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Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates. Download the TDS.
Master Bond
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BGA Solder Ball Collapse
Do lead free solder balls collapse the same amount as tin-lead solder balls? ...
Responses by:
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Ray Prasad
President, Ray Prasad Consultancy Group
Fritz Byle
Process Engineer, Astronautics
Rodney Miller
Capital Equipment Operations Manager, Specialty Coating Systems
Robert Freid
President and Founder, Contract Manufacturing Consultants, Inc.
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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What Year Was It?
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The day was Aug 27. What year was it?
Krakatau Explodes
The most powerful volcanic eruption in recorded history occurs on Krakatau, a small, uninhabited volcanic island located west of Sumatra in Indonesia.
See the answer below.
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More than just hot air
Rehm's Vision series Convection Soldering Systems ensure reliable, high-quality electronics production by using precise heat transfer and customizable options for maximum efficiency.
Rehm Thermal Systems
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What Year Was It Answer
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Krakatau Explodes
Answer: August 27, 1883
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Will Foldable Phones Make Tablets Obsolete?
Foldable phones offer tablet-like displays in pocketable designs, but high prices, durability concerns, shorter battery life and limited multitasking keep them from replacing tablets. Until manufacturers make foldables more affordable, larger tablets will remain the practical choice.
BGR
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Digital Warehouse Automation in High-Mix PCB Assembly
High mix SMT production demands full material visibility. This white paper shows how ASTER improved traceability, inventory accuracy and FIFO control through integrated automation and reel-level tracking across warehouse operations.
Technical Paper
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Foxconn eyeing likely investment in Gujarat
Foxconn is scouting more than 200 acres near Sanand, Ahmedabad, to establish a technology park and high-end electronics manufacturing facility. Gujarat has offered customized incentives as the company evaluates locations, potentially strengthening the state's electronics ecosystem.
The Times of India
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Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? Jim Hall and PHil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences and knowledge.
Board Talk
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High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
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Global economy 'storm-tossed' between crises and AI opportunity
IMF chief Kristalina Georgieva said the global economy remains resilient despite energy shocks, inflation, debt and trade wars. She warned that renewed oil price increases could worsen inflation, while AI investment provides a powerful economic boost but creates risks.
Taipei Times
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From Days to Minutes: Accelerating 3D IC Debug with Agentic AI
Agentic AI is transforming semiconductor debugging by automating failure analysis, root-cause identification, fix proposals, and verification. ChipAgents reports reducing complex root-cause cycles from days to 15–60 minutes, helping engineers tackle increasingly intricate 3D IC designs.
EE Times
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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Why Automation Is Essential to Achieve EU CRA Compliance
The EU Cyber Resilience Act will affect far more products than many companies expect, including legacy connected hardware and software. Manufacturers must assess risks, implement security measures, manage vulnerabilities, and plan support periods for products sold in Europe.
EE Times
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A New NASA Design Turbocharges Nuclear Spacecraft
NASA and General Atomics engineers propose a synchronal bimodal nuclear rocket combining high-thrust nuclear thermal propulsion with continuous electric power. The design could cut crewed Mars missions to 335 days while reducing engineering and astronaut health challenges.
IEEE Spectrum
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Accelerating Silicon Design for Physical AI
Physical AI demands heterogeneous architectures that balance real-time performance, power, security, and scalability. The eBook offers architects guidance on inference sizing, hardware-rooted trust, and monolithic versus chiplet designs while reducing integration risks.
EE Times
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom
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| Today's Sponsor |
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Test Your Knowledge
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What was the first turbocharged car?
See answer below.
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| Industry Press |
Plasmatreat Sets Course for Future Requirements
With an expanded technology portfolio, Lukas and Magnus Buske and their teams are positioning Plasmatreat to meet future demands in industrial surface treatment. ...
Plasmatreat GmbH
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Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026
Koh Young Technology will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026, at the Center of Excellence Building within Binghamton ...
Koh Young Technology Inc.
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PCEA Launches Designer Career Day at PCB West 2026
PCB West this year will debut Designer Career Day, a free program targeted at students, graduates, and anyone interested in careers in PCB design and design engineering, ...
Printed Circuit Engineering Association, Inc.
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BTU Introduces High-Yield Reflow Technologies for Advanced Packaging at SEMICON Taiwan
BTU International, Inc. will showcase its latest high-yield reflow technologies at SEMICON Taiwan in Booth I2516, with a focus on advanced packaging and other high-density ...
BTU International, Inc.
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SCHMID Group N.V. reports H1 2026 Financial Results and Updates Full-Year 2026 Guidance
SCHMID Group N.V. reports its unaudited financial results for the first half of 2026, covering the period ended June 30, 2026, and adjusts its full-year 2026 guidance. Arthur ...
SCHMID Group N.V.
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Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL at SEMICON Taiwan 2026
Nordson Electronics Solutions introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level ...
Nordson Electronics Solutions
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MORE INDUSTRY PRESS
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"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
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Quote of the Day
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"Fail often so you can succeed sooner."
Tom Kelley, Ideo partner
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| Cartoon of the Day
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"Of course I can accept criticism. Who should we criticize first?"
Copyright © Randy Glasbergen
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Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology
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Test Your Knowledge Answer
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What was the first turbocharged car? Answer:
Oldsmobile F5
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