circuitnet
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AI-Technology-Inc

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
Ask the Experts
Baking After Cleaning Hand Placed Parts
Is baking required after in-line cleaning an assembly with moisture sensitive parts that were hand placed instead of through an SMT machine?
Responses by:
Georgian Simion
Engineering and Operations Management, Independent Consultant
Mike Konrad
President, Aqueous Technologies
Paul Austen
Senior Project Engineer, Electronic Controls Design Inc
Terry Munson
President/Senior Technical Consultant, Foresite
Carlos Bouras
General Manager, Nordson SELECT
Mark Waterman
M.O.L.E. Line Product Manager, Electronic Controls Design, Inc. (ECD)
Tod Cummins
Director of Corporate Quality Assurance, Delta Group Electronics Inc.
Question About IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Coils Rotated After Reflow
Stencil Pattern for Thermal Pads on QFNs
Component Shifting
What Is Causing Connectors to Bow?
Cleaning No-Clean Solder Paste
Solder Paste Alloy Check
MORE ASK THE EXPERTS
Uyemura
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Apr 5, 2027
APEX EXPO 2027
Global Electronics Association
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Viscom-SE
Sponsor
Plasma-Etch

Plasma Clean, Etch and RIE in One Machine
The PE-100 convertible allows you to perform plasma cleaning, isotropic etching and reactive ion etching(RIE) in the same system!
Plasma Etch
What Year Was It?
Armstrong Walks on the Moon
What Year
American astronaut Neil Armstrong, 240,000 miles from Earth, speaks these words to more than a billion people listening at home: "That's one small step for man, one giant leap for mankind."
See the answer below.
Sponsor
Air-Vac-Engineering

High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
Glenbrook-Technologies
What Year Was It Answer
Armstrong Walks on the Moon
Answer: July 20, 1969
July 20, 2026
image
Hon Hai Eyes Production at Texas Site
Hon Hai will begin small-scale AI server production in Texas within two months, using Nvidia-powered humanoid robots for assembly. The company is also expanding US smart factories and overseas high-tech parks to strengthen global supply chains.
Taipei Times
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
SpaceX Awards Foxconn A Part In A Huge $52 Billion Order For 13,000 Racks Of NVIDIA GB300 AI Servers, Where Each Rack Costs $4 Million And The Total Order Spans Nearly 1 Million GPUs
SpaceX reportedly awarded Foxconn a $52 billion order for about 13,000 NVIDIA GB300 AI server racks, with deliveries starting in Q4 2026. The deal strengthens Foxconn's AI server ambitions, breaks the Dell-Supermicro dominance, and supports SpaceX's expanding AI infrastructure.
wccftech
Maintenance: The Basics of Cleaning Series Part 4
This article is the fourth and final part of the series titled "The Basics of Cleaning". In this final chapter, some of the common mistakes in maintenance cleaning applications found in electronic assembly operations will be covered and a summary of the entire series.
Technical Paper
How Growing Companies Lose the Clarity That Made Them Successful — and How It Hurts Your Customers' Experience
Companies begin with a clear mission to solve problems differently, messaging and customer experiences. In the early stages, founders keep every customer-facing decision aligned, creating a consistent, intentional experience driven by a shared vision rather than coordination.
Entrepreneur
Sponsor
DL-Technology

Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
Data center projects drawing increasing pushback worldwide
Governments are competing to attract AI data centers, but public opposition is rising over land, power, water and environmental impacts. Protests, lawsuits and new regulations worldwide are forcing leaders to balance AI expansion with community concerns.
Taipei Times
Low-Voiding High-Reliability Lead-Free Solder Paste for Automotive
A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology. This technology demonstrates the combined merits of each constituent solder powder in the paste. DFHR is based on Sn-Ag-Cu alloy system and contains bismuth (Bi), indium (In), and antimony (Sb).
Technical Paper
Technical Papers
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
MORE TECHNICAL PAPERS
Sponsor
EOS-ESDA-Association

PAE Certification – Oct 2-5, 2026
Advance your expertise with the ESDA Process Assessment Engineer (PAE) Certification at the 2026 EOS/ESD Symposium. Learn ANSI/ESD SP17.1 principles to assess and improve EOS/ESD processes.
EOS/ESD Association
Here's What A Data Center Actually Does (Besides Use Electricity And Water)
AI data centers power models with high-performance hardware but consume much more electricity and water than traditional facilities. Communities challenge rising resource demands, utility costs and impacts as AI infrastructure expands worldwide.
BGR
iPhone owners hit 87% loyalty rate this year, Android-to-iPhone switching drops to 12%
A CIRP survey shows Apple strengthened iPhone user loyalty in 2026, with 87% of buyers upgrading from older iPhones and only 12% switching from Android. The findings suggest most smartphone users remain committed to their preferred mobile platform.
TechSpot
iNEMI Board Assembly –Press-Fit Technology Roadmap
A press-fit roadmap team including press-fit manufacture, OEM/ODM and EMS are getting together every two years to identify the future technology trend, future technical challenges and needs and then to find potential solution for next 5 to 10 years in the horizon.
Technical Paper
Sponsor
Master-Bond

Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates. Download the TDS.
Master Bond
New Material Beats Copper's Thermal Conductivity
UCLA and Argonne researchers unveiled theta-phase tantalum nitride, a metal with 1,100 W/m-K thermal conductivity, nearly three times copper's. Its atomic structure cuts electron-phonon interactions, improving heat transfer for advanced electronics.
EE Times
Xi calls for global cooperation on AI
At the World AI Conference, Xi Jinping urged global cooperation on AI governance and opposed control by any single nation. China promoted human-centered regulation while showcasing advanced AI models and technologies to boost AI leadership ambitions.
Taipei Times
Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk
Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Taiwan to keep best TSMC tech despite US push
Taiwan pledged to keep TSMC's most advanced chip technology at home after the company unveiled another US$100 billion for Arizona. Officials cited new domestic fabs, infrastructure investment and steady semiconductor growth to strengthen global leadership.
Taipei Times
Japan's first national AI factory will use 27,500 GPUs across 382 Vera Rubin racks
Nvidia will build a 140MW AI factory with Japan's Noetra consortium to power FRONTia robotics. The Rubin-based facility will train multimodal AI models, boost Japan's physical AI infrastructure, and support its push to lead the AI robotics market.
TechSpot
Sponsor
BEST-Inc.

J-STD-001 Solder Training Kit
BEST's IPC J-STD-001 Revision H-J training kit features circuit boards representing actual soldering conditions including multilayer boards with challenging thermal conditions.
BEST Inc
Apple, Nvidia vie for title of world's most valuable company
Apple briefly overtook Nvidia as the world's most valuable company before Nvidia reclaimed the top spot by market close. Apple's 2026 rally, driven by AI optimism, product launches and analyst upgrades, has outpaced Nvidia as investors shift toward memory and infrastructure stocks.
CNBC
Study of Lead-Free Solder Materials for Power Module Packaging Assembly
This study focused on the thermal fatigue performance and the microstructural evolution of five lead-free solders under harsh service conditions.
Technical Paper
U.S.-China AI feud sees ASML walk tightrope between sales and geopolitics
ASML expects China to drive about 20% of 2026 sales as chipmakers expand equipment purchases despite export curbs. The company navigates strong AI demand while facing U.S. pressure to tighten restrictions and manage growing geopolitical risks.
CNBC
How a quality management system identifies suspect counterfeits
Counterfeit electronic parts are spreading as AI demand and supply shortages fuel risks. ERAI reported a 25% rise in suspect parts in 2024, threatening critical industries and prompting companies to improve testing, sourcing, and prevention measures.
Sourceability
Sponsor
Viscom

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom
Apple lawsuit targets OpenAI's AI hardware ambitions
Apple has sued OpenAI, alleging trade secret theft, highlighting a broader battle over AI access points. As large language models become increasingly similar, competition is shifting from model capabilities to controlling the devices and platforms through which users interact with AI.
Digitimes
Today's Sponsor
ECD
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Test Your Knowledge
Arrange these computer-related inventions in chronological order: Silicon Chip, Floppy Disk, Microchip
See answer below.
Industry Press
SMTA Announces Expansion of Advanced Electronics Assembly Conf. into Asia
The SMTA announced the Advanced Electronics Assembly Conference (AEAC) is expanding to Asia through a new partnership with the Thailand Printed Circuit Association ...
SMTA
AdvancedPCB Strengthens Leadership with Promotion of Patrick York
AdvancedPCB has promoted Patrick York to General Manager of its Chandler, Arizona, manufacturing facility. York will be reporting to Ruben Zepeda, Chief Operations Officer ...
AdvancedPCB
Eutect will be exhibiting for the first time at productronica India 2026
Eutect GmbH will be exhibiting for the first time at productronica India 2026. By participating in one of India's most important trade shows for electronics development ...
Eutect GmbH
PROMATION Highlights Why Manufacturers Choose Its Smart Line Solutions
PROMATION USA highlights the key advantages driving increased adoption of its Smart Line technology among SMT manufacturers. Designed to improve ...
PROMATION USA
Sharpen Selective Soldering Skills with Kurtz Ersa's VERSAFLOW Training
Kurtz Ersa Inc. will host two VERSAFLOW 4/55 training courses July 27–31 at its U.S. headquarters, located at 1779 Pilgrim Road in Plymouth, Wisconsin. The training ...
Kurtz Ersa Inc.
RBB to Showcase Flexible Assembly Solutions at Two SMTA Expos in August
RBB will exhibit at two upcoming SMTA regional events this August: the Michigan Expo & Tech Forum on August 18, 2026, and the Ohio Valley Expo & Tech Forum ...
RBB
Siemens and Cloudberry VC collaborate to accelerate European innovation
Siemens announced a collaboration between Siemens Cre8Ventures and Cloudberry VC to help accelerate commercialization of Europe's sovereign deep-tech innovation ...
Siemens
MORE INDUSTRY PRESS
Nordson-ASYMTEK
Sponsor
kyzen

Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
KYZEN
Quote of the Day
The best way to predict the future is to invent it.
Alan Kay
Sponsor
Summit-Interconnect

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Zestron
Cartoon of the Day
Cartoon
"I've hit the glass ceiling so many times, my hair smells like Windex."
Copyright © Randy Glasbergen
Sponsor
Circuitnet

Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
Circuit-Technology-Center
Test Your Knowledge Answer
Arrange these computer-related inventions in chronological order: Silicon Chip, Floppy Disk, Microchip
Answer: Microchip (1958), Silicon Chip (1961), Floppy Disk (1970)