July 22, 2026

AI, Silicon Photonics & Space Manufacturing: Three Signals of What's Ahead for Electronics Emerging technologies are reshaping electronics as AI-driven design, silicon photonics, and space-based semiconductor experiments push innovation across PCB design, advanced packaging, AI infrastructure, and future manufacturing systems globally. Global Electronics Association

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

How Quantum Computing Earns Its Place in the Data Center Quantum computing is entering data centers as QPUs join AI and HPC systems. Industry leaders tackle cooling, power, networking, and orchestration challenges to scale quantum infrastructure, with modular and colocated models rising worldwide. EE Times

Understanding Solder Dross: Causes and Control Strategies This article outlines the main contributors to dross formation, examines how alloy refining methods play a role, and explores practical ways to reduce dross through process control and equipment optimization. Technical Paper

Why AI Needs a "Genie Coefficient" Researchers propose the Genie coefficient, a new benchmark that measures how closely AI agents follow users' intended meaning rather than literal instructions. The metric aims to identify risky, overly proactive behavior and improve safety as autonomous AI systems gain responsibilities. IEEE Spectrum

Sponsor Training for Certified IPC Specialists BEST's 7711 Training Rework Kit is designed for certification/re-certification of Certified IPC Specialists (CIS) so employees can be tested for speed, accuracy and quality. BEST Inc

Samsung can't afford to play it safe with Apple's first foldable looming Samsung is expected to unveil redesigned Galaxy Fold and Flip phones alongside a new shorter, wider foldable at Galaxy Unpacked, marking its biggest foldable lineup overhaul yet as it responds to growing competition and the anticipated arrival of Apple's first foldable iPhone. The Verge

Hand Soldering Reliability What are the differences in reliability for SMT machine placement followed by reflow vs. hand placement followed by hand soldering in surface mount? Board Talk

Technical Papers ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics MORE TECHNICAL PAPERS

Sponsor How pH Cleaning Agents Affect Production Performance Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability. KYZEN

Billionaire CEO Says AI Could Make Him 20 Times Richer: 'That's a Problem for Society' Palantir CEO Alex Karp warned that AI will boost living standards while concentrating enormous wealth among founders and tech leaders. He predicted widening inequality as AI-driven fortunes soar faster than middle-class incomes, echoing Oxfam's findings on billionaire wealth growth. Entrepreneur

Nvidia details its next-generation Vera CPU for AI, setting up challenge to AMD and Intel Nvidia is expanding beyond AI GPUs with its Vera data center CPU, targeting Intel and AMD in AI servers. The company says Vera boosts AI agent performance, supports integrated AI systems, and aims to strengthen its position as cloud providers evaluate next-generation infrastructure. CNBC

Flip Chip LED Solder Assembly A pin transfer process was adapted to assemble flip-chip CSP LEDs with fine pitch solder paste to assemble lateral and vertical LEDs on flat substrates. Technical Paper

Sponsor Eliminate Lead Tinning Issues Before They Become Reliability Failures Learn lead tinning methods, causes of tinning defects, and solutions from the experts at Circuit Technology Center to help ensure dependable solder connections. Circuit Technology Center

Refuse a data center transmission line on your property, and power companies may force it through anyway A report says utilities can use eminent domain to secure land for transmission lines serving data centers when negotiations fail, fueling public opposition. As AI-driven projects expand, concerns over property rights, environmental impacts, and community costs continue to intensify. TechSpot

Carbon Nanotube Firm Strengthens Executive Team to Build CNT Ecosystem Canatu strengthened its leadership team to accelerate carbon nanotube commercialization in semiconductor, automotive, and medical markets. CEO Maximilian Slawinski will expand partnerships, boost confidence, and drive CNT adoption across industries. EE Times

Modern Methods of PCB Depanelization with a Focus on Low Impact Depanelization It is easier and more economical to manufacture multiple assemblies simultaneously on a larger panel and then singularize them once they’ve been populated. Technical Paper

Sponsor Introducing our new Board to Board Connectors These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling. Advanced Interconnections Corp

AI offers new path for Asia's manufacturers, from EVs to humanoids Asian firms are integrating AI into electric vehicles and humanoid robots to enhance performance and competitiveness. Manufacturers accelerate adoption as Chinese rivals expand, intensifying competition across two growing industries worldwide. Nikkei Asia

Phone prices to surge in 2H26 as low-end models fade AI-driven memory shortages are set to push smartphone prices sharply higher in the second half of 2026, with analysts warning that persistent chip shortages and rising memory costs will fuel prolonged "chipflation" and keep consumer electronics prices elevated through 2027. Digitimes

Sponsor ASYMTEK Select Coat SL-1040 The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield. Nordson Electronics Solutions

India's smartphone shipments fall as memory costs bite India's smartphone market fell sharply in Q2 as rising component costs pushed prices higher and weakened demand. The decline highlights global memory shortages, inflation, and softer electronics spending, challenging manufacturers and supply chains. Digitimes

How Does Printed Solder Paste Volume Affect Solder Joint Reliability? Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability. Technical Paper

This State Wants To Make It Illegal For Tech Companies To Hide Software Support Timelines California's SB-898 would require tech makers to provide five years of support and disclose update timelines. The bill boosts cybersecurity, reduces e-waste, guides purchases, and helps consumers avoid repairs with clearer support notifications. BGR

AI as an Opportunity and a Stress Test for the Electronics Industry Electronica 2026 will spotlight AI-driven electronics as companies unveil efficient, secure systems for industry, mobility, healthcare, and infrastructure. The event shows semiconductor, cybersecurity, and connectivity advances as AI adoption grows. All About Industries

Sponsor Gripping Systems from micro assembly to heavy lifting The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market. SCHUNK

Samsung finally has its own credit card, seven years after Apple Samsung has launched its first branded Galaxy Card in the US with Barclays and Visa, offering up to 5% cash back on Samsung purchases, Samsung Wallet rewards, and a $200 signup bonus to strengthen competition with Apple's long-established credit card. TechSpot