November 28, 2025

Amazon is building a massive $50 billion AI cloud for the US government AWS commits up to $50 billion to expand its government-only AI and high-performance computing infrastructure, adding 1.3 GW of capacity. The investment boosts classified cloud regions and equips over 11,000 federal agencies with advanced AI, HPC, and chip technologies. TechSpot

Sponsor Fast PCBs, Fully Assembled Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source. Summit Interconnect

Why Are Insurance Plans For Electric Vehicles More Expensive? EVs are cheaper to run but often cost more to insure because they have higher sticker prices, pricier specialized repairs, and fewer trained technicians. Limited long-term claims data also drives insurers to charge more to offset uncertain risk. BGR

PCB Rework Evolves, With X-ray a Constant Support Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years. Technical Paper

Nvidia says its GPUs are a ‘generation ahead’ of Google’s AI chips Nvidia defended its lead in AI infrastructure after a report on Meta considering Google’s TPUs, insisting its Blackwell chips offer superior power and flexibility. The company stressed strong demand and ongoing Google partnerships as TPU competition intensifies across the industry. CNBC

Sponsor Macurco Doubles Output with Manncorp Scaled fast. Improved speed and quality. Full control of SMT production in under a year—with no prior in-house experience. See how Manncorp helped Macurco make it happen. Manncorp Inc.

OpenAI just confirmed its first hardware prototype, built with Jony Ive OpenAI unveiled its first AI hardware prototype, showcasing a screenless, ambient-intelligence device that quietly learns context and filters digital noise. Led by Sam Altman and designed with Jony Ive, the portable gadget signals a major hardware push supported by Foxconn. TechSpot

Technical Papers ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies ■ Optimizing BGA Rework: Challenges, Techniques and Quality Control ■ Maintenance: The Basics of Cleaning Series Part 4 ■ The Economics of Electronic Component Salvage and Reuse MORE TECHNICAL PAPERS

Sponsor Tech Paper - Keys to Component Lead Tinning Success This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques. Circuit Technology Center

Apple Conducted Rare Layoffs Focused on One Specific Team Apple has carried out rare layoffs, cutting dozens of roles across its sales organization. Management informed affected employees over recent weeks, with workforce reductions varying by team. Apple has not disclosed the exact number of cuts to staff or the media. Entrepreneur

AI Agents Break Rules Under Everyday Pressure A new study introduces PropensityBench, a benchmark testing how AI agents behave under realistic pressures. Across 6,000 scenarios, models increasingly used harmful tools when stressed, revealing shallow alignment and high misbehavior rates, even after acknowledging safety rules. IEEE Spectrum

Sponsor Latest 3D AOI System from Viscom iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements. Viscom

This Self-Driving Scooter Could Transform Personal Mobility Strutt showcases its autonomous Ev1 “everyday vehicle,” a mobility device using lidar, sensors, cameras and voice control to navigate spaces independently. Demonstrated ahead of its CES 2026 debut, the Ev1 maps homes, avoids obstacles, climbs slopes and supports Apple Vision Pro control. CNET

Rockstar co-founder Dan Houser says AI is a long way from replacing real creativity in game development Dan Houser tempers industry hype around AI, arguing on Sunday Brunch that current models automate narrow tasks but can’t match human creativity. He says studios oversell AI to cut costs and impress investors, stressing that meaningful game design still relies on human judgment. TechSpot

Sponsor ISM Storage and Software Integration Solutions We are specialized in storage solutions and our warehouses ensure efficient production. Patented cases maximize space, facilitating material handling. Essegi Automation

Why rural Wisconsin is blocking the AI data center boom: ‘Horses are skittish’ Microsoft abandoned a rezoning bid in Caledonia after residents opposed a proposed data center over pollution, energy use and limited jobs, while nearby Mount Pleasant embraced a larger Microsoft project, highlighting the uneven local reactions shaping the tech industry’s AI-driven data-center expansion. CNBC

TSMC sues ex-SVP for allegedly taking secrets to Intel TSMC filed a lawsuit on November 25, 2025, accusing former senior vice president Wei-Jen Lo of breaching his employment contract, violating a non-compete agreement, and failing to uphold obligations under Taiwan’s Trade Secrets Act in the Intellectual Property and Commercial Court. Digitimes

Sponsor Need a Profiler Plan B? Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency. ECD

Nvidia stock falls 4% on report Meta will use Google AI chips Nvidia shares slid after reports that Meta may adopt Google’s TPUs in future data centers, signaling rising competition in AI chips. The potential shift boosts Google, pressures AMD and Arm, and highlights growing efforts to diversify away from Nvidia’s dominant GPUs. CNBC

iPhone Fold’s Crease-Free Design Milestone Reportedly Achieved By Apple, With The Device Now Moving To Engineering Validation And Pre-Mass Production Phases Apple reportedly solves the long-standing crease issue in foldable phones, pushing the iPhone Fold into engineering validation and pre-production. Apple, Foxconn, and component partners advance hinge and display integration, positioning the crease-free device for a 2026 debut alongside the iPhone 18 Pro lineup. Wccftech

Cloud-first safety: EB corbos Linux for Safety Applications on AWS Elektrobit launches EB corbos Linux for Safety Applications as an AWS AMI, enabling automotive teams to instantly spin up safety-ready Linux environments on ARM-based EC2 instances. The cloud deployment accelerates prototyping, CI/CD integration, and ISO 26262-aligned development without hardware bottlenecks. EE Times

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

Amazon is building a massive $50 billion AI cloud for the US government AWS plans to invest up to $50 billion to add 1.3 GW of high-performance, government-exclusive computing capacity, expanding its Top Secret, Secret, and GovCloud regions. The buildout aims to boost federal AI, HPC, and supercomputing capabilities starting in 2026. TechSpot

Why Are Insurance Plans For Electric Vehicles More Expensive? Electric vehicles remain cheaper to operate, but insurance premiums climb because EVs cost more to repair, rely on specialized parts and certified technicians, and lack long-term claim data. Complex batteries and sensor-packed systems further raise repair risks, pushing insurers to charge higher rates. BGR

Memory Safety Will Be Key to Tackle Fundamental Cyber Security The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority. EE Times