| Sponsor |
|
Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
|
|
|
Ask the Experts
|
Rework of Underfilled Array Packages
What is the best method for removing a SMT array package that has been underfilled and cured? Mechanically, thermally, chemically? A combination of methods? Is there ...
Responses by:
Richard D. Stadem Advanced Engineer/Scientist, General Dynamics Bob LePage Sales Engineer, Circuit Technology Center Neil O'Brien Sales Director, Finetech Neil Poole Senior Applications Chemist, Henkel Electronics Bhanu Sood Laboratory Director, CALCE, University of Maryland Dr. Brian Toleno Application Engineering, Henkel Electronics
|
|
|
|
|
MORE ASK THE EXPERTS
|
|
|
| Sponsor |
|
SMT Line Builder Tool – Fast & Easy
Skip the guesswork. Our SMT Line Builder gives you instant, expert-recommended setups based on your budget and output. Or send us your BOM—we'll handle it.
Manncorp Inc.
|
|
|
What Year Was It?
|
Gone With the Wind Published
Margaret Mitchell's Gone with the Wind, one of the best-selling novels of all time and the basis for a blockbuster 1939 movie, is published.
See the answer below.
|
|
What Year Was It Answer
|
Gone With the Wind Published Answer: June 30, 1936
|
|
June 30, 2026
|
The Lab Mistake That Might Revolutionize Computing
Researchers have discovered that ordinary CMOS transistors can function as artificial neurons and synapses, offering a scalable neuromorphic computing approach that could dramatically reduce AI’s energy consumption, lower data-center power demands, and narrow the efficiency gap with the human brain.
IEEE Spectrum
|
|
| Sponsor |
|
Eliminate Voids for High-Reliability Applications
Voids compromise reliability. Achieve near zero-voiding with our vacuum reflow for automotive, micro-bumping, and advanced electronics. Send your boards to see the results.
Heller Industries
|
|
Apple accuses India of ‘copy-pasting’ rivals’ claims in antitrust investigation
Apple urged India's antitrust watchdog to dismiss findings that it abused App Store dominance, accusing investigators of copying rivals’ claims without independent analysis. The company warned penalties could disrupt its business model, deter investment, and undermine India’s growing iPhone manufacturing ecosystem.
Taipei Times
|
|
Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Whitepaper shows formic-acid-assisted, flux-free soldering enables reliable, nearly void-free joints for power semiconductors. The technology improves thermal performance and lifespan, offering strong potential for electromobility, renewable energy, and high-frequency electronics.
Technical Paper
|
|
Europe’s Path to Defense Resilience Lies in Technological Independence
Europe can strengthen defense resilience by reducing reliance on foreign technology ecosystems and investing in sovereign semiconductors, AI, cloud infrastructure, and secure supply chains. Building domestic innovation and trusted partnerships will improve security, competitiveness, and long-term strategic autonomy.
EE Times
|
|
| Sponsor |
|
Need Improved Solder Joint Visibility?
Solder Peel-A-Way Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
|
|
A hollow-core fiber cable just carried 51.3 Tb/s across 200 km
YOFC, working with China Telecom and Dekoli, set a world record by transmitting 51.3 Tb/s over 206.5 km of hollow-core fiber without signal regeneration. The live commercial trial demonstrated lower latency, higher speeds, and advanced wavelength optimization for long-haul networks.
TechSpot
|
|
Impact of Pb-free Solder Alloy Mixing on Solder Joint Integrity Using BGAs
An investigation was conducted to assess the solder joint integrity (acceptable/nonacceptable) for three different solder alloys on ball grid arrays (BGAs) in a mixed metallurgy configuration as compared to a baseline SAC305 system. Thermal cycle testing using a -55 to +125 ºC range in accordance with the IPC-9701 specification was used.
Technical Paper
|
|
| Sponsor |
|
Automation in Transition
The world of automation is changing. What does this mean for customers? And what impact is the transformation having on providers? Find out more from a panel of experts.
SCHUNK
|
|
U.S. Eyes China’s Expanding Role in Latin America
A Gartner report says expanding U.S. scrutiny of Chinese firms in Latin America reflects a broader national security strategy targeting ownership, technology and supply chain dependencies. Companies must map entire business ecosystems as regulators intensify oversight ahead of the 2026 USMCA review.
EE Times
|
|
How to Cost a Board
My boss has asked me to provide a cost matrix so we can quickly quote labor machine time component for the SMT board assembly.
Board Talk
|
|
| Sponsor |
|
Safe and Effective Cleaning with 440-R
Not consumed during the stencil cleaning process so there is no need to monitor concentration. Simply replace with fresh solution every 4-6 weeks. Learn more.
Smart Sonic
|
|
Key facts on South Korea's three chip and AI 'mega projects'
South Korea unveiled three mega projects focused on semiconductors, physical AI and AI data centres. Samsung Electronics plans massive domestic investments through 2040, expanding semiconductor clusters, advanced HBM fabs and new facilities to strengthen the country's technology leadership and future growth.
Reuters
|
|
| Sponsor |
|
Cut SAC305 Costs with REL61TM Lead–Free Alloy
Silver prices have tripled. While silver is 2/3 of SAC305's cost, it's only 1/4 of REL61. Save hundreds of thousands annually with this proven, drop-in alternative.
AIM Solder
|
|
Korea plans to double memory output in five years
South Korea unveiled a $1.4 trillion semiconductor expansion plan, with Samsung and SK Group doubling memory chip production within five years. The initiative includes new fabs, packaging facilities and NAND plant expansions to strengthen regional development and global chip leadership.
Electronics Weekly
|
|
Jewar set to be electronics and semicon hub: Vaishnaw
Union Minister Ashwini Vaishnaw said Jewar will become a major electronics and semiconductor manufacturing hub, backed by Noida International Airport and improved connectivity. He said new investments and domestic production will strengthen Uttar Pradesh’s role in India’s growing high-tech manufacturing sector.
The New Indian Express
|
|
South Korean president to unveil massive AI and chip investment drive
South Korea will unveil three mega-projects, including a massive southwest semiconductor hub, to boost AI, chip production and regional growth. The plan could attract over 1,000 trillion won in investments, with Samsung and SK expected to lead while expanding infrastructure and workforce support.
The Standard
|
|
Will A New Google Pixel Phone Actually Last 7 Years?
Google’s seven-year Pixel support boosts long-term software updates and resale value, but aging hardware, battery degradation, and limited access to newer AI features reduce its practical lifespan. For most users, frequent upgrades mean the extended support promise offers more reassurance than real-world benefit.
BGR
|
|
| Sponsor |
|
High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
|
|
Cellular IoT connections to reach 5.9 billion by 2035
Omdia forecasts global cellular IoT connections will grow from 4.3 billion in 2026 to 5.9 billion by 2035, driven by NB-IoT, mMTC, and eRedCap. Automotive, smart infrastructure investments, and expanding 5G Standalone networks will accelerate adoption worldwide.
Telecoms
|
|
| Today's Sponsor |
|
|
Test Your Knowledge
|
What piece of technology did IBM develop in 1973 that they nicknamed Winchester?
See answer below.
|
|
Industry Press
|
YINCAE to Showcase Advanced Materials at IICIE 2026
YINCAE will showcase its latest innovations in advanced materials and packaging technologies at the International Integrated Circuit Innovation Expo (IICIE) 2026 ...
YINCAE Advanced Materials
|
Assembled Product Specialists Offers Complete Facility Solutions
Assembled Product Specialists is is highlighting its comprehensive approach to facility design, product sourcing, installation, and operational support. While many organizations know ...
Assembled Product Specialists
|
I.C.T Delivers SMT Line for Drone Manufacturing in Europe
I.C.T has successfully delivered a complete SMT production line to a customer in Europe, supporting their drone manufacturing business. In March 2026, I.C.T dispatched ...
Dongguan ICT Technology Co.,Ltd.
|
SmartController offers interfaces for controlling demanding tests
In the automotive sector, individual components—such as vehicle seats—often need to be tested or demonstrated independently of the overall configuration ...
GOEPEL Electronic
|
ITW EAE appoints Alfa SMT as Distributor for MPM & Camalot Products
ITW EAE is pleased to announce the appointment of Alfa SMT as the authorized distributor of MPM Printer and Camalot Dispenser products for the Balkan territory, ...
ITW EAE
|
Global Electronics Association Releases IPC-1401B
The Global Electronics Association has released IPC-1401B, Environmental, Social and Governance (ESG) Management System Standard, an updated industry standard ...
Global Electronics Association
|
MicroCare Appoints Doug Kay as Dir. of Market and New Business Development
MicroCare, LLC announced the appointment of Doug Kay as Director of Market and New Business Development. In this newly created role, Kay will focus on finding ...
MicroCare, LLC
|
|
MORE INDUSTRY PRESS
|
|
|
Quote of the Day
|
"Success is simply a matter of luck. Ask any failure." Earl Wilson
|
| Cartoon of the Day
|
|
"Any chance you could learn PowerPoint before you next presentation, Jim?"
Copyright © Randy Glasbergen
|
|
|
Test Your Knowledge Answer
|
What piece of technology did IBM develop in 1973 that they nicknamed Winchester? Answer: A disk drive
|
|