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Master-Bond

Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates. Download the TDS.
Master Bond
Ask the Experts
BGA Solder Ball Collapse
Do lead free solder balls collapse the same amount as tin-lead solder balls? ...
Responses by:
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Ray Prasad
President, Ray Prasad Consultancy Group
Fritz Byle
Process Engineer, Astronautics
Rodney Miller
Capital Equipment Operations Manager, Specialty Coating Systems
Robert Freid
President and Founder, Contract Manufacturing Consultants, Inc.
ESD Ground Wire Gauge
Conformal Coating Press Fit Connectors
Recommended Fiducial Shape
PCBA Inspection Process Causing Damage
Can a Few Contaminated Joints Cause an Assembly to Fail RoHS Compliance?
MORE ASK THE EXPERTS
ECD
Sponsor
Circuit-Technology-Center

Stop Guessing. Repair Circuit Boards with Confidence.
This guidebook provides proven methods to improve workmanship, enhance reliability, and help technicians perform repairs in accordance with IPC standards.
Circuit Technology Center
Industry Calendar
Oct 1, 2026
Long Island Expo & Tech Forum
SMTA
Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA
Oct 25, 2026
SMTA International Conference & Exposition
SMTA
Oct 27, 2026
NEPCON ASIA 2026
Reed Exhibitions
Apr 5, 2027
APEX EXPO 2027
Global Electronics Association
FULL INDUSTRY CALENDAR
Ormet-TLPS
Sponsor
Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
What Year Was It?
The day was Aug 27. What year was it?
Krakatau Explodes
What Year
The most powerful volcanic eruption in recorded history occurs on Krakatau, a small, uninhabited volcanic island located west of Sumatra in Indonesia.
See the answer below.
Sponsor
Rehm-Thermal-Systems-GmbH

More than just hot air
Rehm's Vision series Convection Soldering Systems ensure reliable, high-quality electronics production by using precise heat transfer and customizable options for maximum efficiency.
Rehm Thermal Systems
Viscom-SE
What Year Was It Answer
Krakatau Explodes
Answer: August 27, 1883
Aug 27, 2026
image
Will Foldable Phones Make Tablets Obsolete?
Foldable phones offer tablet-like displays in pocketable designs, but high prices, durability concerns, shorter battery life and limited multitasking keep them from replacing tablets. Until manufacturers make foldables more affordable, larger tablets will remain the practical choice.
BGR
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
North American EMS Orders Surge in July as Book-to-Bill Stands at 1.29
North American EMS demand surged in July, lifting the book-to-bill ratio to 1.29 as bookings jumped 44.3% year over year. Shipments fell 0.3% year over year, but YTD shipments rose 6.2%, signaling stronger orders and potential sales growth ahead.
Global Electronics Association
Digital Warehouse Automation in High-Mix PCB Assembly
High mix SMT production demands full material visibility. This white paper shows how ASTER improved traceability, inventory accuracy and FIFO control through integrated automation and reel-level tracking across warehouse operations.
Technical Paper
Apple Suppliers Diverge in 1H26: Lens Profit Halves on Rising Memory Costs, Luxshare Revenue Jumps 40%
Apple suppliers are feeling the memory squeeze differently. Lens Technology’s profit plunged as costs weakened demand, while Luxshare's revenue jumped 40% by diversifying into automotive and AI data centers, highlighting the value of broader markets.
TrendForce
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Foxconn eyeing likely investment in Gujarat
Foxconn is scouting more than 200 acres near Sanand, Ahmedabad, to establish a technology park and high-end electronics manufacturing facility. Gujarat has offered customized incentives as the company evaluates locations, potentially strengthening the state's electronics ecosystem.
The Times of India
Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? Jim Hall and PHil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences and knowledge.
Board Talk
Technical Papers

UHDI Fabrication for IC Substrates: SAP and mSAP Processes
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Redesigning Material Logistics for High-Mix EMS Production
Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse
Digital Warehouse Automation in High-Mix PCB Assembly
Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses
MORE TECHNICAL PAPERS
Sponsor
Plasma-Etch

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
Global economy 'storm-tossed' between crises and AI opportunity
IMF chief Kristalina Georgieva said the global economy remains resilient despite energy shocks, inflation, debt and trade wars. She warned that renewed oil price increases could worsen inflation, while AI investment provides a powerful economic boost but creates risks.
Taipei Times
Apple sets iPhone launch event for Sept. 9, first under new CEO John Ternus
Apple will hold its September 9 launch event in Cupertino, teasing "Surprise and shine." Analysts expect new iPhones, Apple Watches and its first foldable phone, while Siri AI will debut. The event marks John Ternus' first as CEO.
CNBC
New Approaches to Develop a Scalable 3D IC Assembly Method
In this paper, we will discuss various assembly options and the challenges posed by each.
Technical Paper
Sponsor
Glenbrook-Technologies

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies
Bill Gates warns 'there is no plan' for the 'upheaval' AI will cause
Bill Gates warns that AI could rapidly displace workers, widen inequality and disrupt economies without adequate preparation. He urges governments to create national and international institutions to manage employment, education, safety nets and global AI risks.
CNBC
From Days to Minutes: Accelerating 3D IC Debug with Agentic AI
Agentic AI is transforming semiconductor debugging by automating failure analysis, root-cause identification, fix proposals, and verification. ChipAgents reports reducing complex root-cause cycles from days to 15–60 minutes, helping engineers tackle increasingly intricate 3D IC designs.
EE Times
Uni-Directional Growth of CU SN in Microbumps
The growth of CuSn has been proven as a preferential growth behavior on single crystal copper. However, a layer of single crystal copper is not possible.
Technical Paper
Sponsor
BEST-Inc.

Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
Why Automation Is Essential to Achieve EU CRA Compliance
The EU Cyber Resilience Act will affect far more products than many companies expect, including legacy connected hardware and software. Manufacturers must assess risks, implement security measures, manage vulnerabilities, and plan support periods for products sold in Europe.
EE Times
A New NASA Design Turbocharges Nuclear Spacecraft
NASA and General Atomics engineers propose a synchronal bimodal nuclear rocket combining high-thrust nuclear thermal propulsion with continuous electric power. The design could cut crewed Mars missions to 335 days while reducing engineering and astronaut health challenges.
IEEE Spectrum
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Accelerating Silicon Design for Physical AI
Physical AI demands heterogeneous architectures that balance real-time performance, power, security, and scalability. The eBook offers architects guidance on inference sizing, hardware-rooted trust, and monolithic versus chiplet designs while reducing integration risks.
EE Times
Failure Analysis and Assembly of Package-On-Package Module
In this paper, both failure analysis and finite element analysis (FEA) were utilized to study the thermally-induced yield loss for POP modules.
Technical Paper
Gartner Survey Finds AI Spending by Customer Service Leaders Has Surged by 38%, Despite Overall Service and Support Function Budgets Rising by Just 2%
Customer service leaders increased AI spending by 38% while overall support budgets grew just 2%, Gartner found. Organizations are shifting funds from labor to technology, expecting GenAI chatbots, voicebots and connected AI agents to deliver greater value.
Gartner
HP inks deal with U.S.-blacklisted Huawei for licensing the Chinese company's WiFi tech
HP has signed a multi-year global agreement with Huawei to license Wi-Fi patents, following a patent dispute. The deal highlights Huawei's technology reach despite U.S. restrictions, while HP stressed it does not signal a broader partnership.
CNBC
Sponsor
Viscom

iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom
China proposes new safety rules for autonomous vehicles and electric bicycles
China's proposed Road Traffic Safety Law revision would regulate autonomous vehicles, distracted driving and electric bikes. The draft makes manufacturers liable for violations during autonomous operation, raises e-bike speed limits and toughens penalties for unsafe driving.
China Daily
Today's Sponsor
kyzen
Sponsor
kyzen

How pH Cleaning Agents Affect Production Performance
Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability.
KYZEN
Test Your Knowledge
What was the first turbocharged car?
See answer below.
Industry Press
Plasmatreat Sets Course for Future Requirements
With an expanded technology portfolio, Lukas and Magnus Buske and their teams are positioning Plasmatreat to meet future demands in industrial surface treatment. ...
Plasmatreat GmbH
Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026
Koh Young Technology will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026, at the Center of Excellence Building within Binghamton ...
Koh Young Technology Inc.
PCEA Launches Designer Career Day at PCB West 2026
PCB West this year will debut Designer Career Day, a free program targeted at students, graduates, and anyone interested in careers in PCB design and design engineering, ...
Printed Circuit Engineering Association, Inc.
BTU Introduces High-Yield Reflow Technologies for Advanced Packaging at SEMICON Taiwan
BTU International, Inc. will showcase its latest high-yield reflow technologies at SEMICON Taiwan in Booth I2516, with a focus on advanced packaging and other high-density ...
BTU International, Inc.
SCHMID Group N.V. reports H1 2026 Financial Results and Updates Full-Year 2026 Guidance
SCHMID Group N.V. reports its unaudited financial results for the first half of 2026, covering the period ended June 30, 2026, and adjusts its full-year 2026 guidance. Arthur ...
SCHMID Group N.V.
Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL at SEMICON Taiwan 2026
Nordson Electronics Solutions introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level ...
Nordson Electronics Solutions
MORE INDUSTRY PRESS
EOS-ESDA-Association
Sponsor
Circuitnet

"Ask the Experts" Program by Circuitnet
Do you have a question or process issue in PCB assembly? The Circuitnet "Ask the Expert's" program has over 100 panel members waiting to answer your question. Submit question now.
Circuitnet Media LLC
Quote of the Day
"Fail often so you can succeed sooner."
Tom Kelley, Ideo partner
Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Summit-Interconnect
Cartoon of the Day
Cartoon
"Of course I can accept criticism. Who should we criticize first?"
Copyright © Randy Glasbergen
Sponsor
DL-Technology

Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology
Circuit-Technology-Center
Test Your Knowledge Answer
What was the first turbocharged car?
Answer: Oldsmobile F5