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Ask the Experts
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Storage To Prevent Corrosion
Which storage method will better protect against corrosion, nitrogen or super-dry?
Responses by:
Georgian Simion Engineering and Operations Management, Independent Consultant Edithel Marietti Senior Manufacturing Engineer, Northrop Grumman Dr. Eyal Weiss CTO, Cybord Manuel Schöllig Product Manager Soldering, Inventec Dehon Jerry Karp President, JSK Associates Terry Munson President/Senior Technical Consultant, Foresite Paul Austen Senior Project Engineer, Electronic Controls Design Inc Fritz Byle Process Engineer, Astronautics
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MORE ASK THE EXPERTS
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Low Thermal Resistance Epoxy
Master Bond EP53TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
Master Bond
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What Year Was It?
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World War II Monument Opens in Washington
The National World War II Memorial opens in Washington, D.C., to thousands of visitors, providing overdue recognition for the 16 million U.S. men and women who served in the war.
See the answer below.
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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What Year Was It Answer
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World War II Monument Opens in Washington Answer: April 29, 2004
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April 29, 2026
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Can AI outperform doctors? Experts weigh the pros and cons
Experts urge wider consumer use of AI for health questions, with Insilico Medicine CEO Alex Zhavoronkov saying models can match doctors for basic advice. While AI speeds drug discovery and gains industry adoption, leaders warn human validation remains essential.
CNBC
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Laptops Vs. Notebooks: What's The Difference?
Computers have shrunk from room-sized machines to portable devices, but laptops and notebooks differ. Laptops deliver stronger performance, more ports, and shorter battery life, while ultra-thin notebooks sacrifice power for longer battery life, portability, and lower cost for basic tasks.
BGR
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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The Chip That Made Hardware Rewriteable
IEEE honored the first FPGA at AMD’s San Jose campus, recognizing Xilinx’s 1980s innovation that enabled reconfigurable hardware. The technology bridged processors and ASICs, letting engineers repeatedly redesign chips and accelerating modern electronics and AI development.
IEEE Spectrum
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Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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TSMC expects 70% 2nm growth
TSMC projects its 2-nanometer chip capacity will grow at a 70% CAGR through 2028 as five fabs ramp production in Taiwan, while early output exceeds 3-nanometer launch levels and the company expands advanced packaging and overseas manufacturing.
Taipei Times
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A Samsung factory strike may push DRAM and NAND prices even higher
Samsung faces an inevitable 18-day strike as labor talks stall, threatening global memory supply. Analysts warn DRAM and NAND output could fall, worsening shortages, while the union demands higher profit-sharing and bonus reforms amid booming AI chip earnings.
TechSpot
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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
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OpenAI Prepares AI-First Smartphone for 2028
OpenAI is partnering with Qualcomm and MediaTek to build an AI-first smartphone, targeting a 2028 launch. The device will center on AI agents, integrate on-device and cloud intelligence, and challenge Apple and Samsung with a new AI-native ecosystem.
EE Times
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The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
This paper aimed to investigate the impacts of printed circuit board (PCB) design, including the PCB thickness and solder mask opening, on the fatigue performance of lead-free solders. Each test vehicle includes one of two component types: CABGA192 and MLF32, assembled using SnAgCu solder paste with an Organic Solderability Preservative (OSP) surface finish.
Technical Paper
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What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK Electronic Solutions
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What the DRAM Crunch Teaches Us About System Design
A global DRAM shortage, driven by demand for DDR5 and HBM, is driving up prices and constraining AI deployments. In response, companies are redesigning systems toward edge computing, smaller models, and memory-efficient architectures to improve cost control, reliability, and scalability.
EE Times
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| Today's Sponsor |
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Test Your Knowledge
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Thomas Edison was known as the Wizard of ________ Park?
See answer below.
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Industry Press
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Indium Corporation Joins India's IDSPS Industry Consortium Partnership
Indium Corporation® announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting R&D, ...
Indium Corporation
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AIM to Highlight Cost-Saving Low Silver REL61 Alloy at SMTA Upper Midwest
AIM Solder is pleased to announce its participation in the upcoming SMTA Upper Midwest Expo and Tech Forum. This event takes place May 12 at the DoubleTree ...
AIM Solder
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Building Industry-ready Talent Through Standards-based Education
Recently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and ...
Global Electronics Association
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AdvancedPCB Boosts Assembly with Creative Electron's TruView™ Novus
AdvancedPCB announced the successful installation of a TruView™ Novus 2D, 2.5D, and 3D X-ray inspection system from Creative Electron, further strengthening its ...
AdvancedPCB
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TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU ...
TTC-LLC and TTCI
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HVDC Circuit Breaker Market Set to Reach USD 3.5 Billion by 2033
The HVDC (High-Voltage Direct Current) circuit breaker market is experiencing strong momentum, driven by the global transition toward renewable energy and the ...
Research Intelo
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MORE INDUSTRY PRESS
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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
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Quote of the Day
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"A positive attitude may not solve all your problems, but it will annoy enough people to make it worth the effort." Herm Albright
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| Cartoon of the Day
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"I am a time traveler from the future. I came back to tell you how happy you'll be that you decided to hire me today!"
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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Thomas Edison was known as the Wizard of ________ Park? Answer: Menlo Park. Edison purchased two parcels of land at Menlo Park in late 1875. The office of the real estate development company, and by the Spring of 1876, Edison moved his operations to Menlo Park.
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