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Ask the Experts
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Tin Whiskers and Vapor Phase Reflow
Can we solder components with tin-plated leads using Sn63Pb37 solder paste in vapor phase reflow (215C) without a tin whisker reliability issue?
Responses by:
Tony Lentz Field Applications, FCT Assembly Brien Bush Manufacturing Applications Specialist, Cirtronics Corp.
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MORE ASK THE EXPERTS
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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What Year Was It?
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President Polk Declares War on Mexico
U.S. Congress overwhelmingly votes in favor of President James Polk's request to declare war on Mexico.
See the answer below.
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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What Year Was It Answer
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President Polk Declares War on Mexico Answer: May 13, 1846
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May 13, 2026
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Hackers attack Foxconn again, Apple doesn't appear to be at risk
Ransomware group Nitrogen breaches Foxconn’s Wisconsin facility, stealing up to 8TB of data, including engineering files tied to Intel, Google, and Nvidia. The attack disrupts operations but shows no clear evidence of compromising Apple product designs.
Apple Insider
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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
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IEEE Program Aims to Connect the Billions Who Are Still Offline
IEEE Future Networks’ Connecting the Unconnected program accelerates efforts to expand Internet access for over 2 billion people still offline. It supports innovations through global competitions, summits, and mentorship, advancing affordable connectivity solutions using emerging 5G, 6G, and community-driven technologies.
IEEE Spectrum
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Reliable drying of UV materials
Rehm Thermal Systems launches the RDS UV dryer to meet faster hardening demands, enabling efficient, eco-friendly UV coating for electronics and various industries.
Rehm Thermal Systems
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Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN
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‘Made in Europe’ is not going to be competitive
EU companies struggle to fund decarbonization amid high energy prices, Chinese overproduction and US tariffs. Policymakers debate subsidies versus protectionism, but heavy local-content rules risk higher costs, weaker competition and strained global partnerships, despite efforts to support clean industrial transition.
Taipei Times
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Fill the Void
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding.
Technical Paper
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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
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Taiwan should look beyond manufacturing in AI era: Nobel economist
Nobel laureate Peter Howitt said AI will accelerate automation, permanently reducing manufacturing jobs while shifting employment toward services. He urged governments, including Taiwan, to invest in education and retraining as innovation drives “creative destruction” across economies.
Taipei Times
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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
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In the AI Era, Trust Scarcity Is Rewriting the Rules of Brand Growth
AI is shifting competition from capturing attention to earning trust, according to Gartner’s Amy Abatangle. She says brands must prioritize credible human perspectives, expert validation and community advocacy to boost discoverability, customer preference and sustainable growth in an AI-saturated content landscape.
Gartner
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Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
Apple’s reported chipmaking deal with Apple and Intel could reduce reliance on TSMC, strengthen Intel Foundry’s position, and advance U.S. semiconductor strategy as AI-driven demand reshapes advanced manufacturing economics and global competition.
EE Times
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AI Delivers Faster, Actionable DRC Closure for Complex SoC Designs
AI-driven workflows are reshaping SoC verification as advanced 2 nm chip designs generate billions of DRC violations. New tools use AI grouping, incremental debugging and collaborative workflows to accelerate error resolution, improve traceability and shorten tapeout cycles for complex semiconductor projects.
EE Times
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Speed That Scales With You
High-throughput 10-head MC388HS pick and place machines built for accuracy at high-speed—helping you scale production without compromising placement quality.
Manncorp Inc.
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7 Reasons Your Company Isn’t Profiting With AI, and How to Fix That
Companies are pouring billions into generative AI, but most struggle to see meaningful returns. Reports from MIT and BCG reveal that the vast majority of businesses gain little or no value from AI investments, with only a small fraction achieving substantial results.
Entrepreneur
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Test Your Knowledge
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What term describes the increase in the resistance of a conductor caused by the tendency of current to concentrate at the conductor surface?
See answer below.
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Industry Press
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Semitech Named Authorized Distributor for NVE Corporation Isolator Products
Semitech announced that it has been appointed an authorized distributor of isolation products from NVE Corporation, a publicly traded U.S.-based manufacturer ...
Semitech
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AIM to Highlight Low Silver REL61 Alloy at SMTA Ciudad Juárez Expo
AIM Solder is pleased to announce its participation in the upcoming SMTA Ciudad Juárez Expo and Tech Forum. This event takes place May 21 at Injectronics Convention ...
AIM Solder
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Datest Expands Southwest Presence with PAC Global Representation
Datest is pleased to announce a new partnership with PAC Global, who will now represent Datest throughout Texas and key regions of Mexico. Because when ...
Datest
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KIC & E-tronix Webinar on Automatic Profiling for Modern SMT Manufacturing
KIC in partnership with E-tronix, will host a live technical webinar on May 19 titled "Automatic Profiling: Why Aren't You Using It Yet?" The webinar will examine how ...
KIC
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Absolute EMS Expands Support for LEO, MEO & GEO Satellite Programs
Absolute EMS, Inc. continues to grow its presence in the satellite sector, supporting programs across low Earth orbit (LEO), medium Earth orbit (MEO), and ...
Absolute EMS
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BGA Tech Expands Inspection Capabilities with Creative Electron TruView™
BGA Technology has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility. The new ...
BGA Technology
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Titanium Tubes & Rods Revolutionize Electronics Manufacturing Systems
In the rapidly evolving world of industrial electronics manufacturing, precision, corrosion resistance, and long-term reliability are no longer optional, they are essential. ...
M-Kube Enterprise Pty Ltd
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MORE INDUSTRY PRESS
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Quote of the Day
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"Never doubt that a small group of committed citizens can change the world. Indeed it is the only thing that ever has." Margaret Mead
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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| Cartoon of the Day
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"Our legal department wants us to download their new software. It translates gobbledygook to mumbo jumbo."
Copyright © Randy Glasbergen
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What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK Electronic Solutions
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Test Your Knowledge Answer
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What term describes the increase in the resistance of a conductor caused by the tendency of current to concentrate at the conductor surface? Answer: Skin Effect. The electric current flows mainly at the "skin" of the conductor, between the outer surface and a level called the skin depth.
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