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ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
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Ask the Experts
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Class 3 Pin Contact Question
I am working on a class 3 product. We have an assembly from one operation that has a tinned pin. The pin is inserted into ...
Responses by:
Leo Lambert Vice President, Technical Director, EPTAC Corporation Dr. Craig D. Hillman CEO & Managing Partner, DfR Solutions Richard D. Stadem Advanced Engineer/Scientist, General Dynamics
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MORE ASK THE EXPERTS
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Keeley Pedals Perfected with Manncorp
Keeley Electronics revolutionizes production with Manncorp pick & place machines, achieving unprecedented speed, precision, and innovation in the guitar pedal industry.
Manncorp Inc.
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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What Year Was It?
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FDR Gives First Fireside Chat
President Franklin D. Roosevelt gives his first national radio address or "fireside chat," broadcast directly from the White House.
See the answer below.
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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
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What Year Was It Answer
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FDR Gives First Fireside Chat Answer: March 12, 1933
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March 13, 2026
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The Silicon Hegemon
Taiwan dominates the semiconductor industry, producing about 92% of the world’s most advanced chips. Led by Taiwan Semiconductor Manufacturing Company, its pure-play foundry model powers global tech firms while driving AI growth, even as energy limits and geopolitical tensions threaten this critical supply-chain hub.
EE Times
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Investigation of Overprinting BGA Pads
The added benefit of using overprinting stencil design strategy is that this should compel further improvement in paste transfer efficiency and uniformity by raising its area ratio. In this study the circle shape overprint apertures were designed for 0.5mm pitch BGA land patterns that measured to an area ratio value of 0.70.
Technical Paper
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Beyond Bandwidth: The Industry is Striving for Custom Memory (Part 2)
Chipmakers are developing custom memory to push AI performance beyond standard HBM4E. Companies including Marvell Technology, Samsung Electronics, Micron Technology, SK Hynix, Global Unichip Corp., and imec are advancing architectures that boost bandwidth, efficiency, and capacity for next-generation AI accelerators.
EE Times
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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40 Years of Wireless Evolution Leads to a Smart, Sensing Network
The upcoming 6G era will transform connectivity beyond speed, creating a universal data fabric where millions of agents collaborate across digital and physical worlds. Building on 1G–5G evolution, 6G will fundamentally reshape how devices, networks, and applications interact, advancing system-wide intelligence.
IEEE Spectrum
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From Slave to Master: flexible ISM integrations
ESSEGI AUTOMATION's ISM software integrates with 250+ brands, connecting ERP, MES, WMS, Pick & Place and X-Ray systems. Flexible logic allows it to operate as master or slave in any production flow.
Essegi Automation
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Honor flagship phone to launch in Taiwan by 2Q26, shaking up market
Honor plans to enter the Taiwanese smartphone market in 2026 by opening retail stores and selling phones and accessories. Its flagship Honor Magic8 Pro has received certification from Taiwan’s National Communications Commission and could launch as early as the second quarter.
Digitimes
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X-ray Rentals & Rent-to-Own
Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
Glenbrook Technologies
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Meta designs four in-house chips to power data centers
Meta Platforms unveiled plans for four generations of in-house artificial intelligence chips as it expands data center infrastructure. The move aims to strengthen control over AI hardware, improve performance efficiency, and support rapidly growing AI workloads across its platforms.
Digitimes
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Blow Holes After Switching from Lead-Free HASL to ENIG
After switching our PCB finish from lead-free HASL to ENIG blow holes started occurring in the solder joints of the through-hole LEDs. The PCBs and LEDs are from the same suppliers as before, only the finish changed.
Board Talk
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Pegatron Eyes 10-fold AI Server Growth
Pegatron Corp said it plans to grow AI server revenue more than tenfold this year, driven by demand for Nvidia GB300 server platform systems and cloud clients. Shipments are expected to rise quarterly, though near-term margins may face pressure from infrastructure investments.
Taipei Times
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Apple's Foldable iPhone Just Got Its Most Convincing Leak Yet
Apple's foldable iPhone looks closer to launch as new CAD renders reveal a book-style design resembling a mini tablet. The leak aligns with earlier reports, hinting at a possible fall debut as Samsung begins producing Apple’s crease‑reduced foldable displays.
CNET
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Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom
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Why AI Chatbots Agree With You Even When You're Wrong
AI researchers warn that chatbots often display "sycophancy," agreeing with users even when they're wrong. Studies from OpenAI and Anthropic tie the issue to training methods, raising safety concerns, lawsuits, and efforts to build more critical models.
IEEE Spectrum
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| Today's Sponsor |
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| Sponsor |
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Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect
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Test Your Knowledge
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What science deals with the motion of projectiles?
See answer below.
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Industry Press
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Indium Experts to Present Solder & Thermal Management Solutions at APEX
Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics at APEX 2026, March 17-19, in Anaheim, California. ...
Indium Corporation
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Rehm Thermal Systems Strengthens Its Presence in Asia at Spring Trade Fairs
Electronics manufacturing is increasingly shaped by smart factory concepts, e-mobility, and the continuous expansion of 5G infrastructure. As requirements ...
Rehm Thermal Systems
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TopLine® Offers Custom 'Super-Sized' BGA
When you need bigger, only bigger will do. So where do you go if it's not off-the-shelf? TopLine can help. TopLine Corporation announces the availability of custom ...
TopLine Corporation
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Transition Automation Introduces Innovative Advancements
Transition Automation, Inc. is announcing two new product advancements designed to improve SMT printing performance and extend squeegee life: Laser-Enhanced ...
Transition Automation, Inc.
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TAGARNO Responds to Growing Conformal Coating Inspection Demands
TAGARNO is seeing significant growth in demand for its digital microscopy systems as electronics manufacturers increase their use of conformal coating across a range ...
TAGARNO
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Renesas Announces General Availability of Renesas 365
Renesas Electronics Corporation announced the general availability of Renesas 365, Powered by Altium, an intelligent, model-based platform that integrates ...
Renesas Electronics Corporation
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AIM Solder Promotes Timothy O'Neill to Vice President of Technology
AIM Solder is pleased to promote Timothy O'Neill to Vice President of Technology, effective March 1, 2026. In this newly created role, O'Neill will unify Research ...
AIM Solder
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MORE INDUSTRY PRESS
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| Sponsor |
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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
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Quote of the Day
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"One machine can do the work of fifty ordinary men. No machine can do the work of one extraordinary man." Elbert Hubbard
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| Sponsor |
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Use of Numerical Simulation Methods
The use of numerical methods has now become widespread. The implementation of these methods helps to minimize development costs by reducing the number of required prototypes. Download now.
Rehm Thermal Systems GmbH
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| Cartoon of the Day
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"It's supposed to be inspirational, but most employees see it as permission to take a nap."
Copyright © Randy Glasbergen
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Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
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Test Your Knowledge Answer
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What science deals with the motion of projectiles? Answer: Ballistics
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