element from Böllhoff and the light-curing ...
DELO
YINCAE Launches Next Generation Solderable Adhesives: EN 256ED
YINCAE has introduced Solderable Adhesives. EN 256ED is a next-generation material that combines soldering and encapsulation into a single process, delivering enhanced ...
YINCAE
ITW EAE appoints AMB Technic as Distributor for Vitronics Soltec
ITW EAE is pleased to announce the appointment of AMB Technic as the authorized distributor of Vitronics Soltec reflow products for the Polish territory. "We are delighted ...
ITW EAE
MORE INDUSTRY PRESS
Glenbrook-Technologies
Sponsor
Summit-Interconnect

Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect
Quote of the Day
Ability is of little account without opportunity.
Napoleon Bonaparte
Sponsor
kyzen

Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN
Nordson-ASYMTEK
Cartoon of the Day
Cartoon
"I'm leaving early today to have my cat neutered. While I'm gone, select 9 people to be Employee of the Month and award each of them with a kitten."
Copyright © Randy Glasbergen
Sponsor
Master-Bond

Low Outgassing, Glob Top Epoxy
Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates.
Master Bond
Viscom
Test Your Knowledge Answer
How many nautical miles are there in one degree of latitude?
Answer: 60 nautical miles (approximately 69 statute miles) in one degree of latitude.