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Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
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Ask the Experts
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Circuit Board Bow and Twist
Board flexing has recently started to occur on one of our circuit board assemblies. This assembly has a 40 mm PoP BGA component. The BGA has an integrated heat sink. ...
Responses by:
Richard D. Stadem Advanced Engineer/Scientist, General Dynamics Stephanie Nash Director, Integrated Ideas & Technologies, Inc. Robert "Bob" Lazzara President, Circuit Connect, Inc. James DiBurro President, Round Rock Consulting Fritz Byle Process Engineer, Astronautics Paul Reid Program Coordinator, PWB Interconnect Solutions Dr. Craig D. Hillman CEO & Managing Partner, DfR Solutions Kevin Beattie Quality Manager, Sunstone Circuits
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MORE ASK THE EXPERTS
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Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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What Year Was It?
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Yosemite National Park Established
An act of Congress creates Yosemite National Park, home of such natural wonders as Half Dome and the giant sequoia trees.
See the answer below.
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Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN
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What Year Was It Answer
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Yosemite National Park Established Answer: October 1, 1890
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October 1, 2025
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Tech Giants Look to Small Nuclear to Power AI's Next Phase
Small modular reactors are gaining traction as demand for clean energy rises, attracting investment and regulatory review. Advocates highlight cost-efficient, factory-built designs, but high costs, safety concerns, and public acceptance remain key hurdles.
TechSpot
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6 Common Mistakes of BGA Rework
BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ...
Circuit Technology Center
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Quantum Brilliance Makes Devices That Keep Their Cool
Quantum Brilliance is advancing diamond-based, room-temperature quantum computers, eliminating costly cryogenics and enabling edge deployment. With projects at Oak Ridge and Germany's Cyberagentur, the startup pushes hybrid HPC-quantum integration.
EE Times
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
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Autonomous Vehicles Are Coming To Cities Faster Than You Think
At the National Parking Association conference, experts predicted autonomous vehicles will operate across most of the 25 largest U.S. cities within 24 months. Airports, ride-hail services, and corporate mobility programs are rapidly scaling, challenging cities to prepare effectively.
Forbes
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Discover consistency for your operations
Explore the reliable solutions for jet dispensing, conformal coating, plasma treatment, and selective soldering from Nordson.
Nordson Electronics Solutions
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Here's Where Electric Car Batteries Go After Their Lifespan Ends
Electric vehicle batteries don’t end their life in landfills. After years of use, they're repurposed for energy storage or recycled to recover lithium, nickel, cobalt, and copper. This process conserves resources, reduces mining, and strengthens EVs' sustainability promise.
BGR
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Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect
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AI Chip Market Surges But Challenges Lie Ahead
President Trump's push to ease AI regulations is fueling fierce competition among U.S. chipmakers as AI processor demand soars. Studies show slowing growth but massive long-term expansion, with GPUs dominant, ASICs rising, and industry consolidation expected by 2030.
Design News
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"Hearing Car" Detects Sounds for Safer Driving
Fraunhofer researchers are developing the "Hearing Car," using external mics and AI to detect sirens and other sounds. Tested in harsh conditions, the system adds acoustic awareness to cameras, lidar, and radar, enhancing vehicle safety and responsiveness.
IEEE Spectrum
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Designing CPUs for next-generation supercomputing
Despite GPU hype, CPUs remain central to high-performance computing, powering 80–90% of scientific, engineering, and financial simulations. In 2025, innovations like high-bandwidth memory are boosting CPU performance, driving a quiet but significant technological renaissance.
MIT Technology Review
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Sponsor |
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The new Smart Rack Mobile
Optimize your workflow with Smart Rack Mobile: intelligent storage, mobility, and real-time component management. Discover more!
Essegi Automation
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Have We Reached a Space-Junk Tipping Point?
Low Earth orbit faces rising hazards as space debris multiplies, forcing satellites like SpaceX's Starlinks into frequent evasive maneuvers. Experts warn accelerating Kessler syndrome could destabilize orbits, demanding urgent global and regulatory action.
IEEE Spectrum
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Why the World Needs a Flying Robot Baby
Italy's Institute of Technology's jet-powered humanoid, iRonCub3, flew stably for the first time, marking a robotics milestone. Built for disaster response, the project also advances thrust control, aerodynamic modeling, and broader robotics innovation.
IEEE Spectrum
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Performance Comparison: Liquid and Pad Thermal Interface Material
A new study tests whether liquid thermal interface materials (TIMs) outperform solid gap pads despite equal conductivity, finding liquids may lower resistance by wetting interfaces more effectively. It also highlights bondline thickness as a key resistance factor.
Circuit Insight - Analysis Lab
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Memory Safety Will Be Key to Tackle Fundamental Cyber Security
The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority.
EE Times
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Today's Sponsor |
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Sponsor |
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Test Your Knowledge
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What is the only base unit of measure still defined by an artifact?
See answer below.
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Sponsor |
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Buy SMT Dispensing Needles Online
EZ-FLO needles are machined from stainless steel with smoother internal profile for improved material flow. Chamfered needle tip is finely ground for better release. Buy online.
DL Technology
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Quote of the Day
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"I think I lost an electron." "Are you sure?" "Yes, I'm positive." Unknown
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Reliable Potting Resins, Every Time
Ensure consistent performance with our epoxy & polyurethane resins engineered for durability, fast cure times, and seamless processing. Learn More!
Epic Resins
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Cartoon of the Day
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"They cut our travel budget again. You'll have to get to the Denver conference by swivel chair."
Copyright © Randy Glasbergen
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Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom
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Test Your Knowledge Answer
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What is the only base unit of measure still defined by an artifact? Answer: The kilogram.
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