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Ask the Experts
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Baking After Cleaning Hand Placed Parts
Is baking required after in-line cleaning an assembly with moisture sensitive parts that were hand placed instead of through an SMT machine?
Responses by:
Georgian Simion Engineering and Operations Management, Independent Consultant Mike Konrad President, Aqueous Technologies Paul Austen Senior Project Engineer, Electronic Controls Design Inc Terry Munson President/Senior Technical Consultant, Foresite Carlos Bouras General Manager, Nordson SELECT Mark Waterman M.O.L.E. Line Product Manager, Electronic Controls Design, Inc. (ECD) Tod Cummins Director of Corporate Quality Assurance, Delta Group Electronics Inc.
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MORE ASK THE EXPERTS
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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What Year Was It?
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Armstrong Walks on the Moon
American astronaut Neil Armstrong, 240,000 miles from Earth, speaks these words to more than a billion people listening at home: "That's one small step for man, one giant leap for mankind."
See the answer below.
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What Year Was It Answer
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Armstrong Walks on the Moon Answer: July 20, 1969
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July 20, 2026
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Hon Hai Eyes Production at Texas Site
Hon Hai will begin small-scale AI server production in Texas within two months, using Nvidia-powered humanoid robots for assembly. The company is also expanding US smart factories and overseas high-tech parks to strengthen global supply chains.
Taipei Times
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Maintenance: The Basics of Cleaning Series Part 4
This article is the fourth and final part of the series titled "The Basics of Cleaning". In this final chapter, some of the common mistakes in maintenance cleaning applications found in electronic assembly operations will be covered and a summary of the entire series.
Technical Paper
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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
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Data center projects drawing increasing pushback worldwide
Governments are competing to attract AI data centers, but public opposition is rising over land, power, water and environmental impacts. Protests, lawsuits and new regulations worldwide are forcing leaders to balance AI expansion with community concerns.
Taipei Times
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Low-Voiding High-Reliability Lead-Free Solder Paste for Automotive
A novel lead-free solder paste, Durafuse® HR (DFHR), has been developed using Durafuse® technology. This technology demonstrates the combined merits of each constituent solder powder in the paste. DFHR is based on Sn-Ag-Cu alloy system and contains bismuth (Bi), indium (In), and antimony (Sb).
Technical Paper
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PAE Certification – Oct 2-5, 2026
Advance your expertise with the ESDA Process Assessment Engineer (PAE) Certification at the 2026 EOS/ESD Symposium. Learn ANSI/ESD SP17.1 principles to assess and improve EOS/ESD processes.
EOS/ESD Association
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iNEMI Board Assembly –Press-Fit Technology Roadmap
A press-fit roadmap team including press-fit manufacture, OEM/ODM and EMS are getting together every two years to identify the future technology trend, future technical challenges and needs and then to find potential solution for next 5 to 10 years in the horizon.
Technical Paper
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Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates. Download the TDS.
Master Bond
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New Material Beats Copper's Thermal Conductivity
UCLA and Argonne researchers unveiled theta-phase tantalum nitride, a metal with 1,100 W/m-K thermal conductivity, nearly three times copper's. Its atomic structure cuts electron-phonon interactions, improving heat transfer for advanced electronics.
EE Times
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Xi calls for global cooperation on AI
At the World AI Conference, Xi Jinping urged global cooperation on AI governance and opposed control by any single nation. China promoted human-centered regulation while showcasing advanced AI models and technologies to boost AI leadership ambitions.
Taipei Times
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Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of 9%. The failure only appears in rows near the component center. What is happening?
Board Talk
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Taiwan to keep best TSMC tech despite US push
Taiwan pledged to keep TSMC's most advanced chip technology at home after the company unveiled another US$100 billion for Arizona. Officials cited new domestic fabs, infrastructure investment and steady semiconductor growth to strengthen global leadership.
Taipei Times
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J-STD-001 Solder Training Kit
BEST's IPC J-STD-001 Revision H-J training kit features circuit boards representing actual soldering conditions including multilayer boards with challenging thermal conditions.
BEST Inc
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Apple, Nvidia vie for title of world's most valuable company
Apple briefly overtook Nvidia as the world's most valuable company before Nvidia reclaimed the top spot by market close. Apple's 2026 rally, driven by AI optimism, product launches and analyst upgrades, has outpaced Nvidia as investors shift toward memory and infrastructure stocks.
CNBC
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How a quality management system identifies suspect counterfeits
Counterfeit electronic parts are spreading as AI demand and supply shortages fuel risks. ERAI reported a 25% rise in suspect parts in 2024, threatening critical industries and prompting companies to improve testing, sourcing, and prevention measures.
Sourceability
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Apple lawsuit targets OpenAI's AI hardware ambitions
Apple has sued OpenAI, alleging trade secret theft, highlighting a broader battle over AI access points. As large language models become increasingly similar, competition is shifting from model capabilities to controlling the devices and platforms through which users interact with AI.
Digitimes
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| Today's Sponsor |
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD
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Test Your Knowledge
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Arrange these computer-related inventions in chronological order: Silicon Chip, Floppy Disk, Microchip
See answer below.
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Quote of the Day
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The best way to predict the future is to invent it. Alan Kay
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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
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| Cartoon of the Day
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"I've hit the glass ceiling so many times, my hair smells like Windex."
Copyright © Randy Glasbergen
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Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
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Test Your Knowledge Answer
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Arrange these computer-related inventions in chronological order: Silicon Chip, Floppy Disk, Microchip Answer: Microchip (1958), Silicon Chip (1961), Floppy Disk (1970)
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