This document is in the final stages of review, so it is difficult to determine at this point the reception it will receive from the industry at large.
The document was developed to replace military specifications and guidelines for packaging and preserving the quality and reliability of boards during shipment and storage. It also has added information relative to lead-free coatings and other final finishes we are seeing today.
Today's products are exposed to many elements and this document provides "...guidelines are intended to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake." "The document covers all phases from manufacture of the bare printed board, through delivery, receiving, stocking, assembly and soldering."
The draft document can is available on the IPC website for review and comments.
Leo Lambert
Vice President, Technical Director
EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
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