October 17, 2025

Electrifying Everything Will Require Multiphysics Modeling Engineers are using multiphysics simulations to solve electrification challenges across batteries, motors, grids, and wireless charging. COMSOL’s integrated platforms combine thermal, electromagnetic, and structural models to enable safer, optimized, and innovative energy designs. IEEE Spectrum

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS

AI Chips Shifting from Round to Rectangular Surging AI chip demand is pushing the semiconductor industry from round wafers to rectangular panels, boosting packaging efficiency. Lam, Nikon, Amkor, and ASE are scaling up as the panel-level packaging market is forecast to jump from $160M in 2024 to $650M by 2030. EE Times

Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing A laser depanelling solution delivers precision, zero mechanical stress, and cleanroom-level quality—transforming PCB manufacturing for high-reliability industries like automotive, medical, and industrial electronics. Technical Paper

Chinese Research Team Breaks Precision Record with New Analog In-Memory Computing Chip Nanjing University researchers created a high-precision analog computing chip using geometry-based weight encoding, achieving a record 0.101% RMSE in vector–matrix multiplication. Built on CMOS, it maintained exceptional accuracy under extreme conditions. TrendForce

Sponsor Corrosion, UV Protection for Power Transmission Moisture, corrosive gas, oxidation & UV blocking prop-erties. FLUOROSEAL® confor-mal coating for electrical contacts & ceramic insulator protection. AI Technology, Inc.

Ray-Ban maker EssilorLuxottica says Meta smart glasses are boosting growth EssilorLuxottica drove third-quarter sales up 11.7% to €6.9 billion, fueled by its Ray-Ban Meta smart glasses partnership. Wearables contributed over 4 points of growth, with Oakley and Prada versions boosting revenue, as the company bets on glasses replacing smartphone functions. CNBC

Technical Papers ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies ■ Optimizing BGA Rework: Challenges, Techniques and Quality Control ■ Maintenance: The Basics of Cleaning Series Part 4 ■ The Economics of Electronic Component Salvage and Reuse ■ Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing MORE TECHNICAL PAPERS

Sponsor Inline Automatic X-Ray Inspection: TruView™ Verus TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed. Creative Electron

Oracle stock rises as company confirms Meta cloud deal Oracle shares rose 3% as the company projected $20 billion in AI-driven database revenue by 2030 and confirmed a major cloud deal with Meta. Executives highlighted $65 billion in new cloud commitments, signaling strong demand across multiple customers. CNBC

Taipei to join Japan, US response to rare earth ban Taiwan plans to collaborate with the US and Japan in response to China's new rare earth export curbs, accelerating domestic recycling initiatives and exploring overseas high-tech parks to secure supply chains and support manufacturers amid growing geopolitical tensions. Taipei Times

Sponsor 100+ Breakthrough Repair/Rework Guides Illustrated and Online Free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies to IPC standards. Circuit Technology Center

Beyond Tariffs: Should Manufacturers Reshore to the US? Manufacturers are stalled by tariffs, often moving production from China to other low-cost regions rather than the U.S., says Rosemary Coates of the Reshoring Institute. She urges firms to plan globally, consider automation, and weigh labor and geopolitical risks before reshoring. Design News

You Can Cool Chips With Lasers?!?! Maxwell Labs is pioneering photonic cooling, using lasers and anti-Stokes fluorescence to convert chip heat into light, targeting hot spots with precision. This approach could eliminate dark silicon, boost performance, enable 3D stacking, and recover energy, revolutionizing computing efficiency. IEEE Spectrum

Sponsor Storage Solutions – Free Online Demo Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are. Essegi Automation

Texas Instruments On Its Path to 95% In-House Manufacturing by 2030 Texas Instruments plans to grow internal semiconductor manufacturing to over 95% by 2030, investing $60 billion across U.S. fabs and global sites. The company strengthens supply resilience, embeds AI in devices, and leverages India for R&D, talent, and market growth. EE Times

Alibaba says its AI spending in e-commerce is already breaking even Alibaba is already seeing returns on its massive AI investment in e-commerce, VP Kaifu Zhang said, citing a 12% boost in advertising efficiency. Ahead of Singles Day, the company expects AI-driven tools to significantly lift sales and engagement. CNBC

Sponsor RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Uyemura

How Google's $33B Cloud and AI Expansion Is Transforming the U.S. and India Google is investing over $33 billion to expand cloud and AI infrastructure across South Carolina, Virginia, and southern India. Beyond building data centers, the company emphasizes workforce development and AI education, upskilling locals to power the next wave of innovation. TechReport

Soldering Challenges Caused by Warpage of Large Integrated Circuits We found that BGAs exhibit minimum warpage at a reflow temperature of 200-220°C, not MAPSP 210oC the lower temp of about 180°C that tin-bismuth solders require. The best process production window can be obtained by using a solder alloy with a melting point of 200°C. Circuit Insight - Production Floor

Taiwan's Foxconn deal with ZF Group stalls Foxconn's bid to buy ZF Group's powertrain unit collapsed after due diligence exposed heavy debt, negative equity, and weak valuation, Reuters reported. The failed deal slows Foxconn's EV push, though it continues courting Mitsubishi Motors and Fuso for partnerships. Taiwan News

Sponsor In-House Assembly? We're the Experts The right equipment, expert installation, technical training, and full support—every step made easy. On-site or remote, we set you up for success. Manncorp Inc.

Aluminum Trays and Rapid Static Discharge Occasionally we transport assembled circuit boards directly on aluminum trays. Some in our plant are concerned that the aluminum surface may discharge static charges too quickly. Should we be concerned when transporting assembled circuit boards that lie directly on the surface? Circuit Insigh - Ask the Experts

A Guide to Building Chiplets Today While Shaping Tomorrow's Standards As chips exceed reticle limits, chiplets are emerging as the next evolution in semiconductor design. Industry groups are racing to establish universal standards—UCIe, AIB, and BoW—to enable seamless multi-die integration, though broad adoption remains years away. EE Times

Memory Safety Will Be Key to Tackle Fundamental Cyber Security The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority. EE Times