May 19, 2026

Intel CEO says foundry business is gaining momentum as customer interest grows Intel CEO Lip-Bu Tan says the company’s foundry business is gaining traction, with improving 18A yields, rising customer interest, and potential major deals. He frames it as central to Intel’s turnaround and U.S. semiconductor reshoring efforts. CNBC

Sponsor Your Award-Winning Cored Wire Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications. Indium Corporation

Dell makes its strongest case yet for keeping AI out of the cloud Dell argues cloud-only AI is losing ground as enterprises adopt hybrid architectures spanning on-prem, cloud, and workstation compute. At Dell Technologies World, it showcased AI Factory upgrades, growing customer adoption, and services aimed at moving AI from pilots to production. TechSpot

The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible The analysis of variance (ANOVA) allows comparisons between groups using one test. Validation is accomplished by verifying that residuals are normally distributed, have independence of observations, and homogeneity of variances. Technical Paper

Canada Spins Off Photonics Lab Canada announces plans to spin off the Canadian Photonics Fabrication Center into a commercial entity, aiming to attract investment, scale compound semiconductor manufacturing, and strengthen sovereign capabilities in AI, defense, and telecom, while transitioning NRC-led facility into industry-driven growth. EE Times

Sponsor Need Improved Solder Joint Visibility? Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action. Advanced Interconnections Corp.

Five Years Into Remote Work, Here’s What Actually Works for Businesses Five years after the shift to remote work, companies continue to redefine workplace models, with some returning to offices, others embracing remote setups, and many testing hybrid approaches, as they struggle to implement systems that balance performance and employee needs. Entrepreneur

Technology for Optical Co-Packaging A practical approach is to use optical transceiver submodules and to attach them onto the package substrate by soldering is discussed in this paper. Technical Paper

Technical Papers ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin MORE TECHNICAL PAPERS

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4 Roles Most Likely to Survive AI — and How to Position Yourself For Them AI is reshaping the workforce faster than organizations expect. A tech career coach working with senior leaders observes this shift firsthand, spotting emerging hiring patterns through executive and HR coaching months before roles appear on public job boards. Entrepreneur

New Power, Memory, Interconnect, and Thermal Architectures for AI Infrastructure at Scale AI infrastructure is shifting from training to inference, exposing critical power, memory, thermal, and interconnect bottlenecks. Companies are redesigning data centers with efficient power delivery, SRAM-focused architectures, and advanced cooling technologies to sustain scalable, energy-efficient AI inference workloads. EE Times

Process-Reliability Relationships of Low-Temperature Solders and ECAs This paper studies the process-performance-reliability relationships for Sn-Bi-Ag and Sn-In solders on additively printed copper metallization. Technical Paper

Sponsor Start Micro Dispensing Today The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve. DL Technology

What Makes a Job Dull, Dirty, or Dangerous? Researchers challenged robotics’ long-standing “dull, dirty, and dangerous” framework by showing that job classifications depend on social, cultural, and worker perspectives. Their study urges roboticists to use better data and worker experiences to identify where automation can genuinely improve safety and working conditions. IEEE Spectrum

Meta layoffs starting this week stress harsh AI reality inside Zuckerberg’s company Meta is accelerating layoffs and AI spending as Zuckerberg shifts from apologizing for overhiring to prioritizing efficiency and automation. Employees report growing anxiety over job cuts, AI-driven workplace changes, and controversial worker-monitoring tools amid the company’s aggressive AI push. CNBC

Dissolution Rate of Specific Elements in SAC305 Solder This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies. Technical Paper

Sponsor You need clear soldering results? The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes. SEHO Systems GmbH

How Melbourne’s AI and Data Center Flywheel Is Accelerating Research Innovation Melbourne is transforming from a global events hub into a major AI research center by expanding sovereign compute infrastructure, hyperscale data centers, and international collaboration. Monash University’s MAVERIC supercomputer strengthens Australia’s capacity for secure, large-scale AI research in medicine, engineering, and science. IEEE Spectrum

Gartner Says Chief Supply Chain Officers Must Shift to an Autonomous Business Mindset Gartner urged chief supply chain officers to prepare for autonomous business models that blend human and machine decision-making. The company said self-improving technologies will soon drive supply chain operations, forcing organizations to redesign strategies, manage risks, and coordinate complex physical networks more effectively. Gartner

Sponsor Optimizing BGA Rework: Challenges, Techniques and Quality Control The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more. BEST Inc.

High energy prices could derail Europe’s AI race with U.S. and China Europe’s AI ambitions face mounting pressure as soaring energy costs threaten data center expansion. Experts warn that expensive electricity, slow infrastructure development, and growing power demand could push major AI investments toward cheaper, faster-growing markets like the U.S. and China. CNBC

How Long Solder Paste Can Be Left On a Stencil Without Activity How long can we leave solder paste on a stencil without any activity? If activity means not printing, then we are talking about a pause or abandoned time. Board Talk

Thermal Paste Vs Pad: Which Is Better For Your PC? Theral paste continues to outperform thermal pads in cooling tests, despite newer pad technologies narrowing the temperature gap. Experts say paste spreads into microscopic gaps more effectively, while pads offer easier application, reusability, and cleaner installation for beginner PC builders. BGR

Samsung's race to avoid a chip strike is running out of time Samsung Electronics escalated its labor dispute after executives publicly apologized and offered unconditional talks on May 15. Despite the gesture, the union rejected the proposal and confirmed plans to stage an 18-day strike from May 21 through June 7. Digitimes

Sponsor AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives 240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity. AI Technology, Inc.

Electric Cars Were Invented Much Earlier Than You Think Electric vehicles trace their roots back nearly 200 years, beginning with Robert Anderson’s crude prototype and later evolving through pioneers like William Morrison and Studebaker. Early EVs offered quiet, practical transportation, and by the early 1900s, they accounted for more than one-third of vehicles on the road. BGR