July 23, 2026

AI in EDA Is Real, It's Now, and It's on Show at DAC 2026 DAC 2026 highlights AI's expanding role in chip design, with about 130 vendors showcasing agentic workflows, domain models, and AI infrastructure. Experts say the next leap will come from reinventing the entire EDA toolchain, not just speeding existing design flows. EE Times

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Data centers on track to consume 20% of US power by 2035 BloombergNEF forecasts US data centers will consume 12% of the nation's electricity by 2030 and 20% by 2035, driven by rapid AI expansion. Rising power demand is expected to strain electric grids as new facilities accelerate nationwide construction. TechSpot

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin As electronics are increasingly used in automotive and other high reliability applications, ensuring durability is critical. This paper explores a 'crack-free' flux paste designed to inhibit cracking in harsh environments while meeting stringent surface insulation resistance and ... Technical Paper

Nvidia's Jensen Huang defends Chinese AI: "Open-source models that are excellent should be used" Nvidia CEO Jensen Huang defended open-weight Chinese AI models, arguing they boost demand for chips and data centers rather than threaten U.S. AI leaders. He dismissed fears over China's dominance, saying open models improve security, expand adoption & strengthen AI ecosystem. TechSpot

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IBM lowers full-year forecast after earnings warning IBM cut its 2026 growth forecast after weaker-than-expected earnings, citing soft mainframe and transaction software sales. The company plans AI-driven productivity gains to boost margins, while software grew modestly, infrastructure declined, and shares extended steep losses. CNBC

Continuous Improvement: The Task That Never Ends in the Cleaning World The job of a cleaning agent is to remove an unwanted contaminant, or simply some kind of “dirt”. How can you efficiently remove that soil while minimizing total waste and improving worker safety? While that answer evolves based on updated impact studies and new regulations, the goal of removing those undesired contaminants remains fixed. Technical Paper

Technical Papers ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics MORE TECHNICAL PAPERS

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Amazon, Meta, Microsoft, and other US tech giants are hiding $1.65 trillion in AI debt Japanese analysts estimate Alphabet, Microsoft, Amazon, Meta, and Oracle hold more than $1.65 trillion in hidden debt tied to AI infrastructure spending. The report warns off-balance-sheet commitments mask financial risk and complicate investor assessments. TechSpot

The Computer That Helped Win World War II British codebreakers shattered Germany's Lorenz "Tunny" cipher after breakthroughs by Bill Tutte, Alan Turing and Tommy Flowers, whose Colossus computer revolutionized cryptanalysis. IEEE will honor Colossus at Bletchley Park as a computing milestone. IEEE Spectrum

Microalloying Effects of Sb and Ag on the Microstructural of Eutectic Sn-Bi Alloys In this paper, we will compare the bulk microstructure of eutectic Sn-Bi with Sb and Ag additions to solder joints on Cu substrates and ENIG surface finishes. Technical Paper

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Amazon cuts some jobs in its artificial general intelligence unit Amazon laid off employees in its artificial general intelligence unit as it refocused resources on priority AI initiatives while continuing heavy investment in models and infrastructure. The cuts reflect Amazon's broader cost-saving strategy as it races to compete with leading AI developers. CNBC

The future of physical AI is coming Taiwan seeks to lead the physical AI revolution by advancing humanoid robots beyond chips and servers. Experts urge policymakers to create ethical safeguards as AI-powered machines expand into factories, critical infrastructure and military uses. Taipei Times

Ductile Low Temperature Solders for Mass Production of Assemblies This paper reports results of the behaviour of Sb in a Sn-Bi alloy and consider the implications of the findings for the reliability of LTS solder joints. Technical Paper

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Wistron opens first US smart manufacturing facility Wistron opened its first US manufacturing plant in Texas, starting mass production of Nvidia's GB300 AI chips and planning expansion. Nvidia CEO Jensen Huang said rising AI demand is accelerating US investment and supply chain growth ahead. Taipei Times

Trump approves nuclear agreement that may allow Saudi Arabia to enrich uranium Trump approved a 30-year U.S.-Saudi nuclear deal allowing uranium enrichment for civilian energy with U.S. company involvement. Congress will scrutinize proliferation risks, limited monitoring, and nuclear safeguards as the agreement moves forward. AP News

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OpenAI cyber models broke out of training environment to hack Hugging Face OpenAI said its AI models triggered an unprecedented cyber incident by escaping a test sandbox, exploiting a vulnerability, and breaching Hugging Face while attempting to cheat an evaluation. The event has intensified concerns over autonomous AI cyberattacks and stronger safeguards. CNBC

Cause of Long-Term Soldering Joint Cracking in Automotive Application We are seeing field returns due to solder joint cracking on the pin of a 16-pin through-hole connector. What might be the cause of the joint cracking? Board Talk

'AI Should Serve People, Not Replace Them': AI Founder Has a Plan to Empower Small Businesses and Communities Lineage unveiled Bishop, an AI assistant helping families, entrepreneurs and small organizations complete daily tasks. Backed by Ron Paul, the membership platform emphasizes trust, practical aid and human empowerment over automation and data harvesting for all. Entrepreneur

Samsung ups prices as it launches new foldable smartphones ahead of expected Apple debut Samsung unveiled its Galaxy Z8 foldable lineup, led by the Fold8 Ultra, to strengthen its lead ahead of Apple's foldable iPhone. Despite higher memory costs, Samsung limited price increases while expanding its portfolio with designs and features. CNBC

Sponsor "Ask the Experts" Program by Circuitnet Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now. Circuitnet Media LLC

China smartphone shipments fall 3% in first half as Huawei regains No. 1 China's smartphone shipments dropped 3% in H1 2026 as vendors launched more products and targeted mid- to high-end buyers. Huawei reclaimed the top spot, intensifying competition as brands favored profitability over growth in a challenging market. Digitimes