|
|
|
|
|
|
Ask the Experts | |||||||
|
|||||||
May 13, 2014 - Updated May 13, 2014 - Originally Posted RoHS Bill of Materials CrosscheckWe are CM for multiple customers. We currently have customers that spec a sn63/37 assembly and will list RoHS compliant BGA's on their Bill of Materials. Is there any service or database that will allow us to take a BOM and determine the max temperature of the components. We usually catch most BGA's and LGA's by looking at datasheets, but recently we've noticed resistor networks and capacitors that cannot see the temperature required for the RoHS reflow profile. It is nearly impossible to pull data sheets for all the components for every build. Any suggestions would be welcome. N.M. |
|||||||
Expert Panel Responses | |||||||
J-STD-609A requires the labeling of component maximumtemperatures. Here’s an example from that standard. You should contact your BGAsupplier re: labeling perJ-STD-609A. The following is an example of 2nd Level Interconnect Component Label indicating a Pb-free e2 material with a maximum component temperature of 260C Director, EHS TTM Technologies Lee Wilmot has 20+ years doing EHS work in the PCB/PCBA industries, including environmental compliance, OSHA compliance, workers compensation, material content declarations, RoHS & REACH compliance. Active on IPC EHS committee and c-chaired committees on IPC-1331, J-STD-609A on labeling & marking, IPC-1758 on packaging and others.
|
|||||||
Submit A Comment | |||||||
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address. |
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|
|
|