circuitnet
Sponsor
Aim-Solder

Drop-in SAC305 Alternative: Try REL61
Upgrade your alloy without the downtime. REL61 requires no pot cleaning and your SAC305 scrap value often covers the cost of the changeover. Optimize your process today.
AIM Solder
Ask the Experts
Out-gassing and Cleaning
I have created a series of PCBs with no solder mask. I will be soldering 2 spring pins, a 0805 ceramic capacitor and a 0805 resistor to each board. There are 40 ...
Responses by:
Gerard O'Brien
President, S T and S Testing and Analysis
Rick Perkins
President, Chem Logic
Tony Lentz
Field Applications, FCT Assembly
Contamination From Anti-static Foam
Organic Flux Residue Concerns
Lifted Lead on SOT Component
Ultrasonic Cleaning and Surfactants
Frequency of Temperature and Relative Humidity Tracking
Pin-in-Paste Hole Stencil Printing
Pre-bake in a Vacuum
MORE ASK THE EXPERTS
Smart-Sonic
Sponsor
DL-Technology

Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
ECD
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
What Year Was It?
Jackie Robinson Breaks Color Barrier
What Year
Jackie Robinson, age 28, becomes the first African-American player in Major League Baseball when he steps onto Ebbets Field in Brooklyn to compete for the Brooklyn Dodgers.
See the answer below.
Sponsor
SEHO

Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH
Master-Bond
What Year Was It Answer
Jackie Robinson Breaks Color Barrier
Answer: April 15, 1947
April 15, 2026
image
Microsoft is Working on Yet Another OpenClaw-like Agent
Microsoft is testing OpenClaw-like features in Microsoft 365 Copilot, aiming to deliver secure, enterprise-focused agents capable of autonomous, multistep tasks, while exploring local execution options alongside existing cloud-based tools powered partly by Anthropic.
TechCrunch
Sponsor
Viscom-SE

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
Apple is testing four smart glasses designs as it prepares to challenge Meta Ray-Bans
Apple tests four N50 smart glasses designs, developing them in-house to rival Meta's Ray-Ban line. The lightweight eyewear integrates cameras, sensors, and AI features tightly with iPhone, enabling notifications, media, and visual recognition, with launch expected 2026–2027.
TechSpot
Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing
A laser depanelling solution delivers precision, zero mechanical stress, and cleanroom-level quality—transforming PCB manufacturing for high-reliability industries like automotive, medical, and industrial electronics.
Technical Paper
Meta commits to 1 gigawatt of custom chips with Broadcom as Hock Tan decides to leave board
Meta and Broadcom extend partnership through 2029 to develop custom AI accelerators, scaling to gigawatt deployments and 2-nanometer chips, as Meta pushes in-house silicon strategy. Broadcom CEO Hock Tan leaves Meta board amid intensifying AI chip competition.
CNBC
Sponsor
kyzen

The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN
​Boston Dynamics and Google DeepMind Teach Spot to Reason
Boston Dynamics upgrades its Spot robot with Google DeepMind's Gemini Robotics-ER 1.6, boosting autonomous industrial inspections, object recognition, and reasoning. The system improves safety and decisions, though real-world reliability challenges remain.
IEEE Spectrum
Expandable Bio-based Polymers: Future for Electronics Ruggedization
This paper presents a bio-based, expandable, thermoset solution, a low density, light weight method to effectively encapsulate and protect electronic components.
Technical Paper
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
SEIKA-America

Sayaka Table-Top PCB Router, SAM-CT23S with online camera
Advanced image processing software offers easy programming and CAD base offline programming. Automatic alignment compensation.
Seika
OpenAI Engineer Helps Companies Attract Buyers and Boost Sales
Gupta blends engineering and business, building AI-driven systems from school projects to Goldman Sachs automation, Asana Intelligence, and OpenAI. He now develops data science models for marketing while advancing automation and real-world impact.
IEEE Spectrum
IMF cuts global growth forecast to 3.1% on Mideast war
IMF cut its 2026 global growth outlook, warning Middle East war could derail the world economy as oil, gas and food prices surge. It now projects 3.1% global growth this year and higher inflation at 4.4%.
Taipei Times
How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts.
Board Talk
Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Taiwan leads world in increasing exports to US
US imports from Taiwan surged $59.6B last year, the largest increase globally, as bilateral trade and investment deepen. Taiwan pledged $250B for US semiconductor capacity, while the US trade deficit with Taiwan hit $145B.
Taipei Times
Japan finds a way to recover 90% of lithium from old EV batteries
Japan's JX Metals Circular Solutions extracts 90% of lithium from dead EV batteries using improved hydrometallurgy in Fukui Prefecture. The process cuts emissions by 40% and strengthens Japan's recycling push, though battery collection rates remain a major challenge.
TechSpot
Large Form Factor Surface Mount Technology Process Demonstration
This paper reviews the implementation of a multiple solder ball diameter (MDSB) strategy to increase the SMT warpage capability for a standard SAC BGA Package.
Technical Paper
Sponsor
Intraratio-Corporation

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio
How to Plan Agentic AI Deployment for Chip Design
AI in semiconductor design has become standard practice, with over half of advanced nodes using AI assistance. Agentic AI is shifting EDA from reactive tools to autonomous orchestration, boosting productivity 10–100x and forcing organizations to adopt scalable readiness frameworks.
EE Times
New terahertz technique lets engineers see inside running processors in real time
Engineers in Adelaide develop terahertz method to observe transistor activity running processors in real time. By extending vector network analyzer range enabling non-invasive chip diagnostics but challenges in complex architectures security risks.
TechSpot
Sponsor
Manncorp

Speed That Scales With You
High-throughput 10-head MC388HS pick and place machines built for accuracy at high-speed—helping you scale production without compromising placement quality.
Manncorp Inc.
This Is the Year AI Will Stop Assisting and Start Leading — Plus 2 Other Ways It Will Transform the Workplace
Despite strong hype, AI's workplace impact remains limited. Companies deploy tools to automate tasks and improve workflows, but expectations exceed reality, as most employees mainly use AI to verify work and draft emails, reports, or other written content.
Entrepreneur
Case Study for Improving the PCB Print Process Using Factory Data
The analytics of big data could help us to understand that process better. We can buy better equipment and select the parameters more carefully.
Technical Paper
Samsung 2nm yields reportedly remain below mass production threshold
Samsung Electronics is approaching a key milestone in its 2nm chip process, but low yields continue to hinder stable mass production. The shortfall raises concerns about its competitiveness and ability to attract major foundry clients for next-generation chips.
Digitimes
China exports growth in March misses estimates, imports surge most in over four years
China's export growth slowed to a six-month low in March, missing forecasts as Middle East tensions weakened global demand, while imports surged to a four-year high. Strong domestic demand and energy buffers helped offset risks to its trade-dependent economy.
CNBC
Sponsor
Indium-Corporation

Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation
Apple iPhone Fold: Striking Design Revealed In Leaked Photos
Leaks suggest Apple iPhone Fold could launch in September alongside iPhone 18 Pro models. Dummy images reveal a wide, tablet-like design that may divide opinions, with its compact folded size contrasting sharply against larger Pro variants.
Forbes
Today's Sponsor
Nordson-ASYMTEK
Sponsor
Nordson-ASYMTEK

Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions
Test Your Knowledge
The primary function of the bias circuit is to: (a) hold the circuit stable at VCC; (b) hold the circuit stable at vin; (c) ensure proper gain is achieved; (d) hold the circuit stable at the designed Q-point
See answer below.
Industry Press
Nordson Electronics Solutions wins EM China Innovation award
Nordson Electronics Solutions was honored to accept the 2025 EM Asia Best Supplier of the Year award at the 21st EM Asia Innovation Awards ceremony held March 27 ...
Nordson Electronics Solutions
Industry-Wide Memory Constraints Grow as AI-Driven Supply Reshapes Market
Artificial Intelligence is consuming a growing share of the world's memory supply, leaving electronics manufacturers across industries facing longer lead times ...
Global Electronics Association
Polaris® Expands Compression Connector Portfolio
Polaris® is proud to announce the expansion of its Compression Connector portfolio. Now available, the line offers increased variety for both copper and aluminum long barrel ...
Polaris®
Platinum Wire Supports Superior Conductivity in Electronics Manufacturing
As the electronics industry continues to advance toward smaller, faster, and more reliable devices, manufacturers are increasingly relying on premium conductive ...
M-Kube Enterprise Pty Ltd
Count On Tools Solves Challenging Terminal Placement
Count On Tools, Inc. (COT) has introduced a new custom solution designed to support accurate placement of challenging connector components. Part No. 2025-5644 ...
Count On Tools, Inc.
Fuji to Conduct R&D on High Accuracy Semiconductor Die Placement Processes
Fuji Corporation has joined the Semiconductor Assembly Test Automation and Standardization Research Association (SATAS), established in April 2024. Fuji has been ...
Fuji Corporation
Data I/O Announces New Vision, New Products and Services, New Look
Data I/O Corporation announced the launch of its completely redesigned website. More than a visual refresh, the new site introduces a suite of digital tools and services that ...
Data I/O Corporation
MORE INDUSTRY PRESS
Glenbrook-Technologies
Sponsor
Circuit-Technology-Center

Engineering Changes Don’t Have to Slow You Down
When design updates demand precision and speed, trust the rework technicians at Circuit Technology Center to get it done right the first time.
Circuit Technology Center
Quote of the Day
One should never criticize his own work except in a fresh and hopeful mood. The self-criticism of a tired mind is suicide.
Charles Horton Cooley
Sponsor
Air-Vac-Engineering

Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering
Viscom
Cartoon of the Day
Cartoon
"I won the door prize at the motivational seminar. It's a kick in the pants!"
Copyright © Randy Glasbergen
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Ormet-TLPS
Test Your Knowledge Answer
The primary function of the bias circuit is to: (a) hold the circuit stable at VCC; (b) hold the circuit stable at vin; (c) ensure proper gain is achieved; (d) hold the circuit stable at the designed Q-point
Answer: (d) hold the circuit stable at the designed Q-point