July 27, 2026

How to Source Hard-to-Find Electronic Components During Shortages Companies can cut production risks with resilient sourcing before shortages emerge. AI demand reshapes capacity and inventory, requiring manufacturers to secure memory, advanced passives, and interconnects as semiconductor categories remain stable. Sourceability

Sponsor Reflow Solderable TIM1 Thermal Grease AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology, Inc.

Taiwan's Foxconn says driverless technology coming sooner than expected Foxconn predicts Level 4 autonomous driving will become viable sooner as reliability improves rapidly. The company expects broad adoption by 2040, advancing EV technologies and partnerships to make autonomy a competitive advantage over hybrids. Taiwan News

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Intel Foundry Improves Execution, but External Customers Remain the Test Intel's manufacturing recovery gained momentum as Foundry revenue rose to $5.8 billion and losses narrowed through improved yields and efficiency. However, external customer revenue remained limited, leaving Intel still needing major foundry wins beyond its own chip production. EE Times

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

Industrial PC orders rise on edge AI demand Industrial PC vendors are experiencing stronger orders as edge AI and physical AI applications expand beyond data centers into factories and other environments. The sector enters a new growth cycle, driven by rising demand for intelligent systems across industrial markets. Digitimes

Protecting the Reliability and Integrity of Electronic Products and Assemblies The COVID-19 crisis has prompted increasing inquiries on how to disinfect electronic equipment and assemblies without detrimental impact on the electronics. Technical Paper

Technical Papers ■ Flux-Free, Reliable, Efficient: Soldering with Formic Acid ■ Redesigning Material Logistics for High-Mix EMS Production ■ Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education ■ Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You ■ Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse ■ Digital Warehouse Automation in High-Mix PCB Assembly ■ Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics MORE TECHNICAL PAPERS

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Why Are Data Centers Moving Into Rural Areas? AI data centers are expanding into rural U.S. communities as tech companies seek cheaper land, power, and water resources. Residents worry these facilities will strain utilities, increase costs, harm farmland, create pollution, and damage local environments over time. BGR

Optical Tech Would Update a Robot's AI on the Fly Cornell researchers developed an optical receiver that directly writes AI model data into memory using light-based QR-like signals. The technology could reduce energy costs in AI systems by replacing power-hungry data links and enabling faster communication for edge devices. IEEE Spectrum

Selective Solder Paste Printing for BGA Components Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? The Assembly Brother, Phil Zarrow and Jim Hall, discuss this topic and share their own experiences. Board Talk

Sponsor Electrically Insulative, Low Viscosity Epoxy Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist. Master Bond

Nvidia locks down memory supply from SK Hynix as part of $500 billion AI deal Nvidia secured a major AI memory supply agreement with SK Hynix, supporting next-generation processors and data centers. The partnership, potentially worth $500 billion, expands AI infrastructure investment while addressing growing demand for high-bandwidth memory. CNBC

OpenAI and Apple heat up AI hardware; Anthropic stands apart Anthropic is sharpening its AI strategy by prioritizing specialized AI capabilities over consumer platform expansion. The company advances targeted innovation and model development to strengthen its leadership with focused AI solutions now. Digitimes

High-Speed 3D Surface Imaging Technology in Electronics Manufacturing This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution. Technical Paper

Sponsor Plasma Etch PE-Avenger The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal. Plasma Etch

Musk's bad week: Tesla suffers worst slump since 2022, SpaceX drops ahead of Starship test flight Tesla shares suffered their steepest weekly decline since 2022 after weak earnings and heavy AI-related spending, while SpaceX stock extended post-IPO losses. The combined sell-off erased about $130 billion from Elon Musk's fortune amid investor concerns over profitability and growth. CNBC

The Biggest Obstacle For Data Centers Isn't Locals, It's Heat Waves - Here's Why Rising heatwaves are fueling opposition to AI data centres as communities challenge energy use, water demand and local warming. Protests have delayed £130 billion in projects, pushing governments to tighten rules on future AI infrastructure. BGR

Sponsor 5 Keys to Component Lead Tinning Success Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering. BEST Inc.

Nvidia is challenging 20 years of datacenter CPU design with its new Vera chip Nvidia unveils its Vera CPU with custom Olympus cores to challenge x86 datacentre processors. Designed for AI workloads, Vera boosts single-thread performance, memory bandwidth and latency, targeting the $200 billion CPU market as a growth engine. TechSpot

Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint. Technical Paper

Nvidia, Microsoft, Meta warn against 'premature restrictions' of open-weight models Nvidia, Microsoft, Meta and 20+ tech firms urge policymakers to protect open-weight AI models, warning broad limits could curb competition, slow innovation and aid overseas rivals. They favor targeted security laws over sweeping bans on AI risks. CNBC

Demand for AI Computing Is So High That Apple Is Redesigning Every Mac It Sells Apple is redesigning nearly its entire Mac lineup as AI demand drives shortages and delays for Mac mini and Mac Studio orders. Upcoming models include the first touchscreen OLED MacBook Pros, refreshed entry-level MacBook Pros and new iMacs, following recent price increases. Entrepreneur

Sponsor Reclaim Your Factory's Future Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability. Nordson Electronic Solutions

Wistron's Texas AI factory shows why US manufacturing still needs Taiwan Wistron opens its D1 AI smart factory in Fort Worth, Texas, starting the first US mass production of Nvidia GB300 compute boards. The facility strengthens AI manufacturing, grows Wistron's reach and showcases Taiwan’s role in advanced electronics. Digitimes