April 10, 2026

Google Expands Partnership with Intel for AI Chips Google expanded its partnership with Intel, committing to multiple generations of Xeon 6 CPUs for AI training and inference in its data centers. The move strengthens Intel's position against Nvidia as CPUs gain importance in next-generation AI workloads. CNBC

Sponsor Refurbished and Demo X-ray Inspection Systems 2024 Demo JewelBox-70T X-ray System and 2024 Demo JewelBox-100T X-ray System Refurbished & Demo Systems on sale with warranty. Learn more. Glenbrook Technologies

Intel Enters Pact With Tesla and SpaceX for Terafab Intel partners with Tesla, SpaceX, xAI and Elon Musk to build the Terafab semiconductor fab in Austin, Texas, designing and manufacturing advanced AI and robotics chips while addressing supply constraints and creating a domestic alternative to overseas foundries. EE Times

Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics Electrostatic discharge (ESD) threatens IoT and high-reliability electronics as components shrink and densify. This paper details design protections, assembly controls, and validation methods to help engineers and OEMs enhance device resilience and ensure long-term performance. Technical Paper

OpenAI looks to take on Anthropic with $100 per month ChatGPT Pro subscriptions OpenAI introduced a $100/month Pro ChatGPT tier boosting Codex limits 5x over Plus, targeting heavy users and rivaling Anthropic's Claude Code. With rapid growth and millions of users, it expands subscription options and intensifies AI coding competition. CNBC

Sponsor Start Micro Dispensing Today The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve. DL Technology

Chip Can Project Video the Size of a Grain of Sand Scientists from MIT, MITRE and partners developed a photonic chip using micro-cantilevers that project and steer millions of light spots, enabling scalable control of quantum qubits and advancing imaging, 3D scanning, augmented reality, and biomedical applications. IEEE Spectrum

Predicting Mid-Chip Solder Balling Is there a calculation that can be used to predict solder balling? We would like to design our stencil apertures to ensure no mid-chip solder balls. The Assembly Brothers, Jim Hall and Phil Zarrow, discuss design suggestions to prevent solder balling. Board Talk

Technical Papers ■ Scaling SMT Traceability ■ The Drawbacks of Internal Recycling Systems for Solder Dross ■ Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies MORE TECHNICAL PAPERS

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Samsung weighs Vietnam semiconductor testing facility Samsung is reportedly in talks with the Vietnamese government to set up an integrated circuit (IC) testing facility in Vietnam, aiming to expand its semiconductor operations and position the site as a key regional hub for chip testing and packaging. Digitimes

Artemis II crew hails 'golden age of space travel' as they prepare for return Artemis II astronauts celebrate their historic 10-day lunar flyby and praise a "golden age of space travel" as they prepare to return to Earth. NASA coordinates Orion's high-speed reentry, parachute splashdown, and recovery off California. The Guardian

Impact of PCB Manufacturing, Design, and Material to PCB Warpage This paper will use high temperature warpage metrology to evaluate the impact that PCB manufacturing, design, and material has on BGA and panel area PCB warpage. Technical Paper

Sponsor iX7059 Series by Viscom: Inline X-ray Inspection Power High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application. Viscom SE

Tech layoffs are piling up: 80,000 jobs cut in early 2026, and AI is getting the blame The global tech industry saw nearly 80,000 layoffs in early 2026, with many linked to AI, though experts argue companies may be blaming automation during restructuring, as firms like IBM expand hiring while true productivity impact of AI remains uncertain. TechSpot

IDC Defines the Next Era of Technology Intelligence with the Introduction of IDC Quanta™ at Directions 2026 IDC opened Directions 2026, unveiling IDC Quanta™, an AI-powered platform embedding trusted technology intelligence directly into workflows. The platform integrates proprietary data, context, and secure analytics, enabling faster, personalized, and actionable decision-making. IDC

Do We Need to Switch to Type 5 Solder Pastes? The experiment should find the optimum printer parameters, compare type 4 vs. 4.5 vs. 5 solder paste and 4 different stencils. Technical Paper

Sponsor Die-Module Attach (Pastes & Films) Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding. AI Technology, Inc.

Meta's long-awaited AI model is finally here. But can it make money? Meta has launched Muse Spark, its first major AI model after a costly overhaul, shifting from open-source Llama to proprietary systems. The company aims to monetize via APIs and enhanced ad targeting, competing with OpenAI, Anthropic, and Google. CNBC

Why Industrial Operations are Turning to Bluetooth® Technology Bluetooth SIG shows how Bluetooth powers smarter industrial operations by enabling real-time asset tracking, predictive maintenance, and connected sensing, turning data into actionable insights that boost efficiency, improve safety, reduce downtime, and enhance automation. EE Times

Sponsor The Drawbacks of Internal Recycling Systems for Solder Dross This paper examines the risks and hidden costs of in-house solder dross recycling, highlighting contamination, compliance, quality, safety, and economic challenges that often outweigh perceived savings. AIM Solder

China Just Allegedly Suffered The Biggest Hack In The Country's History A hacking group claims it breached China's Tianjin supercomputing center, stealing over 10 petabytes of sensitive military and research data. Experts say the leak appears credible, though unverified, and could attract intelligence agencies despite questions over its strategic value. BGR

Void Reduction in Reflow Soldering Processes by Sweep Stimulation The insights of the feasibility study were the basis for the integration of the voidless technique into an industrial production process. Technical Paper

Which Chips Actually Matter? Europe Reassesses Its Semiconductor Strategy After Nexperia Wakeup Call Europe's Nexperia fallout is reshaping chip strategy, driving policymakers to prioritize critical applications, mature-node strengths, and resilient supply chains. Leaders now target trusted niches and vital sectors over costly, unrealistic leading-edge ambitions. EE Times

Alibaba and Meta retreat from open-source AI Alibaba and Meta reshape AI strategies, signaling an industry pivot toward closed or hybrid models. Their moves mark a retreat from fully open-source approaches, as firms prioritize control, monetization, and competitive differentiation in a maturing AI market. Digitimes

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

Astronomers thought the early universe was full of hydrogen: Now they've found it The HETDEX survey discovers over 33,000 hydrogen gas halos around early galaxies, vastly expanding known samples. This breakthrough reveals such structures are common, offering unprecedented data to study galaxy formation, evolution, and the universe's rapid growth. Phys.org