circuitnet
Sponsor
Glenbrook-Technologies

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies
Ask the Experts
D-PAK With Exposed Copper
The D-PAK shown was trimmed to avoid overhanging the edge of the PCB. This has exposed copper. Is this a defect for a class III?
Responses by:
Amit Bahl
Director of Sales and Marketing, Sierra Circuits
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Guy Shemesh
General Manager, ePiccolo Engineering
Cleanliness Testing
Hand Sanitizer Contamination
Epoxy Wicking up Wire Insulation
Out-gassing and Cleaning
Contamination From Anti-static Foam
Organic Flux Residue Concerns
Lifted Lead on SOT Component
MORE ASK THE EXPERTS
Viscom-SE
Sponsor
Essegi-Automation

From Slave to Master: flexible ISM integrations
ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow.
Essegi Automation
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Alltemated
Sponsor
DL-Technology

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology
What Year Was It?
The First Earth Day
What Year
Earth Day, an event to increase public awareness of the world's environmental problems, is celebrated in the United States for the first time.
See the answer below.
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Circuit-Technology-Center
What Year Was It Answer
The First Earth Day
Answer: April 22, 1970
April 22, 2026
Jim Cramer says Tim Cook accomplished something ‘almost impossible’ as Apple CEO
Jim Cramer praised Tim Cook for building Apple into the greatest consumer enterprise, boosting its stock about 1,900%, deepening customer loyalty, and expanding services. He said Cook transformed Apple into a more predictable, premium business before John Ternus succeeds him.
CNBC
Sponsor
Indium-Corporation

Your Award-Winning Cored Wire
Our industry-leading, award-winning range of flux-cored wire solder solutions meet the diverse needs of both manual soldering, and rework and robotic soldering applications.
Indium Corporation
Apple’s elevation of silicon head Johny Srouji signals sprint to build in-house chips for all devices
Apple names John Ternus CEO and promotes Johny Srouji to chief hardware engineer, reinforcing its in-house silicon strategy. The company advances custom chips for AI-era devices, tightening hardware-software integration and reducing reliance on external suppliers.
CNBC
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
As electronics are increasingly used in automotive and other high reliability applications, ensuring durability is critical. This paper explores a 'crack-free' flux paste designed to inhibit cracking in harsh environments while meeting stringent surface insulation resistance and ...
Technical Paper
Tenstorrent Previews Large Compute Cluster, Generates Video Faster Than Real Time
Tenstorrent previewed its new cluster-scale system by running a Wan2.2-14B video generation demo that produced a 720p, five-second clip from text in three seconds, claiming up to 10× faster performance on optimized BlackHole-based Galaxy servers with 256 chips.
CNBC
Sponsor
SEHO

Wave Soldering Processes Rethought
As a pioneer in the development of automated soldering technologies, SEHO is setting global standards today more than ever with outstanding features. Find out more.
SEHO Systems GmbH
What to Consider Before You Accept a Management Role
As an engineering manager at Clorox, writer learns a promotion is a role change. Without training, they struggle as impact shifts from personal coding output to indirect team results, leading them to revert to writing code.
IEEE Spectrum
Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Technical Paper
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
Plasma-Etch

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
Tim Cook turned Apple into a $4 trillion juggernaut by not trying to be Steve Jobs
Tim Cook leaves Apple after 15 years, growing market value from $350 billion to $4 trillion through operational discipline, supply chain strength, and services expansion, while navigating tariffs and China dependence, passing leadership to John Ternus.
CNBC
Apple Eyes Product Engineering Revival with CEO Transition
Apple will appoint hardware chief John Ternus as CEO on Sept. 1, replacing Tim Cook, who becomes executive chairman. The transition signals a shift toward product-led innovation, stronger AI integration, and continued in-house silicon development driving future devices.
EE Times
Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
We make electronics equipment used in corrosive environments. Do you recommend the use of HASL versus immersion gold for our application? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Samsung plans NAND expansion at P5 on AI-driven price gains
AI-driven demand for NAND flash is surging, pushing prices sharply higher and triggering new investments by Samsung and SK Hynix. Tight supply, delayed capacity expansion, and rising storage needs are expected to sustain elevated pricing and market momentum.
Digitimes
The Changing ASICs Landscape: the Shift Toward Chip Disaggregation
AI is transforming ASIC design by driving system-specific architectures and multi-die disaggregation. Engineers now prioritize cross-domain collaboration, advanced packaging, and reusable IP to balance performance, cost, and complexity, shifting development toward holistic, ecosystem-driven approaches rather than traditional monolithic chip design.
EE Times
Developments of the X-ray Inspection Technology for PCBAs
This paper provides an overview of some of the latest technical developments in the X-ray inspection technology for the electronics industry.
Technical Paper
Sponsor
kyzen

Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
KYZEN
ESSCI and UPLC Ink Strategic Pact to Transform Uttar Pradesh into a Global Semiconductor and Electronics Hub
ESSCI and UPLC sign a landmark MoU to boost electronics and semiconductor skills in Uttar Pradesh. ESSCI will lead training programs, while UPLC connects institutions and supports a Centre of Excellence to address talent gaps and future industry needs.
BIS Infotech
Apple incoming CEO John Ternus faces a defining challenge: Fixing the company’s AI strategy
Apple enters a pivotal transition as John Ternus replaces Tim Cook, facing investor pressure to strengthen its AI strategy. While iPhone sales remain strong, Ternus must accelerate AI innovation, navigate supply challenges, and define Apple’s future beyond hardware dominance.
CNBC
Sponsor
BEST-Inc.

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
Taiwan has more than 260,000 job vacancies, with manufacturing accounting for 32.4%
Taiwan’s AI servers and advanced chip sectors fuel manufacturing growth, maintaining a stable workforce despite 85,000 openings. Most roles are full-time, but talent shortages, demographic pressures, and competition from semiconductor firms lengthen hiring times across industries.
Digitimes
Structural Electronics for Automotive Interiors
This project evaluates structural electronics for automotive interior use. The car interior application is back-seat-control-panel and the structural electronics.
Technical Paper
Exclusive: US battery push faces EV headwinds, but energy storage boom offers relief
Slowing US EV demand has strained battery ventures, but booming energy storage needs—driven by AI power consumption, subsidies, and import restrictions—are tightening lithium cell supply and creating new opportunities, especially for South Korean firms expanding into cost-effective LFP battery production.
Digitimes
Who is John Ternus, the incoming Apple CEO?
After 15 years, Tim Cook will hand Apple’s leadership to John Ternus on September 1. A longtime hardware leader, Ternus now faces steering the company’s future, including AI competition and advancing products like the Vision Pro.
TechCrunch
Sponsor
Summit-Interconnect

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect
5 Major Brands That Are Actually Owned By Apple (And What Changed After The Acquisition)
Apple marked its 50th anniversary by highlighting how strategic acquisitions—from NeXT and Siri to Beats and Shazam—fueled its rise. The company continues investing in AI and software, using past deals to shape its ecosystem, services growth, and future innovations.
BGR
Today's Sponsor
Ormet-TLPS
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Test Your Knowledge
Which one of these structures is the oldest: Taj Mahal, Leaning Tower of Pisa, Tower of London
See answer below.
Industry Press
AIM to Highlight Cost-Saving Low Silver REL61 Alloy at SMTA Wisconsin Expo
AIM Solder is pleased to announce its participation in the upcoming SMTA Wisconsin Expo and Tech Forum. This event takes place May 5 at the Crowne Plaza Milwaukee ...
AIM Solder
TM Soldering Solutions Launches PHOENIX Selective Soldering Platform
TM Soldering Solutions, the re-born successor to ACE Production Technologies, has re-emerged in the PCB assembly industry with new and better technology and most ...
TM Soldering Solutions
Automated Production Equipment Launches Fully-Redesigned Website
Automated Production Equipment, or A.P.E announced the launch of its newly redesigned website, APE.com—delivering a more connected, content-driven experience ...
Automated Production Equipment
KOKI Solder Launches 2026 Webinar Series on SMT Process Optimization
What if your solder paste, your cleaning process, and your inspection strategy weren't treated as separate conversations—but as one connected system? KOKI Solder America ...
KOKI Solder America
SMTA Adds New Dr. Jennie Hwang Pinnacle Award to "Members of Distinction"
The SMTA is proud to announce the addition of the Dr. Jennie Hwang Pinnacle Award to its esteemed Members of Distinction Program. Established in collaboration with Dr. Jennie ...
SMTA
RBB Expands Facility to Support Continued Growth and Increased Production
RBB has expanded its facility by 3,500 square feet to support continued growth and increasing customer demand. The added space provides flexibility to streamline ...
RBB
MORE INDUSTRY PRESS
Aim-Solder
Sponsor
Smart-Sonic

Safe and Effective Cleaning with 440-R
VOC-free stencil cleaning chemistry! Cleans any solder paste from any fine-pitch stencil when used as part of the Smart Sonic stencil cleaning process. Learn more.
Smart Sonic
Quote of the Day
"The first rule of any technology used in a business is that automation applied to an efficient operation will magnify the efficiency. The second is that automation applied to an inefficient operation will magnify the inefficiency."
Bill Gates
Sponsor
SEIKA-America

McDry Ultra-Low Humidity Storage Cabinets
McDry dry cabinet for MSL components and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages.
Seika
AI-Technology-Inc
Cartoon of the Day
Cartoon
"Global warming is a good thing - more hot prospects, no more frozen assets!"
Copyright © Randy Glasbergen
Sponsor
Intraratio-Corporation

Unlock Operational Success with Insights from Global Leaders
4-part series focused on achieving excellence while facing the operational challenges of advanced electronics and SMT manufacturing. No registration required.
Intraratio
Plasmatreat-GmbH
Test Your Knowledge Answer
Which one of these structures is the oldest: Taj Mahal, Leaning Tower of Pisa, Tower of London
Answer: Tower of London is the oldest structure built in 1078. Taj Mahal was built between 1631 and 1648 and the Leaning Tower of Pisa was built in 1173.