June 17, 2026

China Has Made A Supercomputer Work Without A GPU — Here's How China has unveiled LineShine, a domestically developed CPU-only supercomputer that delivers 1.54 exaflops using 2.45 million Arm-based cores. By replacing GPUs with advanced vector and matrix extensions, it advances China’s self-reliance goals despite trailing top Western systems in efficiency and AI throughput. BGR

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

Intel begins production of most-advanced chip, inching closer to possible Apple deal Intel has started risk production of its advanced 18A-P chip process, marking a key milestone in its foundry turnaround strategy. The company aims to attract major customers, including potentially Apple, by improving performance, efficiency, yields, and advanced packaging capabilities. CNBC

Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly. Technical Paper

Qualcomm wants to be the chip inside whatever replaces your smartphone, and it just announced two products toward that end Qualcomm is accelerating its push beyond smartphones, developing more than 40 AI wearable designs while launching new mixed-reality and smart-glasses platforms. The company aims to power next-generation AI devices with stronger on-device processing, advanced tracking, and easier hardware development. TechSpot

Sponsor vCONNECT: Your Next Level of Digital Connectivity Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News. Viscom SE

Poland pursues Taiwan investments to end role as assembly hub Poland is courting major Taiwanese investment to transform its economy, with Foxconn planning a US$1 billion EV project and potential semiconductor partnership. The government aims to build a high-tech manufacturing ecosystem, reduce supply-chain risks and strengthen Europe’s strategic technology capabilities. Taipei Times

Reliability of Copper, Gold, Silver and PCC Wirebonds Under Operation In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented. Technical Paper

Technical Papers ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support MORE TECHNICAL PAPERS

Sponsor X-Ray Inspection Verifies Quality of Complex PCBs A Netherlands-based PCB supplier relies on real-time X-ray inspection to ensure the quality of HDI, hybrid, multi- layer, flex-rigid & other complex boards. Glenbrook Technologies

Tech glitch cause of social media lock-outs: MODA Meta acknowledged that a technical glitch in its new age-verification system mistakenly suspended Facebook, Instagram, and Threads accounts worldwide. Taiwan’s digital ministry urged rapid account restoration, stronger verification safeguards, and improved user protections as affected users gradually regained access. Taipei Times

Self-driving tech supplier Mobileye targets U.S. robotaxi launch in 2027 Mobileye will launch its own robotaxi service in a major U.S. city in 2027, starting with 100 vehicles and targeting 17,000 within five years. The move expands its autonomous-driving ambitions while intensifying competition with Waymo, Zoox, Tesla, and other rivals. CNBC

Adiabatic & Isothermal Humidification for Electronics Manufacturing The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed. Technical Paper

Sponsor Outsourcing Costs More Than You Think Delays, tariffs, and uncertainty come with overseas PCB assembly. In-house production with Manncorp delivers faster builds, tighter control, and long-term stability. Manncorp Inc.

The Best Phones for Every Budget - 2026 Update Rising memory and storage costs have pushed up prices for many smartphones, but strong value options remain available. The guide highlights the Google Pixel 10a and iPhone 17e, praising their affordability, long-term software support, capable performance, and competitive feature sets. TechSpot

After resurrecting an iconic PC brand, Commodore is getting into flip phones Retro gaming YouTuber Christian Simpson is reviving Commodore by imagining products the original company might have built. After selling 30,000 modernized Commodore 64 computers, his team is launching the $499 Callback 8020 flip phone, blending nostalgia with a simpler alternative to smartphone overuse. The Verge

Maximum Board Temperature During Tin-Lead IPC discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. How is this temperature was determined? Board Talk

Sponsor Removal/Milling of Underfilled Parts: AVX1000M High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more. Air-Vac Engineering

RISC-V Silicon in the Jungle Could Save the Amazon Brazilian researchers unveiled the Internet of Trees, a RISC-V-based sensor network designed to monitor the Amazon in real time. Using biodegradable, ultra-low-power devices and edge AI, the project aims to track biodiversity, detect threats, support carbon markets, and build a digital twin of the rainforest. EE Times

Samsung reportedly moves closer to 5nm-class MRAM as TSMC advances its roadmap Samsung Electronics has developed a key 5nm-class magnetoresistive RAM (MRAM) cell technology, marking rapid progress just four months after unveiling its 8nm-class MRAM. The breakthrough strengthens Samsung’s position in next-generation memory and could accelerate high-performance, low-power semiconductor applications. Digitimes

Sponsor Training for Certified IPC Specialists BEST's 7711 Training Rework Kit is designed for certification/re-certification of Certified IPC Specialists (CIS) so employees can be tested for speed, accuracy and quality. BEST Inc

Qualcomm CEO says AI agents will replace apps — as chip giant works on 40 new AI-powered devices Qualcomm CEO Cristiano Amon says the company is developing more than 40 AI-powered wearable designs, from smart glasses to camera-equipped earbuds. He predicts AI agents will reshape apps, drive new device categories, and push demand for more efficient chips. CNBC

Impact of BGA Escape Trace Design on Performance of Solder Joint In this paper, a comprehensive study is presented to demonstrate the impact of different BGA escaping trace design cases on solder joint reliability. Technical Paper

Here we go again: Supply chain thinks iPhone Fold will ship in 2027, not 2026 Apple’s foldable iPhone plans appear to face fresh delays, as suppliers Largan Precision and Xinrixing hint at rescheduled product timelines. Industry reports suggest Apple may postpone the iPhone Fold’s launch or shipment from late 2026 into 2027 amid ongoing production challenges. Apple Insider

The Numbers Don't Lie: Reading the Global EMS Data for 2025 Global EMS data shows AI-driven demand lifting markets while Europe falls 2.9% amid sharp West declines. Despite job cuts and insolvencies, 42% of firms lift margins, revealing a split industry balancing resilience with structural strain. Global Electronics Association

Sponsor Low Outgassing, Glob Top Epoxy Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates. Master Bond

PCB prices are up 40% in a month because of a material most people have never heard of A shortage of high-purity PPE resin from Saudi Arabia's Jubail complex disrupts global PCB production, drives board prices higher, and tightens electronics supply chains. Analysts warn prolonged shortages could lift costs and delay output of critical tech hardware. TechSpot