circuitnet
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Ask the Experts
Cleanliness Standards for Electronic Components
I work as a supplier engineer in our automotive division and we are very concerned about cleanliness for electronic components. We have a very stringent ...
Responses by:
Paul Austen
Senior Project Engineer, Electronic Controls Design Inc
Doug Pauls
Principal Materials and Process Engineer, Collins Aerospace
Karthik Vijay
Technical Manager - Europe, Indium Corp.
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Kishan Sarjoo
Process Engineering Manager - Electronics, Altech UEC, South Africa
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Baking Concerns for Stacked Trays of Components
Cleanliness Requirement for Populated Printed Boards
Flux Residue During Pin-in-Paste
Storage To Prevent Corrosion
Manual or Automated Assembly?
Soldering Station Calibration
Exposed Copper Risk
MORE ASK THE EXPERTS
Glenbrook-Technologies
Sponsor
Circuit-Technology-Center

Engineering Changes Don’t Have to Slow You Down
When design updates demand precision and speed, trust the rework technicians at Circuit Technology Center to get it done right the first time.
Circuit Technology Center
Industry Calendar
Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA
Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Master-Bond
Sponsor
AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
What Year Was It?
Rabin and Arafat Sign Accord
What Year
Israeli Prime Minister Yitzhak Rabin and PLO Chairman Yasser Arafat reached agreement in Cairo on the first stage of Palestinian self-rule.
See the answer below.
Sponsor
Manncorp

Outsourcing Costs More Than You Think
Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability.
Manncorp Inc.
Nordson-ASYMTEK
What Year Was It Answer
Rabin and Arafat Sign Accord
Answer: May 4, 1994
May 5, 2026
Andy Jassy says Amazon investors will be rewarded by all its AI spending
Andy Jassy defends Amazon’s massive AI investment, saying it will reward investors long term. He calls AI the biggest technology shift, dismisses cash flow concerns, and predicts AWS-like returns once infrastructure spending drives future revenue and profits.
CNBC
Sponsor
Intraratio-Corporation

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio
SEC and Elon Musk agree to settle lawsuit over Twitter buyout in 2022
US Securities and Exchange Commission agreed to settle a lawsuit against Elon Musk over delayed disclosure of his Twitter stake, with his trust paying a $1.5 million civil penalty. The agreement awaits final court approval.
CNBC
The Economics of Electronic Component Salvage and Reuse
This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips.
Technical Paper
A government used AI to write its AI regulations. It did not go well
South Africa's communications minister Solly Malatsi withdraws a draft national AI policy after discovering AI-generated fake academic citations Officials will revise the bill introduce human oversight and pursue accountability while retaining most policy proposals following public consultation concerns.
TechSpot
Sponsor
SEHO

Simply Double the Production Volume
SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more.
SEHO Systems GmbH
AI Accelerator Spec Maintains Rapid Update Pace
UALink consortium updates its accelerator interconnect spec within a year, adding in-network compute, chiplet support, and improved manageability to boost AI workload performance, reduce latency, and enable scalable, modular data center fabrics for faster training and inference efficiency.
EE Times
Trouble With Skewed DPAK Components
We are having trouble with surface mount DPAC components skewing during reflow. We checked our profile and tried a diagonal hatch aperture.
Board Talk
Technical Papers
Scaling SMT Traceability
The Drawbacks of Internal Recycling Systems for Solder Dross
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
MORE TECHNICAL PAPERS
Sponsor
BEST-Inc.

Want High-Quality BGA Reballing?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.
The chip industry is booming again, but only for companies building AI infrastructure
Silicon wafer shipments rise 13.1% year-on-year as AI-driven data center demand surges, while PC and smartphone markets weaken. Chipmakers redirect capacity toward memory and computing chips, signaling a recovery in industrial semiconductors despite uneven consumer demand.
TechSpot
3 Companies You Might Not Realize Are Owned By Foxconn
Foxconn supplies electronics for Apple, Google and gaming consoles, and uses AI growth to diversify, producing half of AI servers and boosting sales. It owns Sharp and Belkin, including Linksys, while facing competition and US regulatory scrutiny.
BGR
Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders
This paper focuses on the effects of sustained high temperatures on the high strain rate of doped lead-free solders operating between -65°C to 200°C.
Technical Paper
Sponsor
DL-Technology

Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology
Big tech is finally under the microscope
England has introduced a school mobile phone ban after political pressure, reflecting growing concern about tech companies. Evidence of harms to children’s learning and development is driving global restrictions and a shift toward more precautionary regulation.
Taipei Times
AI cannot replace real teachers
Education evolves in the AI era as students access knowledge online and through AI tools. Teachers shift from information delivery to emotional guidance, emphasizing communication, problem-solving, and human interaction, while training programs prioritize interpersonal skills and emotional intelligence.
Taipei Times
The Effect of Strain Rate on the Ductility of Bismuth-Containing Solders
In this paper the authors report some preliminary results from a wider study of the effects of bismuth on the properties and behaviour of solder alloys.
Technical Paper
Sponsor
Rehm-Thermal-Systems-GmbH

"Flying" SMD Components
This paper deals with the fundamentals of heat transfer and the test procedures show how the SOD323 can be processed given a suitable selection of solder paste and oven settings. Read more.
Rehm Thermal Systems
Two Hon Hai-built satellites launched from US into orbit
Hon Hai launched its second-generation PEARL-1A and PEARL-2B satellites from California, placing them in low Earth orbit to verify Ka-band inter-satellite communication, ionospheric monitoring, and payload technologies, while advancing Taiwan-US collaboration and future constellation design capabilities.
Taipei Times
Manufacturing activity picks up
Taiwan’s manufacturing sector expanded at its fastest pace in over three years as PMI jumped to 60.3, driven by Middle East tensions pushing raw material costs, pre-emptive orders, and strong AI and semiconductor demand, though growth remains uneven across industries.
Taipei Times
Sponsor
kyzen

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN
Gartner Highlights Three Building Blocks for Autonomous Supply Chain Future
Chief supply chain officers must build autonomous-ready operations, intelligence, and workforce capabilities to manage volatility and gain advantage, Gartner says. The shift moves beyond automation to AI-guided, outcome-based decisions, with humans overseeing and refining machine-driven supply chain actions.
Gartner
Reservoir Printing in Deep Cavities
Guidelines for stencil designs and aperture placement in cavities are presented, including stencil design, paste material, experimentation, and results.
Technical Paper
The Oscars just declared that AI actors and AI-written scripts can't win awards
The Academy of Motion Picture Arts and Sciences bans AI-generated performances and scripts from Oscar eligibility, requiring human actors’ consent and human-authored screenplays, as concerns grow over digital resurrections and AI actors like Tilly Norwood and past experimental AI films.
TechSpot
Industrial Control Systems Manufacturer Eliminates Stockouts
Nexus Automation and Control Systems adopted MRPeasy to manage complex multi-level bills of materials, replacing spreadsheets and reducing inventory errors. The software improved purchasing accuracy, eliminated stockouts and overstocking, and streamlined operations across its industrial automation manufacturing projects.
EE Times
Sponsor
Summit-Interconnect

Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect
Manufacturing Steady in April as Inflation and Iran War Weigh In
U.S. manufacturing expanded for a fourth straight month in April, with PMI holding at 52.7%, despite surging input costs and geopolitical tensions. Rising prices, slowing production, and continued job cuts highlight mounting pressure, even as demand and overall economic growth persist.
EE Times
Today's Sponsor
Plasmatreat-GmbH
Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Test Your Knowledge
What's the better-known identity of minus 273.15 degrees Celsius?
See answer below.
Industry Press
EPTAC Expands. New HQ in Salem, NH Draws Industry Leaders
EPTAC has opened its new corporate headquarters and training facility in Salem, New Hampshire, expanding its capacity to support workforce development across ...
EPTAC
Datest to Host SPEA Webinar on Accelerating Test Development
Datest is set to host the second installment of its 2026 educational webinar series, titled "Streamlining Test Development: From CAD to Production-Ready Test ...
Datest
Space-Qualified PCB Market to Surpass USD 4.04 billion by 2033
According to Growth Market Reports, the global market size for Space-Qualified Printed Circuit Boards (PCBs) reached USD 2.13 billion in 2024, with a robust ...
Growth Market Reports
Transition Automation Discusses Impact of Squeegees on SMT Print Assembly
Transition Automation, Inc. is highlighting a simple but often overlooked truth in SMT printing: in high-precision SMT assembly, the length of the squeegee directly impacts ...
Transition Automation, Inc.
EMI Expands Inspection Capabilities with Its Second TRI 3D AXI System
Express Manufacturing, Inc. (EMI) has added a new TR7600FB SII from Test Research, Inc., further strengthening its inspection capabilities for complex, high-reliability ...
Express Manufacturing, Inc. (EMI)
TAGARNO Relaunches FHD Microscope Line
TAGARNO announced the relaunch of its Full HD (FHD) microscope product line. The refreshed portfolio introduces enhanced imaging performance, updated model ...
TAGARNO
MORE INDUSTRY PRESS
Indium-Corporation
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Quote of the Day
"Time moves in one direction, memory in another."
William Gibson
Sponsor
Plasma-Etch

3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
Viscom-SE
Cartoon of the Day
Cartoon
"I'm writing about all the things I ought to do before I die. It's my oughtobiography."
Copyright © Randy Glasbergen
Sponsor
Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
ECD
Test Your Knowledge Answer
What's the better-known identity of minus 273.15 degrees Celsius?
Answer: Absolute Zero is the lowest temperature theoretically possible, at which the motion of particles that constitute heat would be minimal.