circuitnet
Sponsor
DL-Technology

EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
Ask the Experts
Dross Particles Sticking to PCBs
We are wave soldering using 63/37 tin-lead solder. After wave, we are finding solder dross particles sticking the the PCB surface. We clean the dross from the solder bath ...
Responses by:
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Greg York
Technical Sales Manager, BLT Circuit Services Ltd
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
Peter Biocca
Senior Market Development Engineer, Kester
Fritz Byle
Process Engineer, Astronautics
Terry Munson
President/Senior Technical Consultant, Foresite
Gary Freedman
President, Colab Engineering
Rework or Repair?
BGA Component Grounding Problem
Aluminum Trays and Rapid Static Discharge
Use of Nitrogen for Hand Soldering
Environment Impact on Assembly, Printing and Reflow
IPC-A-610 Class 3 - IPC-A-600 Class 2
Glued SMT Components Falling Off
MORE ASK THE EXPERTS
Summit-Interconnect
Sponsor
Test-Research-Inc.

AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
Industry Calendar
Dec 4, 2025
Silicon Valley Expo & Tech Forum
SMTA
Nov 13, 2025
Tijuana Expo & Tech Forum 2025
SMTA
Nov 13, 2025
Space Coast Expo & Tech Forum
SMTA
Nov 11, 2025
Tampa Bay Expo & Tech Forum
SMTA
Nov 4, 2025
Utah Expo & Tech Forum
SMTA
FULL INDUSTRY CALENDAR
Epic-Resins
Sponsor
SEHO

SEHO@productronica: Innovations up close
Designed for demanding applications and focused on efficiency. Experience what is already possible today to make your production future-proof. Meet SEHO at productronica: A4-578!
SEHO
What Year Was It?
Capone Goes to Prison
What Year
Gangster Al Capone is sentenced to 11 years in prison for tax evasion and fined $80,000, signaling the downfall of one of the most notorious criminals of the 1920s and 1930s.
See the answer below.
Sponsor
ECD

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
kyzen
What Year Was It Answer
Capone Goes to Prison
Answer: October 17, 1931
October 17, 2025
image
Electrifying Everything Will Require Multiphysics Modeling
Engineers are using multiphysics simulations to solve electrification challenges across batteries, motors, grids, and wireless charging. COMSOL’s integrated platforms combine thermal, electromagnetic, and structural models to enable safer, optimized, and innovative energy designs.
IEEE Spectrum
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
AI Chips Shifting from Round to Rectangular
Surging AI chip demand is pushing the semiconductor industry from round wafers to rectangular panels, boosting packaging efficiency. Lam, Nikon, Amkor, and ASE are scaling up as the panel-level packaging market is forecast to jump from $160M in 2024 to $650M by 2030.
EE Times
Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing
A laser depanelling solution delivers precision, zero mechanical stress, and cleanroom-level quality—transforming PCB manufacturing for high-reliability industries like automotive, medical, and industrial electronics.
Technical Paper
Chinese Research Team Breaks Precision Record with New Analog In-Memory Computing Chip
Nanjing University researchers created a high-precision analog computing chip using geometry-based weight encoding, achieving a record 0.101% RMSE in vector–matrix multiplication. Built on CMOS, it maintained exceptional accuracy under extreme conditions.
TrendForce
Sponsor
AI-Technology-Inc

Corrosion, UV Protection for Power Transmission
Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection.
AI Technology, Inc.
Ray-Ban maker EssilorLuxottica says Meta smart glasses are boosting growth
EssilorLuxottica drove third-quarter sales up 11.7% to €6.9 billion, fueled by its Ray-Ban Meta smart glasses partnership. Wearables contributed over 4 points of growth, with Oakley and Prada versions boosting revenue, as the company bets on glasses replacing smartphone functions.
CNBC
Technical Papers
PCB Rework Evolves, With X-ray a Constant Support
How pH Cleaning Agents Affect Production Performance
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin
Understanding Solder Dross: Causes and Control Strategies
Optimizing BGA Rework: Challenges, Techniques and Quality Control
Maintenance: The Basics of Cleaning Series Part 4
The Economics of Electronic Component Salvage and Reuse
Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing
MORE TECHNICAL PAPERS
Sponsor
Creative-Electron

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
Oracle stock rises as company confirms Meta cloud deal
Oracle shares rose 3% as the company projected $20 billion in AI-driven database revenue by 2030 and confirmed a major cloud deal with Meta. Executives highlighted $65 billion in new cloud commitments, signaling strong demand across multiple customers.
CNBC
Taipei to join Japan, US response to rare earth ban
Taiwan plans to collaborate with the US and Japan in response to China's new rare earth export curbs, accelerating domestic recycling initiatives and exploring overseas high-tech parks to secure supply chains and support manufacturers amid growing geopolitical tensions.
Taipei Times
Sponsor
Circuit-Technology-Center

100+ Breakthrough Repair/Rework Guides Illustrated and Online
Free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies to IPC standards.
Circuit Technology Center
Beyond Tariffs: Should Manufacturers Reshore to the US?
Manufacturers are stalled by tariffs, often moving production from China to other low-cost regions rather than the U.S., says Rosemary Coates of the Reshoring Institute. She urges firms to plan globally, consider automation, and weigh labor and geopolitical risks before reshoring.
Design News
You Can Cool Chips With Lasers?!?!
Maxwell Labs is pioneering photonic cooling, using lasers and anti-Stokes fluorescence to convert chip heat into light, targeting hot spots with precision. This approach could eliminate dark silicon, boost performance, enable 3D stacking, and recover energy, revolutionizing computing efficiency.
IEEE Spectrum
Sponsor
Essegi-Automation

Storage Solutions – Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
Texas Instruments On Its Path to 95% In-House Manufacturing by 2030
Texas Instruments plans to grow internal semiconductor manufacturing to over 95% by 2030, investing $60 billion across U.S. fabs and global sites. The company strengthens supply resilience, embeds AI in devices, and leverages India for R&D, talent, and market growth.
EE Times
Alibaba says its AI spending in e-commerce is already breaking even
Alibaba is already seeing returns on its massive AI investment in e-commerce, VP Kaifu Zhang said, citing a 12% boost in advertising efficiency. Ahead of Singles Day, the company expects AI-driven tools to significantly lift sales and engagement.
CNBC
Sponsor
Uyemura

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
How Google's $33B Cloud and AI Expansion Is Transforming the U.S. and India
Google is investing over $33 billion to expand cloud and AI infrastructure across South Carolina, Virginia, and southern India. Beyond building data centers, the company emphasizes workforce development and AI education, upskilling locals to power the next wave of innovation.
TechReport
Soldering Challenges Caused by Warpage of Large Integrated Circuits
We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temp of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C.
Circuit Insight - Production Floor
Taiwan's Foxconn deal with ZF Group stalls
Foxconn's bid to buy ZF Group's powertrain unit collapsed after due diligence exposed heavy debt, negative equity, and weak valuation, Reuters reported. The failed deal slows Foxconn's EV push, though it continues courting Mitsubishi Motors and Fuso for partnerships.
Taiwan News
Sponsor
Manncorp

In-House Assembly? We're the Experts
The right equipment, expert installation, technical training, and full support—every step made easy. On-site or remote, we set you up for success.
Manncorp Inc.
Aluminum Trays and Rapid Static Discharge
Occasionally we transport assembled circuit boards directly on aluminum trays. Some in our plant are concerned that the aluminum surface may discharge static charges too quickly. Should we be concerned when transporting assembled circuit boards that lie directly on the surface?
Circuit Insigh - Ask the Experts
A Guide to Building Chiplets Today While Shaping Tomorrow's Standards
As chips exceed reticle limits, chiplets are emerging as the next evolution in semiconductor design. Industry groups are racing to establish universal standards—UCIe, AIB, and BoW—to enable seamless multi-die integration, though broad adoption remains years away.
EE Times
Memory Safety Will Be Key to Tackle Fundamental Cyber Security
The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority.
EE Times
Today's Sponsor
Summit-Interconnect
Sponsor
Summit-Interconnect

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Test Your Knowledge
Which vitamin does the body get from sunshine?
See answer below.
Industry Press
SHENMAO Unveils Low-Temp Solder Paste for AI Server Cooling Assembly
SHENMAO
ViTrox Presents Smart Manufacturing Solutions at NEPCON Asia
ViTrox Technologies
ASYS presents GenS at Productroica
ASYS Group
Kurtz Ersa and Comtree Bring Precision Rework to EPTECH Edmonton
Kurtz Ersa
Fuji America Brings Smarter, More Flexible Pick-&-Place Platforms to SMTAI
Fuji America Corporation
MORE INDUSTRY PRESS
Viscom
Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Quote of the Day
"Invention is the mother of necessity."
Thorstein Veblen
Sponsor
Glenbrook-Technologies

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
Nordson-ASYMTEK
Cartoon of the Day
Cartoon
"I understand the importance of green technology, but explain to me again why we need solar-powered paperclips."
Copyright © Randy Glasbergen
Sponsor
Master-Bond

Silver Filled, Heat Curing Epoxy
Master Bond EP4S-80 is a one part, electrically conductive, silver filled adhesive for bonding, sealing and coating with a low curing temperature of 80°C.
Master Bond
Plasma-Etch
Test Your Knowledge Answer
Which vitamin does the body get from sunshine?
Answer: D