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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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Ask the Experts
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Dross Particles Sticking to PCBs
We are wave soldering using 63/37 tin-lead solder. After wave, we are finding solder dross particles sticking the the PCB surface. We clean the dross from the solder bath ...
Responses by:
Richard D. Stadem Advanced Engineer/Scientist, General Dynamics Greg York Technical Sales Manager, BLT Circuit Services Ltd Leo Lambert Vice President, Technical Director, EPTAC Corporation Peter Biocca Senior Market Development Engineer, Kester Fritz Byle Process Engineer, Astronautics Terry Munson President/Senior Technical Consultant, Foresite Gary Freedman President, Colab Engineering
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MORE ASK THE EXPERTS
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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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SEHO@productronica: Innovations up close
Designed for demanding applications and focused on efficiency. Experience what is already possible today to make your production future-proof. Meet SEHO at productronica: A4-578!
SEHO
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What Year Was It?
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Capone Goes to Prison
Gangster Al Capone is sentenced to 11 years in prison for tax evasion and fined $80,000, signaling the downfall of one of the most notorious criminals of the 1920s and 1930s.
See the answer below.
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Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
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What Year Was It Answer
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Capone Goes to Prison Answer: October 17, 1931
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October 17, 2025
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Electrifying Everything Will Require Multiphysics Modeling
Engineers are using multiphysics simulations to solve electrification challenges across batteries, motors, grids, and wireless charging. COMSOL’s integrated platforms combine thermal, electromagnetic, and structural models to enable safer, optimized, and innovative energy designs.
IEEE Spectrum
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Sponsor |
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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AI Chips Shifting from Round to Rectangular
Surging AI chip demand is pushing the semiconductor industry from round wafers to rectangular panels, boosting packaging efficiency. Lam, Nikon, Amkor, and ASE are scaling up as the panel-level packaging market is forecast to jump from $160M in 2024 to $650M by 2030.
EE Times
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Sponsor |
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Oracle stock rises as company confirms Meta cloud deal
Oracle shares rose 3% as the company projected $20 billion in AI-driven database revenue by 2030 and confirmed a major cloud deal with Meta. Executives highlighted $65 billion in new cloud commitments, signaling strong demand across multiple customers.
CNBC
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Taipei to join Japan, US response to rare earth ban
Taiwan plans to collaborate with the US and Japan in response to China's new rare earth export curbs, accelerating domestic recycling initiatives and exploring overseas high-tech parks to secure supply chains and support manufacturers amid growing geopolitical tensions.
Taipei Times
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Beyond Tariffs: Should Manufacturers Reshore to the US?
Manufacturers are stalled by tariffs, often moving production from China to other low-cost regions rather than the U.S., says Rosemary Coates of the Reshoring Institute. She urges firms to plan globally, consider automation, and weigh labor and geopolitical risks before reshoring.
Design News
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You Can Cool Chips With Lasers?!?!
Maxwell Labs is pioneering photonic cooling, using lasers and anti-Stokes fluorescence to convert chip heat into light, targeting hot spots with precision. This approach could eliminate dark silicon, boost performance, enable 3D stacking, and recover energy, revolutionizing computing efficiency.
IEEE Spectrum
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Storage Solutions Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
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Texas Instruments On Its Path to 95% In-House Manufacturing by 2030
Texas Instruments plans to grow internal semiconductor manufacturing to over 95% by 2030, investing $60 billion across U.S. fabs and global sites. The company strengthens supply resilience, embeds AI in devices, and leverages India for R&D, talent, and market growth.
EE Times
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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Soldering Challenges Caused by Warpage of Large Integrated Circuits
We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temp of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C.
Circuit Insight - Production Floor
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Taiwan's Foxconn deal with ZF Group stalls
Foxconn's bid to buy ZF Group's powertrain unit collapsed after due diligence exposed heavy debt, negative equity, and weak valuation, Reuters reported. The failed deal slows Foxconn's EV push, though it continues courting Mitsubishi Motors and Fuso for partnerships.
Taiwan News
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In-House Assembly? We're the Experts
The right equipment, expert installation, technical training, and full support—every step made easy. On-site or remote, we set you up for success.
Manncorp Inc.
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Aluminum Trays and Rapid Static Discharge
Occasionally we transport assembled circuit boards directly on aluminum trays. Some in our plant are concerned that the aluminum surface may discharge static charges too quickly. Should we be concerned when transporting assembled circuit boards that lie directly on the surface?
Circuit Insigh - Ask the Experts
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Memory Safety Will Be Key to Tackle Fundamental Cyber Security
The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority.
EE Times
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Today's Sponsor |
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Sponsor |
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Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
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Test Your Knowledge
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Which vitamin does the body get from sunshine?
See answer below.
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Quote of the Day
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"Invention is the mother of necessity." Thorstein Veblen
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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Cartoon of the Day
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"I understand the importance of green technology, but explain to me again why we need solar-powered paperclips."
Copyright © Randy Glasbergen
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Sponsor |
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Silver Filled, Heat Curing Epoxy
Master Bond EP4S-80 is a one part, electrically conductive, silver filled adhesive for bonding, sealing and coating with a low curing temperature of 80°C.
Master Bond
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Test Your Knowledge Answer
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Which vitamin does the body get from sunshine? Answer: D
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