March 10, 2026

Why Automakers are Overhauling the Corner Office From early 2025 to 2026, nine major automakers across Europe, the United States, Japan and South Korea replaced their CEOs, signaling more than routine succession and highlighting an industry-wide reckoning as carmakers confront uncertain technology shifts and strategic futures. Digitimes

Sponsor AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives 240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity. AI Technology, Inc.

VIEWPOINT 2026: Michael Sivigny, General Manager, CeTaQ Americas As we look toward 2026, CeTaQ Americas remains committed to our core conviction: "If you don't measure, you don't know." With the continued push for reshoring and domestic manufacturing—driven in part by the evolving tariff landscape—the need for localized, hyper-efficient production is paramount. Our outlook for 2026 ... CeTaQ Americas

Understanding Solder Dross: Causes and Control Strategies This article outlines the main contributors to dross formation, examines how alloy refining methods play a role, and explores practical ways to reduce dross through process control and equipment optimization. Technical Paper

How Cross-Cultural Engineering Drives Tech Advancement A robotics engineer says cross-cultural experience leads to better engineering decisions. Lessons from work and study in India and the U.S. show that blending efficiency with rigorous validation boosts collaboration and builds reliable real-world automation. IEEE Spectrum

Sponsor Maximize Yield with Patented Vacuum Reflow Heller's innovative, patented vacuum reflow solves the throughput bottleneck by shortening cycle times for maximum yield and minimal voiding. Experience the speed with us. Heller Industries

Gartner Identifies Three Pillars for Deriving Value from AI Gartner survey finds only one in five AI and analytics leaders worry uncertain costs will limit AI value, yet just 44% of organizations use financial guardrails. Analysts urge clearer AI ambition, stronger foundations and workforce skills. Gartner

Electrochemical Reliability as a Function of Component Standoff The purpose of this paper is to research the activity of flux residues as a function of the standoff height using insulation resistance. Technical Paper

Technical Papers ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies ■ Optimizing BGA Rework: Challenges, Techniques and Quality Control MORE TECHNICAL PAPERS

Sponsor Affordable Excellence - iS6052 AOI The latest addition to Viscom's esteemed lineup of AOI systems. This new system offers a compelling option for manufacturers looking to enhance their PCB inspection processes. Viscom

How Business‑Led Diplomacy and Fragile Geopolitics Shape the Transatlantic Tech Ecosystem Transatlantic tech ties remain strong despite political friction. Rising U.S.–EU investment, defense startups, space cooperation and semiconductor supply chains deepen links, but surging energy needs, AI expansion and rival industrial policies strain the partnership. EE Times

Oracle is building yesterday's data centers with tomorrow's debt OpenAI has reportedly halted plans to expand its partnership with Oracle's Stargate data center in Abilene, Texas, favoring access to newer Nvidia chips elsewhere. Rapid AI chip upgrades highlight risks for data center investments and Oracle's debt-driven infrastructure expansion. CNBC

Finding the Cause of Cold Solder Joints We have problems with our wave soldering system, especially cold solder joints. Could this be caused by using a selective soldering frame? Board Talk

Sponsor Introducing our new Board to Board Connectors These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling. Advanced Interconnections Corp

Apple Is Preparing A Wave Of 'Ultra' Products To Launch In 2026 Apple may expand its premium branding with a new "Ultra" lineup across devices, according to Mark Gurman. Future iPhone, MacBook, AirPods, and iPad models could adopt the label, offering advanced technologies and higher prices while Apple continues maintaining its existing Pro lineup. BGR

You Weren't Born to Blend In — Here's Why the Best Leaders Are the Ones Who Stand Out Leaders gain influence by standing out, not blending in. Effective leadership requires challenging assumptions, offering distinctive perspectives and acting on overlooked ideas. Clear vision, authenticity and the courage to differentiate drive advancement in today's business landscape. Entrepreneur

Quantifying Environmental Life Cycle Impacts for ICT Products This paper describes a simplified approach for estimating the environmental impact of Information and Communications Technology (ICT) products. Technical Paper

Sponsor Simply Double the Production Volume SEHO SelectLine features the award-winning Synchro and SmartSplit production modes that allow to halve cycle times in batch production and mixed operation. Find out more. SEHO Systems GmbH

Six Trends Driving 3D IC Innovations in the AI Era Rising AI computing demand is outpacing traditional chip scaling, pushing the semiconductor industry toward complex 3D ICs. Engineers adopt system-level co-optimization, advanced cooling, co-packaged optics and AI-driven design tools to sustain. EE Times

The long game of Rick Tsai: from TSMC's darkest hour to the AI era In November 2008, TSMC CEO Dr. Rick Tsai faced a dire crisis as global finance collapsed. Chip orders evaporated, fab utilization plunged below 40%, and the world’s leading semiconductor manufacturer fought to survive amid unprecedented market turmoil. Digitimes

Sponsor 440-R + Ultrasonics = Safe & Efficient Cleaning Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, misprints & SMD adhesives. Smart Sonic

Tesla builds a car with no steering wheel. Now what? Tesla's first Cybercab rolled out at Gigafactory Texas, showcasing a fully autonomous taxi without a steering wheel or pedals. Elon Musk says production begins in April, but regulators and critics question safety, sensor strategy, and readiness for public roads. Fox News

Cavity Board SMT Assembly Challenges This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success. Technical Paper

This startup wants to build data centers inside floating offshore wind platforms Startup Aikido Technologies proposes floating offshore wind platforms that host AI data centers inside turbine structures, using North Sea water for cooling. The concept could supply power, space and cooling while easing pressure on land grids. TechSpot

Space launches are changing the chemistry of Earth's atmosphere, studies warn. Here's what can be done A surge in satellite launches and atmospheric reentries is altering the upper atmosphere, scientists warn. Burning spacecraft release metals and soot that may deplete ozone and heat the stratosphere, prompting calls for reusable satellites and a circular space economy. Phys.org

Sponsor Optimizing BGA Rework: Challenges, Techniques and Quality Control The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more. BEST Inc.

Samsung Electronics retains global TV market lead for 20 years Samsung Electronics secured its 20th consecutive year as the world’s largest TV maker in 2025, capturing a 29.1% global market share and dominating the premium segment with 54.3%, while planning new OLED, Micro RGB, and Neo QLED launches. The Korea Times