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| Industry Press |
January 19, 2023
Circuit Technology Center At IPC-APEX Expo Booth #2936Haverhill, MA USA - Visitors to this year's IPC-APEX Expo, which will be held at the San Diego Convention Center from January 24-26th, 2023, are invited to stop by booth #2936 to learn more about the industry-leading circuit board and component rework and modification services provided by Circuit Technology Center. "We are thrilled to once again be exhibiting at the IPC-APEX show. We hope to connect with many new and long-time customers, distributors, and vendors. We will be available to answer any questions related to our circuit board rework and repair services and component tinning and BGA re-balling capabilities," said Andy Price, Sales Manager. ########## Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world. For more information, please visit: www.circuitrework.com. Phone: 978-374-5000, Fax: 978-372-5700, Web: www.circuitrework.com. Circuit Technology Center More Information April 4, 2025 Jack Doetzer, MBA, Appointed as President of Circuit Technology Inc. Circuit Technology Inc. (CTI) proudly announces that Jack Doetzer, MBA, has been appointed as President, succeeding his father, Bob Doetzer, in leading the company ... September 18, 2024 Circuit Technology Center Announces Expanded Tinning Services Capacity Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines ... November 14, 2023 Circuit Technology Center Announces New Component Trim and Form Service Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. ... October 10, 2023 New Technical Paper Unveils Key Strategies for Successful BGA Rework Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations. This new paper offers valuable ... July 14, 2023 Whitepaper Discusses Critical Process Steps for BGA Device Re-balling The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker ... June 8, 2023 CircuitMedic Unveils the Ultimate Tool Set for Electronics Techs CircuitMedic has assembled the ultimate benchtop tool set for serious electronics technicians and professionals. This curated selection of nine finely-crafted tools ... March 28, 2023 Circuit Technology Center Announces Series of CircuitMedic Circuit Frames Circuit Technology Center announces the release of a new series of CircuitMedic brand Circuit Frames. Circuit Frames contain replacement circuit patterns, lands, SMT ... March 1, 2023 White Paper: Considerations for Electronic Component Tin Whisker Mitigation The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use lead-free solder alloys containing ... January 19, 2023 Circuit Technology Center At IPC-APEX Expo Booth #2936 Visitors to this year's IPC-APEX Expo, which will be held at the San Diego Convention Center from January 24-26th, 2023, are invited to stop by booth #2936 to learn ... November 2, 2022 New White Paper Examines Key Steps to Component Lead Tinning The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold embrittlement, tin whisker mitigation, or processing ... |
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