Sponsor

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Industry Calendar

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May 14, 2026
Capital Expo & Tech Forum
SMTA

May 19, 2026
Electronics in Harsh Environments Conference and Exhibition
SMTA

May 21, 2026
Ciudad Juárez Expo & Tech Forum
SMTA

Jun 23, 2026
Symposium on Counterfeit Parts & Materials - United States
SMTA

Jul 16, 2026
Queretaro Expo & Tech Forum
SMTA

Aug 18, 2026
Michigan Expo & Tech Forum
SMTA

Aug 20, 2026
Ohio Valley Expo & Tech Forum
SMTA

Oct 1, 2026
Long Island Expo & Tech Forum
SMTA

Oct 7, 2026
Guadalajara Expo & Tech Forum
SMTA

Oct 25, 2026
SMTA International Conference & Exposition
SMTA

Apr 13, 2027
Symposium on Counterfeit Parts and Materials - UK
SMTA

Aug 12, 2027
High Reliability Cleaning and Conformal Coating Conference
SMTA

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Sponsor

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.