circuitnet
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Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Ask the Experts
Mixed Process Solder Joint Appearance, Smooth or Grainy?
We are using RoHS components that are placed using tin/lead solder paste and soldered in oven using a tin/lead reflow profile. What appearance should we ...
Responses by:
Georgian Simion
Engineering and Operations Management, Independent Consultant
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Mitch Holtzer
Director of Reclaim Business, Alpha Assembly Solutions
Kay Parker
Technical Support Engineer, Indium Corporation
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Tim O'Neill
Director of Product Management, AIM
T.J. Hughes
Manufacturing Engineer, Esterline Interface Technologies
Fritz Byle
Process Engineer, Astronautics
Tony Lentz
Field Applications, FCT Assembly
Greg York
Technical Sales Manager, BLT Circuit Services Ltd
Gary Freedman
President, Colab Engineering
What Caused SMT Pads to Oxidize After Reflow
Viscosity of Solder Paste Before Printing
Solder Splashing During Wave Soldering
ENIG Solderability Issues
Solder Paste Mixing
Recommended Solder Paste Aperture Configuration
Polyurethane Conformal and Acrylic Coating on the Same PCB
MORE ASK THE EXPERTS
Master-Bond
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Viscom

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Apr 5, 2027
APEX EXPO 2027
Global Electronics Association
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Viscom-SE
Sponsor
AI-Technology-Inc

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.
What Year Was It?
Nautilus Travels Under North Pole
What Year
The U.S. nuclear submarine Nautilus accomplishes the first undersea voyage to the geographic North Pole.
See the answer below.
Sponsor
Schunk

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK
kyzen
What Year Was It Answer
Nautilus Travels Under North Pole
Answer: August 3, 1958
August 3, 2026
image
China Taps US AI Models to Train Defense Systems
Chinese military researchers are using outputs from U.S. AI models, including OpenAI and Anthropic systems, to distill and train domestic AI for defense applications. The effort heightens concerns over IP theft, security risks and intensifying U.S.-China tech rivalry.
Taipei Times
Sponsor
Glenbrook-Technologies

Refurbished and Demo X-ray Inspection Systems
2024 Demo JewelBox-70T X-ray System and 2024 Demo JewelBox-100T X-ray System Refurbished & Demo Systems on sale with warranty. Learn more.
Glenbrook Technologies
A Huge Number of Data Centers are Set to be Built in the US, Despite Ongoing Issues
Data center expansion in the U.S. faces growing public opposition over energy, water, noise, and pollution concerns. Despite protests, AI demand drives rapid construction, with hundreds of facilities planned, though power shortages and climate challenges may delay some projects.
BGR
The Drawbacks of Internal Recycling Systems for Solder Dross
This paper examines the risks and hidden costs of in-house solder dross recycling, highlighting contamination, compliance, quality, safety, and economic challenges that often outweigh perceived savings.
Technical Paper
Energy efficiency as a key topic in electronics
Manufacturers boost energy efficiency across electronics and industry as power costs and regulations rise. At electronica 2026, companies will showcase semiconductor, power and connected solutions that reduce losses and improve performance.
Digitimes
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Inside the Luxury Robotaxi Uber, Lucid and Nuro Are Testing
Uber, Lucid Motors, and Nuro are testing the Lucid Gravity robotaxi ahead of a public launch later this year. The six-passenger autonomous vehicle combines Uber's ride platform, Nuro's AI technology, and Lucid's luxury EV design for future self-driving services.
CNET
Minimum Lead to Lead Spacing for Wave Soldered Through-Hole Components
What is the recommended minimum lead-to-lead spacing for through-hole components run through a wave soldering system? Jim Hall and Phil Zarrow, The Assembly Brothers, discuss this question and share their own suggestions.
Board Talk
Technical Papers
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
MORE TECHNICAL PAPERS
Sponsor
Rehm-Thermal-Systems-GmbH

"Flying" SMD Components
This paper deals with the fundamentals of heat transfer and the test procedures show how the SOD323 can be processed given a suitable selection of solder paste and oven settings. Read more.
Rehm Thermal Systems
Your fourth grader should not be worried about AI
AI fears have raised concerns about future jobs, but history shows technology creates opportunities alongside disruption. Experts argue AI will transform work rather than eliminate it, rewarding creativity, adaptability and skills that help humans complement emerging technologies.
Taipei Times
This Was The First Email Ever Sent Back In The '70s
Computer engineer Ray Tomlinson sent the first email in 1971, creating a communication tool that transformed digital interaction. His SNDMSG program introduced the @ symbol and email standards, paving the way for modern messaging despite early simplicity & security challenges.
BGR
Non-Contact Measurement of Conformal Coating Thickness
Conformal coating is designed to provide protection and long-term reliability to printed circuit boards (PCB) in harsh environments where high humidity, high temperature, corrosive gases, or salt spray may be present. This study aims to highlight the application of chromatic confocal microscopy (CCM), an optical technique used to characterize 2D/3D surfaces.
Technical Paper
Sponsor
Summit-Interconnect

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
June manufacturing sector indicator shows more growth
Taiwan's manufacturing sector gained momentum in June as AI infrastructure demand lifted electronics, server and networking orders. TIER reported stronger growth, while semiconductor-driven machinery demand offset tariff worries and geopolitical uncertainty.
Taipei Times
Hon Hai subsidiary begins commercial operations of 5MW AI cluster
Hon Hai's Visionbay.ai launched Taiwan's largest 5-megawatt AI cluster using Nvidia HGX B300 systems, with over 90% capacity utilized. The platform earned Nvidia Exemplar Cloud validation and aims to expand AI infrastructure across Asia-Pacific with Blackwell & Vera Rubin technologies.
Taipei Times
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution.
Technical Paper
Sponsor
BEST-Inc.

Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.
Amazon spent $1.8 million on a failed AI project, and didn't notice the overrun for five months
Amazon's AI expansion reveals rising cost challenges as projects exceed budgets due to unpredictable model usage. Internal reviews show failed initiatives and costly errors, prompting engineers to develop safeguards, tracking systems, and controls to better manage AI spending.
TechSpot
More Americans now support banning phones all day at school, not just in class
A Pew Research survey shows growing US support for school cellphone restrictions, with 77% backing classroom bans and 48% supporting all-day limits. Adults cite learning concerns, though parents worry about emergency communication and enforcement challenges across schools.
TechSpot
Sponsor
DL-Technology

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
Power Electronics Market Entering New Growth Phase
Power electronics companies are accelerating adoption of silicon carbide and gallium nitride technologies as EVs and AI data centers drive demand for efficient power solutions. Yole Group projects market growth through 2031, while suppliers expand capacity & diversify supply chains.
EE Times India
3D Aerosol Jet Printed Interconnects on Bare Die
Aerosol Jet Printing can provide many enhancements over traditional bare die attachment techniques. Previous studies have shown that AJ technology offers advantages in the millimeter wave frequency range, such as a significant reduction of insertion loss and the ability to design the line impedance as required.
Technical Paper
Pegatron chair says AI outlook remains strong, calls for Taiwan application push
Pegatron Chairman Tzu-hsien Tung remains confident in AI's long-term growth despite recent market volatility. He says strong industry fundamentals continue to fuel innovation, attract investment, and accelerate technology development across global markets.
Digitimes
Apple braces for "hundred-year flood" in component costs
Apple delivered a strong June quarter with solid hardware results, but rising memory costs, limited chip supplies, and AI investments pressure margins. The company manages higher expenses and evolving technology demands while pursuing growth.
Digitimes
Sponsor
kyzen

pH Employment in Electronic Cleaning
The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now.
KYZEN
We're raising our Apple price target, seeing plenty of good despite the memory crunch knocks
Apple beat quarterly revenue and profit expectations, but rising memory costs threaten future margins. Severe chip shortages continue pushing component prices higher, creating new challenges for the consumer tech leader despite strong demand across its product lineup.
CNBC
Today's Sponsor
ECD
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Test Your Knowledge
Mount Vinson Massif is the highest peak in which continent?
See answer below.
Industry Press
TopLine Ships JEDEC Matrix IC Trays and Waffle Packs from Stock
TopLine ships a complete range of JEDEC Matrix IC trays and Waffle Packs for a wide variety of components, from stock, eliminating long wait times for components, ...
TopLine
ViTrox Americas Welcomes Eric Cruz as Technical Support Engineer
ViTrox Americas is pleased to welcome Eric Cruz to its technical support team. Eric brings more than 20 years of experience in electronics manufacturing, including ...
ViTrox Americas
PSB Industries Introduces Remote Monitoring
PSB Industries is proud to announce its Remote Monitoring Service, giving customers direct OEM visibility, faster technical support, and a more proactive approach ...
PSB Industries
MIRTEC Opens New Dallas Sales & Demo Center to Strengthen Customer Support
MIRTEC is pleased to announce the opening of its new 'Sales and Demo Center, Dallas' to bring advanced inspection technology closer to North American manufacturers through ...
MIRTEC
Green Circuits Showcases.Solutions at Space & Missile Defense Symposium
Green Circuits will exhibit in Booth 905 at the 2026 Space & Missile Defense Symposium, taking place Aug. 11-13 at the Von Braun Center in Huntsville, Alabama. The Space ...
Green Circuits
Siemens and Arizona State University launch PCB design microcredential
Siemens, in collaboration with Arizona State University (ASU) announced a new online microcredential program in printed circuit board (PCB) design - 'PCB Design ...
Siemens
MORE INDUSTRY PRESS
Circuit-Technology-Center
Sponsor
EOS-ESDA-Association

PAE Certification – Oct 2-5, 2026
Advance your expertise with the ESDA Process Assessment Engineer (PAE) Certification at the 2026 EOS/ESD Symposium. Learn ANSI/ESD SP17.1 principles to assess and improve EOS/ESD processes.
EOS/ESD Association
Quote of the Day
To change the world we must be good to those who cannot repay us.
Pope Francis
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Circuitnet

Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
Plasma-Etch
Cartoon of the Day
Cartoon
"Even my GPS says I'm going nowhere!"
Copyright © Randy Glasbergen
Sponsor
Master-Bond

Low Outgassing, Glob Top Epoxy
Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates.
Master Bond
AI-Technology-Inc
Test Your Knowledge Answer
Mount Vinson Massif is the highest peak in which continent?
Answer: Antarctica. It is 16,050 feet (4.89 km) tall, 13 miles (21 km) long and 8 miles (13 km) wide. The mountain is named after Georgia Congressman Carl Vinson who emphatically promoted Antarctic exploration in the 1930s.