circuitnet
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Ask the Experts
Components Jumping Around During Reflow
We reflowed a set of boards using a lead-free solder process and had issues with components jumping around from their initial placed position. We then changed ...
Responses by:
Brian Smith
General Manager - Electronic Assembly Americas, DEK International
Peter Biocca
Senior Market Development Engineer, Kester
T.J. Hughes
Manufacturing Engineer, Esterline Interface Technologies
Fred Dimock
Manager, Process Technology, BTU International
Gary Freedman
President, Colab Engineering
Conformal Coating in Low Humidity Environments
Solder Paste Alloy Check
Reflow Oven - 5 Zone or 8 Zone
Tarnished OSP Circuit Boards
Concerns With Silver Finish Component Leads
Initial Screen Print Test Board
Cleaning Under Low Clearance Components
MORE ASK THE EXPERTS
AI-Technology-Inc
Sponsor
SEIKA-America

Sawa Ecobrid Fully Automatic Stencil Cleaner
This cleaner has 2 ultrasonic cleaning head panels for cleaning the front & back sides together. Ultrasonic energy is applied directly to the stencil.
Seika
Industry Calendar
Dec 4, 2025
Silicon Valley Expo & Tech Forum
SMTA
Nov 13, 2025
Tijuana Expo & Tech Forum 2025
SMTA
Nov 13, 2025
Space Coast Expo & Tech Forum
SMTA
Nov 11, 2025
Tampa Bay Expo & Tech Forum
SMTA
Nov 4, 2025
Utah Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Plasmatreat-GmbH
Sponsor
Summit-Interconnect

Rigid-Flex and Flex PCB Boards
As experts in rigid-flex and flex manufacturing, we handle rigid-flex, bookbinder, multilayer, adhesiveless & adhesive, stiffeners, laser ablation, thin flex laminates, assembly options and more.
Summit Interconnect
What Year Was It?
Pope John Paul II Dies
What Year
John Paul II, history's most well-traveled pope and the first non-Italian to hold the position since the 16th century, dies at his home in the Vatican.
See the answer below.
Sponsor
Viscom

Pioneering 3D X-ray Inspection for Flat Assemblies
Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards with its iX7059 product line. Learn more.
Viscom
Creative-Electron
What Year Was It Answer
Pope John Paul II Dies
Answer: April 2, 2005
April 2, 2025
image
No Technical Obstacles to New Giant Particle Collider in Europe: CERN
CERN confirmed no technical obstacles to building the $17B Future Circular Collider, aimed at maintaining Europe's physics leadership. While officials push for funding, critics slam the project's massive cost, environmental impact, and disruption to local communities.
Phys.org
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology
Consumer electronics see electric performance
China's consumer electronics sector is surging, fueled by government subsidies, AI innovation, and a resilient supply chain. Smartphone sales soared, foldable devices dominated globally, and companies raced to upgrade products, driving growth across upstream and midstream industries.
China Daily.com.cn
Unlocking the Potential of Nanoscale Conformal Coatings
Revolutionary Plasma Coating as Conformal Coating - discover it now! PlasmaPlus® enables ultra-thin, solvent-free functional coatings under atmospheric pressure - without post-treatment. Ideal for corrosion protection, insulation and adhesion improvement.
Technical Paper
North American EMS Industry Up 1.7% in February
IPC reported North American EMS shipments rose 1.7% year-over-year in February 2025, while bookings jumped 8.6% from January. The book-to-bill ratio hit 1.33, the strongest level since May 2024, signaling strong demand.
IPC
Sponsor
DL-Technology

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology
Intel will spin off its 'non-core' businesses, new CEO says
New Intel CEO Tan pledged to spin off non-core units, refocus on AI and Software 2.0, and revive innovation by simplifying operations, building strong teams, and revitalizing its foundry business after years of underperformance.
Quartz
Technical Papers
Unlocking the Potential of Nanoscale Conformal Coatings
Recycling vs Circularity: Minimising E-Waste in Manufacturing
Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
Probe Card Manufacturer 'Sees the Unseen' With X-ray
Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods
An Eight-Step Methodology for Bringing a Process Under Statistical Control
Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel
Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry
Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment
Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes
MORE TECHNICAL PAPERS
Sponsor
Essegi-Automation

The new Smart Rack Mobile
Optimize your workflow with Smart Rack Mobile: intelligent storage, mobility, and real-time component management. Discover more!
Essegi Automation
Trump tariffs kick off today: Electronics companies hope for a reprieve
As Trump's administration readies new tariffs, India's electronics sector eyes a waiver amid intense negotiations. Industry leaders expect any imposed tariffs to be short-lived, pending the finalization of a bilateral trade agreement with the U.S.
The Economic Times
Meta's head of AI research announces departure
Joelle Pineau, Meta's VP of AI research, announced she'll leave the company on May 30. Her exit comes as Meta races to dominate AI, with CEO Mark Zuckerberg investing heavily in AI assistants and artificial general intelligence.
CNBC
Sponsor
Uyemura

Advances in Final Finishes Push Past the Limits of Conventional Electrolytes
New article explores DIG, RAIG, EPIG, EPAG, and the competition-fueled evolution from mSAP to full semi-additive SAP. Read it here.
Uyemura
Auto Tariffs Send Ripples Across Supply Chains – Part 2
President Trump's auto tariffs threaten to raise vehicle prices by up to $10,000, slash U.S. auto sales, and spark global retaliation. Automakers face higher costs, consumers lose affordability, and global trade tensions escalate sharply across major markets.
EE Times
How Digital Archivists Are Saving Public Information from the Memory Hole
The Internet Archive and Harvard's Library Innovation Lab race to preserve vanishing U.S. government datasets, vital to science and engineering. Under Trump's second term, thousands of pages disappeared, threatening research integrity and sparking urgent digital archiving efforts.
IEEE Spectrum
Sponsor
Plasma-Etch

High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
Trump's upcoming tariffs 'will be effective immediately,' White House says
President Trump will unveil and immediately implement sweeping "reciprocal tariffs", targeting nations with duties on U.S. goods. Dubbed "liberation day," the announcement follows weeks of buildup, though details about scope and impact remain unclear.
CNBC
5 Simple Productivity Hacks You'll Wish You Knew Sooner
Effective leaders build success through daily habits like morning routines, Sunday planning, and consistent reading. These practices boost productivity, sharpen decision-making, and enhance clarity—positioning entrepreneurs to lead with focus, discipline, and long-term impact.
Entrepreneur
Sponsor
SEHO

You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH
Protecting Robots in Harsh Environments with Advanced Sealing Systems
Freudenberg Sealing Technologies tackles outdoor robotics challenges with its Ingress Protection Seals for Robots (IPSR), engineered to withstand extreme conditions. Using advanced simulations and materials like Fluoroprene XP, IPSR seals boost durability, and enhance robotic safety.
IEEE Spectrum
GM's first-quarter U.S. vehicle sales lead industry as automakers braces for tariffs
General Motors led a strong first-quarter sales surge in the U.S., jumping 16.7% year-over-year, fueled by electric vehicle and SUV demand. Hyundai, Kia, and others also posted gains, as the industry braces for looming Trump-era auto tariffs.
CNBC
Solder Joint Performance Under Shock for ENIG and ENEPIG Surface Plated Tester PCBs
This paper discusses the results of a comparative study for solder joint performance - under shock - for ENIG and ENEPIG surface plated tester PCBs. The best cost-reduction practice for Intel manufacturing is to deliver testers with high quality and reliability.
Circuit Insight - Analysis Lab
Sponsor
kyzen

Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN
The Evolution of Optical Computing: Part 1
Optical computing uses light's speed and parallelism to solve complex problems faster than traditional computers. Though early systems faced limitations, breakthroughs in spatial light modulators and neural networks laid groundwork for today's promising new generation.
EE Times
Voids in SMT Solder Joints – Trends in Automotive Electronics
There is a need for a more extensive coverage of voiding in standards where customer specifications often contain requirements for voiding in SMT solder joints.
Circuit Insight - Production Floor
Memory Safety Will Be Key to Tackle Fundamental Cyber Security
The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority.
EE Times
Today's Sponsor
Circuit-Technology-Center
Sponsor
Circuit-Technology-Center

Gold Embrittlement Solved!
We use robotic hot solder dip equipment for gold removal on SMT and through-hole components. Gold plating is fully removed and replaced with tin-lead solder.
Circuit Technology Center
Test Your Knowledge
Which scientific discovey was discoveredin the 18th century: chromosomes, microbes, enzymes, or nucleic acid
See answer below.
Industry Press
Seika Machinery to Host Tech Days in Guadalajara
Seika Machinery, Inc.
Kurtz Ersa Names Atlantech USA as 2024 Representative of the Year
Kurtz Ersa Inc.
CE3S Now Carries Millice WaferGrip™ and TrueGrip™ Adhesives
Cumberland Electronics Strategic Supply Solutions (CE3S)
Federal Electronics Welcomes Joel Robbins as Business Development Manager
Federal Electronics
MIRTEC Names Christopher Dodd Manufacturers’ Rep of the Year
MIRTEC
MORE INDUSTRY PRESS
Master-Bond
Sponsor
Glenbrook-Technologies

Counterfeit Components Identified With X-ray Inspection
Automated component sourcing and procurement platform relies on real-time X-ray inspection to remove counterfeit components from supply chain.
Glenbrook Technologies
Quote of the Day
"What you say can mean anything, but what you do means everything."
Anonymous
Sponsor
Indium-Corporation

AVOID THE VOID® with Proven Solder Paste
Looking to achieve void reduction and enhanced SIR performance? Indium8.9HF is your proven, no-clean, Pb-free, halogen-free, solder paste solution.
Indium Corporation
ECD
Cartoon of the Day
Cartoon
"Think globally, act locally, screw up invisibly."
Copyright © Randy Glasbergen
Sponsor
Nordson-ASYMTEK

ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
Ormet-TLPS
Test Your Knowledge Answer
Which scientific discovey was discoveredin the 18th century: chromosomes, microbes, enzymes, or nucleic acid
Answer: Microbes were discovered in the 18th century. Chromosomes, Enzymes and Nucleic acid were discovered in the 19th century.