circuitnet
Sponsor
Circuit-Technology-Center

Tough Engineering Changes? Where Can You Turn?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center
Ask the Experts
Solder Contamination Sources
What are the most common sources of lead-free solder bath contamination?
Responses by:
Mitch Holtzer
Director of Reclaim Business, Alpha Assembly Solutions
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Greg York
Technical Sales Manager, BLT Circuit Services Ltd
Carlos Bouras
General Manager, Nordson SELECT
Kevin Mobley
PCBA Engineering Liaison, General Atomics Electromagnetic Systems Group
Tony Lentz
Field Applications, FCT Assembly
Removal of Non-functional Pads from Inner Layers
Components Jumping Around During Reflow
Estimating Failure Rate During Rework
Long Term Component Storage
How To Measure Solder Paste Rolling Diameter
Class 3 Pin Contact Question
Solder Paste Print Test Boards
MORE ASK THE EXPERTS
Glenbrook-Technologies
Sponsor
Viscom

Pioneering 3D X-ray Inspection for Flat Assemblies
Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards with its iX7059 product line. Learn more.
Viscom
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMT
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Alltemated
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
What Year Was It?
Triangle Shirtwaist Fire in New York City
What Year
In one of the darkest moments of America's industrial history, the Triangle Shirtwaist Company factory in New York City burns down, killing 145 workers.
See the answer below.
Sponsor
Rehm-Thermal-Systems-GmbH

Reliable drying of UV materials
Rehm Thermal Systems launches the RDS UV dryer to meet faster hardening demands, enabling efficient, eco-friendly UV coating for electronics and various industries.
Rehm Thermal Systems
Plasma-Etch
What Year Was It Answer
Triangle Shirtwaist Fire in New York City
Answer: March 25, 1911
March 24, 2026
image
Software Engineering Has Been Commoditized and Automated. What's Next?
Automation has repeatedly commoditized skilled work, and software engineering now follows that arc. As AI tools absorb routine coding, companies cut jobs, shrink teams, and shift value upward, signaling a rapid transformation that threatens mid-level roles and rewards adaptability.
EE Times
Sponsor
Viscom-SE

Discover the power of vAI ProVision from Viscom
Create and optimize 3D AOI and AXI programs in minutes. vAI ProVision boosts inspection depth, quality, and speed. Viscom develops & produces premium inspection systems.
Viscom SE
Amazon is trying smartphones again after the Fire Phone flop with Alexa-first "Transformer"
Amazon is developing a new smartphone, codenamed Transformer, that integrates Alexa, AI, and its services for a voice-driven, always-on experience. Led by J Allard, the device could range from a full smartphone to a minimalist "dumbphone" complementing existing devices.
TechSpot
The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
Technical Paper
Asia/Pacific PC Market Grew 11.6% in 2025, Supply Constraints and Pricing Pressures Expected to Impact 2026
IDC says Asia/Pacific PC shipments will drop 13.7% YoY to 92M units in 2026 as component shortages and rising prices squeeze supply and demand. After a strong 2025 refresh cycle, memory constraints and higher costs are expected to dampen buying activity.
IDC
Sponsor
Essegi-Automation

ISM Storage and Software Integration Solutions
We are specialized in storage solutions and our warehouses ensure efficient production. Patented cases maximize space, facilitating material handling.
Essegi Automation
Microsoft stock may be in a slump. But here's why it is wrong to give up now
Mounting challenges are converging on Microsoft, highlighting its weakened reputation in artificial intelligence and raising concerns about future growth in its Azure cloud business, as doubts over leadership in AI begin to affect broader strategic momentum.
CNBC
Potted Assembly Interfacial Reliability Under Inclined 25000g Mechanical Shock
This study investigates the time and temperature-dependent evolution of interfacial fracture toughness in four distinct potting compounds for printed circuit boards (PCBs). The investigation focuses on the evolution of the interfacial fracture toughness at the potting material-PCB interface.
Technical Paper
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Could AGI really be the 'last invention'?
I. J. Good's "last invention" vision fuels AGI ambitions, but real innovation hits bottlenecks in tacit knowledge and execution. Even powerful AI depends on human judgment, collaboration, and institutions to turn breakthroughs into practical impact.
Taipei Times
California bill targeting Big Tech self-preferencing gains industry support as Apple faces scrutiny
Tech leaders back California's BASED Act to curb platform self-preferencing, aligning with federal antitrust efforts. As support grows, Apple faces scrutiny for restricting apps like Replit, highlighting concerns over App Store control, competition, and fair access for emerging startups.
TechSpot
The True Business Impact of IIoT Technology
Pitfalls and opportunities in IIoT solution technology, at the device level, the manufacturing execution management system layer, and enterprise business systems layer.
Technical Paper
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Gartner Says CFOs Need to Rethink the ROI of AI Investments
Gartner warns CFOs misjudge AI by forcing a single ROI lens on diverse initiatives. Instead, they should manage AI as a portfolio, balancing productivity, process, and transformational bets while valuing nonfinancial gains like agility, decision quality, and innovation.
Gartner
Sam Altman Issued a 'Code Red' After Anthropic Started Dominating the Business Market. Now OpenAI Is Doubling Its Workforce.
Sam Altman flagged a "code red" as OpenAI lost enterprise ground to Anthropic. He now plans rapid hiring, product focus, and monetization efforts to win business customers and convert ChatGPT users into paying clients.
Entrepreneur
Requirements on a Class 0 EPA - ESD Equipment and Measurements
The requirements “0 volt” can be achieved, when die maximum value will be required. Today we do not have any ESD material, which requires these limits.
Technical Paper
Sponsor
Air-Vac-Engineering

Rework/Removal of Underfilled Parts AVX250/1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering
Nebraska Wants To Build Batteries For Storing Renewable Energy
Nebraska advances a bill to expand large-scale battery storage, enabling private firms to support public utilities, stabilize renewable energy supply, and track data center power use, aiming to improve grid reliability despite rising energy demands and renewable limitations.
BGR
What's the right path for AI?
At an MIT symposium, Karen Hao and Paola Ricaurte urged moving beyond hyperscale AI toward smaller, purpose-built models. They highlighted energy efficiency, human-centered design, and public input to ensure AI delivers equitable, real-world community benefits.
MIT News
Sponsor
Smart-Sonic

440-R + Ultrasonics = Safe & Efficient Cleaning
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, misprints & SMD adhesives.
Smart Sonic
How GlobalFoundries Takes AI from Pilot to Global Scale
AI is evolving from niche tools into a core operational layer in semiconductor fabs, enabling adaptive control, early defect detection, and global scalability. At GlobalFoundries, leaders drive disciplined, human-centered AI adoption to boost yield, efficiency, and decision-making.
EE Times
When is it Time to Switch from Manual Assembly to Automation?
We are a new start-up assembling wireless sensors. All assembly is now manual. We are experiencing large reject rates due to hand soldering of components.
Board Talk
Micron says driverless cars and robots will need 300GB of RAM
Micron Technology CEO Sanjay Mehrotra warns surging demand from autonomous cars and AI-powered robots will deepen the memory crisis, with each requiring around 300GB DRAM, as robotics enters a decades-long growth phase and drives industry expansion.
TechSpot
Rising Attacks on Power Grids Push Utilities to Prepare
In a 2025 exercise called GridEx, utilities and government partners simulated attacks on Beryllia's power grid during a heat wave, highlighting rising physical threats to electricity infrastructure. Over 28,000 participants explored AI, robotics, and sensor fusion to prevent grid disruptions.
IEEE Spectrum
Sponsor
Heller-Industries-Inc

Maximize Yield with Patented Vacuum Reflow
Heller's innovative, patented vacuum reflow solves the throughput bottleneck by shortening cycle times for maximum yield and minimal voiding. Experience the speed with us.
Heller Industries
Apple iPhone Fold Might Have A Sun Glare Problem
Apple plans its iPhone Fold with ultra-thin glass, CoE filters, and a liquid metal hinge to boost efficiency and durability. However, higher reflectance—seen in Samsung Galaxy S26 Ultra—may worsen glare, potentially impacting outdoor visibility.
wccftech
Today's Sponsor
Ormet-TLPS
Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Test Your Knowledge
What is the middle day of a non-leap year?
See answer below.
Industry Press
Indium Corporation Indium12.9HF Receives New Product Introduction Award
Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective ...
Indium Corporation
Europlacer Appoints Quiptech as Exclusive Partner in Mexico
Europlacer announced the appointment of Quiptech as its exclusive representative in Mexico. Through this partnership, Quiptech will promote Europlacer's ...
Europlacer
Aven Brings MicroVue™ 2.0 Inspection Power to Three SMTA Expos in April
Aven Tools announced its participation in three upcoming SMTA Expos & Tech Forums this April, where the company will feature live demonstrations of its MicroVue™ 2.0 ...
Aven Tools
Indium Corporation to Spotlight Thermal Innovations at Productronica China
As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase ...
Indium Corporation
AdvancedPCB Strengthens HDI Process Control in Chandler, AZ Facility
AdvancedPCB has expanded its high-density interconnect (HDI) quality inspection capabilities with the installation of the CIMS Phoenix MDI AOI system in its Chandler ...
AdvancedPCB
Coherix Will Showcase AI-Driven Dispensing Technology at April Open House
Coherix will host a two-day open house program at its new Innovation Center in Ann Arbor, Michigan. The event is designed to give manufacturing engineers ...
Coherix
SMTA Announces Program for 2026 Ultra High Density Interconnect Symposium
The SMTA is excited to announce the technical program for the 3rd annual Ultra High Density Interconnect Symposium which takes place on April 9, 2026 in Avondale ...
SMTA
MORE INDUSTRY PRESS
Master-Bond
Sponsor
Summit-Interconnect

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect
Quote of the Day
"A mind, once expanded by a new idea, never returns to its original dimensions."
Oliver Wendell Holmes
Sponsor
BEST-Inc.

Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
BEST Inc.
kyzen
Cartoon of the Day
Cartoon
"I have a question about workplace violence. I've been assaulted by a coworker's perfume."
Copyright © Randy Glasbergen
Sponsor
Schunk

What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK Electronic Solutions
Indium-Corporation
Test Your Knowledge Answer
What is the middle day of a non-leap year?
Answer: July 2